BRPI0820988A2 - Banho galvânico, processo para a separação galvãnica e emprego de um diafragma bipolar para a separação em um banho galvânico - Google Patents
Banho galvânico, processo para a separação galvãnica e emprego de um diafragma bipolar para a separação em um banho galvânicoInfo
- Publication number
- BRPI0820988A2 BRPI0820988A2 BRPI0820988-0A BRPI0820988A BRPI0820988A2 BR PI0820988 A2 BRPI0820988 A2 BR PI0820988A2 BR PI0820988 A BRPI0820988 A BR PI0820988A BR PI0820988 A2 BRPI0820988 A2 BR PI0820988A2
- Authority
- BR
- Brazil
- Prior art keywords
- galvanic
- separation
- bath
- galvanic bath
- bipolar diaphragm
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Cosmetics (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007060200.8 | 2007-12-14 | ||
| DE102007060200A DE102007060200A1 (de) | 2007-12-14 | 2007-12-14 | Galvanisches Bad, Verfahren zur galvanischen Abscheidung und Verwendung einer bipolaren Membran zur Separation in einem galvanischen Bad |
| PCT/EP2008/010635 WO2009077146A2 (de) | 2007-12-14 | 2008-12-15 | Galvanisches bad, verfahren zur galvanischen abscheidung und verwendung einer bipolaren membran zur separation in einem galvanischen bad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BRPI0820988A2 true BRPI0820988A2 (pt) | 2015-08-04 |
| BRPI0820988B1 BRPI0820988B1 (pt) | 2018-12-04 |
Family
ID=40394014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0820988-0A BRPI0820988B1 (pt) | 2007-12-14 | 2008-12-15 | banho galvânico, processo para a separação galvânica e emprego de um diafragma bipolar para a separação em um banho galvânico e emprego de um diafragma bipolar para evitar a decomposição anódica |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP2235236B1 (pt) |
| BR (1) | BRPI0820988B1 (pt) |
| DE (1) | DE102007060200A1 (pt) |
| ES (1) | ES2396801T3 (pt) |
| PL (1) | PL2235236T3 (pt) |
| WO (1) | WO2009077146A2 (pt) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2489763A1 (en) * | 2011-02-15 | 2012-08-22 | Atotech Deutschland GmbH | Zinc-iron alloy layer material |
| JP5805055B2 (ja) * | 2012-11-24 | 2015-11-04 | 丸仲工業株式会社 | 水平搬送式電解メッキ装置 |
| JP5995906B2 (ja) | 2014-05-19 | 2016-09-21 | 株式会社豊田中央研究所 | 隔膜の製造方法、及び金属被膜の製造方法 |
| RU2610183C1 (ru) * | 2015-07-22 | 2017-02-08 | Дипсол Кемикалз Ко., Лтд. | Способ гальваностегии цинковым сплавом |
| WO2016075964A1 (ja) | 2015-07-22 | 2016-05-19 | ディップソール株式会社 | 亜鉛合金めっき方法 |
| CN106987879A (zh) * | 2016-11-23 | 2017-07-28 | 瑞尔太阳能投资有限公司 | 电沉积装置及其电沉积方法 |
| EP3696299A1 (en) | 2019-02-15 | 2020-08-19 | Coventya GmbH | Method for producing a corrosion-resistant aluminum-silicon alloy casting, corresponding corrosion-resistant aluminum-silicon alloy casting and its use |
| CN111663167A (zh) * | 2020-06-16 | 2020-09-15 | 合肥工业大学 | 一种基于bpe技术的金属线制备方法 |
| CN113025829B (zh) * | 2021-04-26 | 2022-12-06 | 福建师范大学 | 一种应用双极膜电渗析处理铜矿石冶炼废渣的方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4122543A1 (de) * | 1991-03-18 | 1992-10-08 | Hans Josef May | Verfahren zur elektrochemischen beschichtung von metallbaendern |
| DE29615084U1 (de) * | 1996-08-29 | 1996-10-24 | Ko, Chien-Hsin, Taipeh/T`ai-pei | Vorrichtung zum kontinuierlichen Galvanisieren von Platten |
| DE19834353C2 (de) | 1998-07-30 | 2000-08-17 | Hillebrand Walter Gmbh & Co Kg | Alkalisches Zink-Nickelbad |
| US6827832B2 (en) * | 1999-12-22 | 2004-12-07 | National Research Council Of Canada | Electrochemical cell and process for reducing the amount of organic contaminants in metal plating baths |
| ES2250166T5 (es) | 2000-06-15 | 2016-05-20 | Coventya Inc | Electrochapado de zinc-níquel |
| US6528185B2 (en) * | 2001-02-28 | 2003-03-04 | Hong Kong Polytechnic University | Cobalt-tungsten-phosphorus alloy diffusion barrier coatings, methods for their preparation, and their use in plated articles |
| GB2383337A (en) * | 2001-12-21 | 2003-06-25 | Accentus Plc | Electroplating plant and method |
| DE10225203A1 (de) | 2002-06-06 | 2003-12-18 | Goema Ag | Verfahren und Vorrichtung zur Spülwasserrückführung und Reinigung eines Prozessbades |
| US7442286B2 (en) * | 2004-02-26 | 2008-10-28 | Atotech Deutschland Gmbh | Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys |
| US20050274620A1 (en) * | 2004-06-15 | 2005-12-15 | Kovarsky Nicolay Y | Copper replenishment system for interconnect applications |
| WO2006004662A1 (en) * | 2004-06-25 | 2006-01-12 | Ge Ionics, Inc. | Bipolar membrane and method of making same |
-
2007
- 2007-12-14 DE DE102007060200A patent/DE102007060200A1/de not_active Ceased
-
2008
- 2008-12-15 ES ES08861431T patent/ES2396801T3/es active Active
- 2008-12-15 BR BRPI0820988-0A patent/BRPI0820988B1/pt not_active IP Right Cessation
- 2008-12-15 WO PCT/EP2008/010635 patent/WO2009077146A2/de not_active Ceased
- 2008-12-15 PL PL08861431T patent/PL2235236T3/pl unknown
- 2008-12-15 EP EP08861431A patent/EP2235236B1/de active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009077146A3 (de) | 2010-01-14 |
| WO2009077146A2 (de) | 2009-06-25 |
| PL2235236T3 (pl) | 2013-03-29 |
| EP2235236A2 (de) | 2010-10-06 |
| BRPI0820988B1 (pt) | 2018-12-04 |
| DE102007060200A1 (de) | 2009-06-18 |
| ES2396801T3 (es) | 2013-02-27 |
| EP2235236B1 (de) | 2012-10-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
| B06T | Formal requirements before examination [chapter 6.20 patent gazette] | ||
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 15/12/2008, OBSERVADAS AS CONDICOES LEGAIS. |
|
| B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 17A ANUIDADE. |
|
| B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2859 DE 21-10-2025 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |