BRPI0821518A2 - Estrutura de vedação híbrida com condutor de passagem hermético - Google Patents

Estrutura de vedação híbrida com condutor de passagem hermético

Info

Publication number
BRPI0821518A2
BRPI0821518A2 BRPI0821518-9A BRPI0821518A BRPI0821518A2 BR PI0821518 A2 BRPI0821518 A2 BR PI0821518A2 BR PI0821518 A BRPI0821518 A BR PI0821518A BR PI0821518 A2 BRPI0821518 A2 BR PI0821518A2
Authority
BR
Brazil
Prior art keywords
sealing structure
hybrid sealing
airtight conduit
airtight
conduit
Prior art date
Application number
BRPI0821518-9A
Other languages
English (en)
Inventor
Gabe Lakner
Jian Sun
Prasad S Khadkikar
Original Assignee
Emerson Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emerson Electric Co filed Critical Emerson Electric Co
Publication of BRPI0821518A2 publication Critical patent/BRPI0821518A2/pt
Publication of BRPI0821518B1 publication Critical patent/BRPI0821518B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/521—Sealing between contact members and housing, e.g. sealing insert
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
    • G11B33/121—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a single recording/reproducing device
    • G11B33/123—Mounting arrangements of constructional parts onto a chassis
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/22—Installations of cables or lines through walls, floors or ceilings, e.g. into buildings
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • A61N1/3752—Details of casing-lead connections
    • A61N1/3754—Feedthroughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5216—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Gasket Seals (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Joining Of Glass To Other Materials (AREA)
BRPI0821518-9A 2007-12-28 2008-12-24 Condutor de passagem hermético BRPI0821518B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US1735207P 2007-12-28 2007-12-28
US61/017,352 2007-12-28
PCT/US2008/088267 WO2009086435A2 (en) 2007-12-28 2008-12-24 Hermetic feed-through with hybrid seal structure

Publications (2)

Publication Number Publication Date
BRPI0821518A2 true BRPI0821518A2 (pt) 2015-07-21
BRPI0821518B1 BRPI0821518B1 (pt) 2019-08-06

Family

ID=40825084

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0821518-9A BRPI0821518B1 (pt) 2007-12-28 2008-12-24 Condutor de passagem hermético

Country Status (6)

Country Link
US (1) US8378239B2 (pt)
EP (2) EP2232646B1 (pt)
JP (2) JP5307156B2 (pt)
CN (1) CN201845943U (pt)
BR (1) BRPI0821518B1 (pt)
WO (1) WO2009086435A2 (pt)

