BRPI0817336A2 - Chapa de antena, transponder e livreto - Google Patents

Chapa de antena, transponder e livreto

Info

Publication number
BRPI0817336A2
BRPI0817336A2 BRPI0817336-2A BRPI0817336A BRPI0817336A2 BR PI0817336 A2 BRPI0817336 A2 BR PI0817336A2 BR PI0817336 A BRPI0817336 A BR PI0817336A BR PI0817336 A2 BRPI0817336 A2 BR PI0817336A2
Authority
BR
Brazil
Prior art keywords
transponder
antenna
booklet plate
booklet
plate
Prior art date
Application number
BRPI0817336-2A
Other languages
English (en)
Inventor
Junsuke Tanaka
Akihisa Yamamoto
Makoto Maehira
Yoshiyuki Mizuguchi
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Publication of BRPI0817336A2 publication Critical patent/BRPI0817336A2/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
BRPI0817336-2A 2007-09-14 2008-09-12 Chapa de antena, transponder e livreto BRPI0817336A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007239982 2007-09-14
JP2008187007 2008-07-18
PCT/JP2008/066570 WO2009035094A1 (ja) 2007-09-14 2008-09-12 アンテナシート、トランスポンダ及び冊子体

Publications (1)

Publication Number Publication Date
BRPI0817336A2 true BRPI0817336A2 (pt) 2015-03-24

Family

ID=40452100

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0817336-2A BRPI0817336A2 (pt) 2007-09-14 2008-09-12 Chapa de antena, transponder e livreto

Country Status (15)

Country Link
US (1) US8519905B2 (pt)
EP (2) EP2192530B1 (pt)
JP (1) JP5370154B2 (pt)
KR (2) KR101163300B1 (pt)
CN (1) CN101836225B (pt)
AU (1) AU2008297839B2 (pt)
BR (1) BRPI0817336A2 (pt)
CA (1) CA2699552C (pt)
ES (2) ES2563451T3 (pt)
MX (1) MX2010002872A (pt)
MY (1) MY159909A (pt)
PL (2) PL2602747T3 (pt)
RU (1) RU2471232C2 (pt)
TW (1) TWI379241B (pt)
WO (1) WO2009035094A1 (pt)

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AU2010243050B2 (en) * 2009-04-28 2014-09-11 Toppan Printing Co., Ltd. Antenna sheet, data carrier with non-contact IC, and method for manufacturing antenna sheet
DE102009023715A1 (de) * 2009-06-03 2010-12-09 Leonhard Kurz Stiftung & Co. Kg Sicherheitsdokument
WO2011024844A1 (ja) * 2009-08-26 2011-03-03 凸版印刷株式会社 非接触通信媒体
JP5428761B2 (ja) * 2009-10-30 2014-02-26 凸版印刷株式会社 アンテナシート、トランスポンダ及び冊子体
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JP2012073725A (ja) * 2010-09-28 2012-04-12 Toppan Printing Co Ltd 非接触通信媒体、冊子及びその製造方法
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JP5834585B2 (ja) * 2011-07-25 2015-12-24 凸版印刷株式会社 非接触通信媒体及びその製造方法
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KR102931665B1 (ko) 2017-10-18 2026-02-26 컴포시큐어 엘.엘.씨. 윈도우 또는 윈도우 패턴 및 선택적인 백라이팅을 갖는 금속, 세라믹, 또는 세라믹 코팅된 트랜잭션 카드
KR102129590B1 (ko) * 2019-06-13 2020-07-02 신혜중 하이브리드형 무선충전용 수신안테나 장치 및 그 제조방법
JP7426693B2 (ja) * 2019-12-13 2024-02-02 日本パッケージ・システム株式会社 Ｒｆｉｄインレイ
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Also Published As

Publication number Publication date
KR101237107B1 (ko) 2013-02-25
KR101163300B1 (ko) 2012-07-05
PL2602747T3 (pl) 2016-06-30
AU2008297839A1 (en) 2009-03-19
EP2192530A1 (en) 2010-06-02
EP2602747A3 (en) 2014-07-30
PL2192530T3 (pl) 2013-08-30
EP2602747A2 (en) 2013-06-12
WO2009035094A1 (ja) 2009-03-19
EP2602747B1 (en) 2016-01-13
US8519905B2 (en) 2013-08-27
RU2010109058A (ru) 2011-09-20
CN101836225B (zh) 2013-10-09
KR20100047320A (ko) 2010-05-07
KR20120029484A (ko) 2012-03-26
TW200937302A (en) 2009-09-01
CA2699552C (en) 2013-05-28
CN101836225A (zh) 2010-09-15
AU2008297839B2 (en) 2011-10-27
MX2010002872A (es) 2010-04-09
JP5370154B2 (ja) 2013-12-18
EP2192530A4 (en) 2010-10-27
EP2192530B1 (en) 2013-03-27
CA2699552A1 (en) 2009-03-19
ES2415364T3 (es) 2013-07-25
RU2471232C2 (ru) 2012-12-27
US20100277382A1 (en) 2010-11-04
MY159909A (en) 2017-02-15
ES2563451T3 (es) 2016-03-15
TWI379241B (en) 2012-12-11
JPWO2009035094A1 (ja) 2010-12-24

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Legal Events

Date Code Title Description
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B11E Dismissal acc. art. 34 of ipl - requirements for examination incomplete
B11T Dismissal of application maintained [chapter 11.20 patent gazette]