BRPI0820988B1 - banho galvânico, processo para a separação galvânica e emprego de um diafragma bipolar para a separação em um banho galvânico e emprego de um diafragma bipolar para evitar a decomposição anódica - Google Patents

banho galvânico, processo para a separação galvânica e emprego de um diafragma bipolar para a separação em um banho galvânico e emprego de um diafragma bipolar para evitar a decomposição anódica Download PDF

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Publication number
BRPI0820988B1
BRPI0820988B1 BRPI0820988-0A BRPI0820988A BRPI0820988B1 BR PI0820988 B1 BRPI0820988 B1 BR PI0820988B1 BR PI0820988 A BRPI0820988 A BR PI0820988A BR PI0820988 B1 BRPI0820988 B1 BR PI0820988B1
Authority
BR
Brazil
Prior art keywords
diaphragm
galvanic bath
galvanic
fact
bipolar
Prior art date
Application number
BRPI0820988-0A
Other languages
English (en)
Portuguese (pt)
Inventor
Hartmut Trenkner
Alexander Jimenez
Original Assignee
Coventya Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coventya Gmbh filed Critical Coventya Gmbh
Publication of BRPI0820988A2 publication Critical patent/BRPI0820988A2/pt
Publication of BRPI0820988B1 publication Critical patent/BRPI0820988B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/22—Electroplating: Baths therefor from solutions of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Cosmetics (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
BRPI0820988-0A 2007-12-14 2008-12-15 banho galvânico, processo para a separação galvânica e emprego de um diafragma bipolar para a separação em um banho galvânico e emprego de um diafragma bipolar para evitar a decomposição anódica BRPI0820988B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007060200A DE102007060200A1 (de) 2007-12-14 2007-12-14 Galvanisches Bad, Verfahren zur galvanischen Abscheidung und Verwendung einer bipolaren Membran zur Separation in einem galvanischen Bad
DE102007060200.8 2007-12-14
PCT/EP2008/010635 WO2009077146A2 (de) 2007-12-14 2008-12-15 Galvanisches bad, verfahren zur galvanischen abscheidung und verwendung einer bipolaren membran zur separation in einem galvanischen bad

Publications (2)

Publication Number Publication Date
BRPI0820988A2 BRPI0820988A2 (pt) 2015-08-04
BRPI0820988B1 true BRPI0820988B1 (pt) 2018-12-04

Family

ID=40394014

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0820988-0A BRPI0820988B1 (pt) 2007-12-14 2008-12-15 banho galvânico, processo para a separação galvânica e emprego de um diafragma bipolar para a separação em um banho galvânico e emprego de um diafragma bipolar para evitar a decomposição anódica

Country Status (6)

Country Link
EP (1) EP2235236B1 (de)
BR (1) BRPI0820988B1 (de)
DE (1) DE102007060200A1 (de)
ES (1) ES2396801T3 (de)
PL (1) PL2235236T3 (de)
WO (1) WO2009077146A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2489763A1 (de) * 2011-02-15 2012-08-22 Atotech Deutschland GmbH Zink-Eisen-Legierungsschichtmaterial
JP5805055B2 (ja) * 2012-11-24 2015-11-04 丸仲工業株式会社 水平搬送式電解メッキ装置
JP5995906B2 (ja) 2014-05-19 2016-09-21 株式会社豊田中央研究所 隔膜の製造方法、及び金属被膜の製造方法
US10156020B2 (en) 2015-07-22 2018-12-18 Dipsol Chemicals Co., Ltd. Zinc alloy plating method
KR101622528B1 (ko) * 2015-07-22 2016-05-18 딥솔 가부시키가이샤 아연 합금 도금 방법
CN106987879A (zh) * 2016-11-23 2017-07-28 瑞尔太阳能投资有限公司 电沉积装置及其电沉积方法
EP3696299A1 (de) 2019-02-15 2020-08-19 Coventya GmbH Verfahren zur herstellung eines korrosionsbeständigen aluminium-silicium-legierungs-gusses, korrosionsbeständiger aluminium-silicium-legierungs-guss und dessen verwendung
CN111663167A (zh) * 2020-06-16 2020-09-15 合肥工业大学 一种基于bpe技术的金属线制备方法
CN113025829B (zh) * 2021-04-26 2022-12-06 福建师范大学 一种应用双极膜电渗析处理铜矿石冶炼废渣的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4122543A1 (de) * 1991-03-18 1992-10-08 Hans Josef May Verfahren zur elektrochemischen beschichtung von metallbaendern
DE29615084U1 (de) * 1996-08-29 1996-10-24 Ko, Chien-Hsin, Taipeh/T`ai-pei Vorrichtung zum kontinuierlichen Galvanisieren von Platten
DE19834353C2 (de) 1998-07-30 2000-08-17 Hillebrand Walter Gmbh & Co Kg Alkalisches Zink-Nickelbad
US6827832B2 (en) * 1999-12-22 2004-12-07 National Research Council Of Canada Electrochemical cell and process for reducing the amount of organic contaminants in metal plating baths
EP1292724B2 (de) 2000-06-15 2015-12-23 Coventya, Inc. Zink-nickel-elektroplattierung
US6528185B2 (en) * 2001-02-28 2003-03-04 Hong Kong Polytechnic University Cobalt-tungsten-phosphorus alloy diffusion barrier coatings, methods for their preparation, and their use in plated articles
GB2383337A (en) * 2001-12-21 2003-06-25 Accentus Plc Electroplating plant and method
DE10225203A1 (de) 2002-06-06 2003-12-18 Goema Ag Verfahren und Vorrichtung zur Spülwasserrückführung und Reinigung eines Prozessbades
US7442286B2 (en) * 2004-02-26 2008-10-28 Atotech Deutschland Gmbh Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys
US20050274620A1 (en) * 2004-06-15 2005-12-15 Kovarsky Nicolay Y Copper replenishment system for interconnect applications
WO2006004662A1 (en) * 2004-06-25 2006-01-12 Ge Ionics, Inc. Bipolar membrane and method of making same

Also Published As

Publication number Publication date
WO2009077146A2 (de) 2009-06-25
ES2396801T3 (es) 2013-02-27
WO2009077146A3 (de) 2010-01-14
PL2235236T3 (pl) 2013-03-29
BRPI0820988A2 (pt) 2015-08-04
DE102007060200A1 (de) 2009-06-18
EP2235236B1 (de) 2012-10-03
EP2235236A2 (de) 2010-10-06

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 15/12/2008, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 17A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2859 DE 21-10-2025 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.