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US20110094768A1 (en) * 2009-10-28 2011-04-28 Pacesetter, Inc. Implantable medical device having feedthru with an integrated interconnect/filter substrate
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DE102011009858B8 (de) 2011-01-31 2013-11-07 Heraeus Precious Metals Gmbh & Co. Kg Cermethaltige Durchführung für eine medizinisch inplantierbare Vorrichtung mit Verbindungsschicht
DE102011009867B4 (de) 2011-01-31 2013-09-05 Heraeus Precious Metals Gmbh & Co. Kg Keramikdurchführung für eine medizinisch implantierbare Vorrichtung
DE102011009855B8 (de) 2011-01-31 2013-01-03 Heraeus Precious Metals Gmbh & Co. Kg Keramikdurchführung mit induktivem Filter
DE102011009859B4 (de) 2011-01-31 2012-09-20 Heraeus Precious Metals Gmbh & Co. Kg Keramikdurchführung mit Filter
US8841558B2 (en) * 2011-08-02 2014-09-23 Medtronic Inc. Hermetic feedthrough
US20130058004A1 (en) * 2011-09-01 2013-03-07 Medtronic, Inc. Feedthrough assembly including underfill access channel and electrically insulating material
DE102011119125B4 (de) 2011-11-23 2014-01-23 Heraeus Precious Metals Gmbh & Co. Kg Kontaktierungsanordnung mit Durchführung und Filterstruktur
CN103296495A (zh) * 2012-02-23 2013-09-11 艾默生电气公司 密封的电源馈通端子板组件
DE102012005637B4 (de) 2012-03-22 2019-02-21 Krohne Messtechnik Gmbh Messgerät
KR101853100B1 (ko) * 2012-12-12 2018-04-27 마이크로 모우션, 인코포레이티드 피드-스루
US9478959B2 (en) * 2013-03-14 2016-10-25 Heraeus Deutschland GmbH & Co. KG Laser welding a feedthrough
KR101418683B1 (ko) * 2013-06-11 2014-07-14 현대오트론 주식회사 방수형 하우징 실링을 이용한 차량의 전자 제어 장치 및 그 제조 방법
JP2015022922A (ja) * 2013-07-19 2015-02-02 矢崎総業株式会社 防液コネクタ
JP6239999B2 (ja) * 2014-02-25 2017-11-29 京セラ株式会社 電子部品収納用パッケージおよび電子装置
AU360052S (en) * 2014-05-07 2015-01-21 Mct Brattberg Ab A cable wire or pipe sealing device
FR3021490B1 (fr) * 2014-05-23 2017-08-11 Radiall Sa Ensemble comprenant un composant hyperfrequence et un circuit imprime
DE102014211593A1 (de) * 2014-06-17 2015-12-17 Conti Temic Microelectronic Gmbh Bauteil mit zumindest einer Öffnung
JP6383213B2 (ja) * 2014-08-05 2018-08-29 ショット日本株式会社 弾性緩衝機能を有する気密端子
CN105375129B (zh) * 2014-08-27 2018-09-07 珠海格力节能环保制冷技术研究中心有限公司 一种玻封接线柱
CN104209643A (zh) * 2014-08-29 2014-12-17 王建辉 集成一体的电火花堆焊修复机接线柱
EP3069757A1 (de) 2015-03-20 2016-09-21 BIOTRONIK SE & Co. KG Durchführung eines implantierbaren medizinelektronischen gerätes und implantierbares medizinelektronisches gerät
US20160271402A1 (en) 2015-03-20 2016-09-22 Biotronik Se & Co. Kg Implantable Electromedical Device
US9608363B2 (en) 2015-07-24 2017-03-28 Magna Powertrain, Inc. Sealing insert for electrical connectors
US9721620B2 (en) 2015-12-09 2017-08-01 Western Digital Technologies, Inc. Hermetic sealing of hard disk drive using laminated film seal
US9721619B2 (en) 2015-12-09 2017-08-01 Western Digital Technologies, Inc. Hermetic sealing of hard disk drive using laminated film seal
US9704539B2 (en) * 2015-12-09 2017-07-11 Western Digital Technologies, Inc. Hermetic sealing of hard disk drive using laminated film seal
JP2018005960A (ja) * 2016-07-01 2018-01-11 エヌイーシー ショット コンポーネンツ株式会社 接触子を有する気密端子
EP3421083A1 (de) * 2017-06-30 2019-01-02 BIOTRONIK SE & Co. KG Durchführung eines medizinelektronischen gerätes und medizinelektronisches gerät
US11058883B2 (en) 2019-02-15 2021-07-13 Medtronic, Inc. Feedthrough assembly
JP2022547845A (ja) * 2019-09-17 2022-11-16 アーデント コンセプツ，アイエヌシー． 密閉封止され、制御されたインピーダンスのフィードスルーアセンブリ
EP4230258B1 (en) 2020-02-21 2025-06-04 Heraeus Medical Components, LLC Ferrule with strain relief spacer for implantable medical device
EP4226968B1 (en) 2020-02-21 2025-04-30 Heraeus Medical Components, LLC Ferrule for non-planar medical device housing
US11804680B2 (en) 2020-09-30 2023-10-31 Corning Optical Communications Rf Llc RF connectors with dispensable and formable insulative materials and related methods
TWI751732B (zh) * 2020-10-07 2022-01-01 和碩聯合科技股份有限公司 連接器及其製造方法
US12567707B2 (en) 2021-11-22 2026-03-03 Corning Optical Communications Rf Llc Devices, assemblies, and methods for terminating coaxial radiofrequency ports
CN114744438B (zh) * 2022-05-11 2023-10-10 中国电子科技集团公司第二十九研究所 一种面向气密矩形连接器的一体化梯度材料盒体封装结构
CN117529856A (zh) * 2022-05-26 2024-02-06 株式会社Lg新能源 用于电池组的高耐热连接器及其制造方法
US12456562B2 (en) * 2024-01-31 2025-10-28 Integrated Microwave Corporation Ceramic RF feedthrough component

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US4493378A (en) * 1981-07-16 1985-01-15 Kyle James C Terminal assembly
US4514590A (en) * 1982-10-08 1985-04-30 Kyle James C Electrical terminal assembly
JPH0334069Y2 (pt) * 1984-12-04 1991-07-18
US4833049A (en) * 1986-09-19 1989-05-23 Emerson Electric Co. Terminal assembly having two sealing layers
JPH0222563U (pt) * 1988-07-28 1990-02-15
US4913673A (en) * 1988-07-29 1990-04-03 Amp Incorporated Hermetically sealed connector
US4940858A (en) * 1989-08-18 1990-07-10 Medtronic, Inc. Implantable pulse generator feedthrough
US5026302A (en) * 1990-06-08 1991-06-25 W. L. Gore & Associates, Inc. Connector
US5535512A (en) * 1994-10-12 1996-07-16 Armogan; Lloyd Method of making a hermetically sealed electrical connector
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US5871513A (en) * 1997-04-30 1999-02-16 Medtronic Inc. Centerless ground feedthrough pin for an electrical power source in an implantable medical device
US6107566A (en) * 1998-11-07 2000-08-22 Emerson Electric Co. Hermetic terminal structure
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US6903268B2 (en) * 2003-10-29 2005-06-07 Medtronic, Inc. Implantable device feedthrough assembly
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Also Published As

Publication number Publication date
JP2011511397A (ja) 2011-04-07
EP2624371B1 (en) 2015-09-02
EP2624371A3 (en) 2013-11-13
CN201845943U (zh) 2011-05-25
JP5307156B2 (ja) 2013-10-02
EP2232646A4 (en) 2011-05-04
JP2013191567A (ja) 2013-09-26
EP2232646B1 (en) 2014-05-21
WO2009086435A3 (en) 2009-08-27
WO2009086435A2 (en) 2009-07-09
US20110108320A1 (en) 2011-05-12
EP2624371A2 (en) 2013-08-07
BRPI0821518B1 (pt) 2019-08-06
EP2232646A2 (en) 2010-09-29
US8378239B2 (en) 2013-02-19
JP5710682B2 (ja) 2015-04-30

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 06/08/2019, OBSERVADAS AS CONDICOES LEGAIS. (CO) 10 (DEZ) ANOS CONTADOS A PARTIR DE 06/08/2019, OBSERVADAS AS CONDICOES LEGAIS

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 17A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2860 DE 28-10-2025 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.