BRPI0912899A2 - equipamento e método para deposição física de vapor - Google Patents

equipamento e método para deposição física de vapor

Info

Publication number
BRPI0912899A2
BRPI0912899A2 BRPI0912899A BRPI0912899A BRPI0912899A2 BR PI0912899 A2 BRPI0912899 A2 BR PI0912899A2 BR PI0912899 A BRPI0912899 A BR PI0912899A BR PI0912899 A BRPI0912899 A BR PI0912899A BR PI0912899 A2 BRPI0912899 A2 BR PI0912899A2
Authority
BR
Brazil
Prior art keywords
equipment
vapor deposition
physical vapor
physical
deposition
Prior art date
Application number
BRPI0912899A
Other languages
English (en)
Inventor
Inspektor Aharon
John J Prizzi
Original Assignee
Kennametal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kennametal Inc filed Critical Kennametal Inc
Publication of BRPI0912899A2 publication Critical patent/BRPI0912899A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
BRPI0912899A 2008-08-20 2009-07-27 equipamento e método para deposição física de vapor BRPI0912899A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/194,866 US20100047594A1 (en) 2008-08-20 2008-08-20 Equipment and method for physical vapor deposition
PCT/US2009/051806 WO2010021811A2 (en) 2008-08-20 2009-07-27 Equipment and method for physical vapor deposition

Publications (1)

Publication Number Publication Date
BRPI0912899A2 true BRPI0912899A2 (pt) 2015-10-06

Family

ID=41696656

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0912899A BRPI0912899A2 (pt) 2008-08-20 2009-07-27 equipamento e método para deposição física de vapor

Country Status (9)

Country Link
US (1) US20100047594A1 (pt)
EP (1) EP2326741A4 (pt)
JP (1) JP2012500339A (pt)
KR (1) KR20110042190A (pt)
CN (1) CN102124135A (pt)
BR (1) BRPI0912899A2 (pt)
CA (1) CA2731408A1 (pt)
IL (1) IL211287A0 (pt)
WO (1) WO2010021811A2 (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR102016007169B1 (pt) * 2016-03-31 2023-01-10 Mahle International Gmbh Anel de pistão para motores de combustão interna, processo para obtenção de anel de pistão e motor de combustão interna
JP7511419B2 (ja) * 2020-09-09 2024-07-05 東京エレクトロン株式会社 成膜方法、成膜装置及びプログラム

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4851095A (en) * 1988-02-08 1989-07-25 Optical Coating Laboratory, Inc. Magnetron sputtering apparatus and process
US5618388A (en) * 1988-02-08 1997-04-08 Optical Coating Laboratory, Inc. Geometries and configurations for magnetron sputtering apparatus
US5069770A (en) * 1990-07-23 1991-12-03 Eastman Kodak Company Sputtering process employing an enclosed sputtering target
US5637199A (en) * 1992-06-26 1997-06-10 Minnesota Mining And Manufacturing Company Sputtering shields and method of manufacture
JPH07216545A (ja) * 1994-02-04 1995-08-15 Nkk Corp 連続真空蒸着膜の形成方法
WO1995030506A1 (en) * 1994-05-06 1995-11-16 Wardell Lon J End mill having high and low helical flutes
JPH0853763A (ja) * 1994-06-06 1996-02-27 Matsushita Electric Ind Co Ltd 薄膜の製造方法
US5879823A (en) * 1995-12-12 1999-03-09 Kennametal Inc. Coated cutting tool
US5716505A (en) * 1996-02-23 1998-02-10 Balzers Prozess-Systems Gmbh Apparatus for coating substrates by cathode sputtering with a hollow target
US6827824B1 (en) * 1996-04-12 2004-12-07 Micron Technology, Inc. Enhanced collimated deposition
US5824197A (en) * 1996-06-05 1998-10-20 Applied Materials, Inc. Shield for a physical vapor deposition chamber
US5914018A (en) * 1996-08-23 1999-06-22 Applied Materials, Inc. Sputter target for eliminating redeposition on the target sidewall
US6006694A (en) * 1997-12-05 1999-12-28 Tegal Corporation Plasma reactor with a deposition shield
US6103074A (en) * 1998-02-14 2000-08-15 Phygen, Inc. Cathode arc vapor deposition method and apparatus
AU3600399A (en) * 1998-03-28 1999-10-18 Angewandte Plasma-, Vakuum- Und Verfahrenstechnik Gmbh Hearing aids with shielding from electromagnetic radiation and method for producing the same
US6051113A (en) * 1998-04-27 2000-04-18 Cvc Products, Inc. Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure using target indexing
FR2783001B1 (fr) * 1998-09-04 2000-11-24 Essilor Int Procede pour le traitement sous vide d'un quelconque substrat courbe, notamment un verre de lunettes, et cache propre a la mise en oeuvre d'un tel procede
US6117279A (en) * 1998-11-12 2000-09-12 Tokyo Electron Limited Method and apparatus for increasing the metal ion fraction in ionized physical vapor deposition
US6238526B1 (en) * 1999-02-14 2001-05-29 Advanced Ion Technology, Inc. Ion-beam source with channeling sputterable targets and a method for channeled sputtering
US6527866B1 (en) * 2000-02-09 2003-03-04 Conductus, Inc. Apparatus and method for deposition of thin films
US6444100B1 (en) * 2000-02-11 2002-09-03 Seagate Technology Llc Hollow cathode sputter source
CN1258616C (zh) * 2001-02-07 2006-06-07 旭硝子株式会社 溅射装置及溅射成膜方法
IL141828A (en) * 2001-03-05 2009-05-04 Hanita Metal Works Ltd Multi-purpose end-mill
DE10141696A1 (de) * 2001-08-25 2003-03-13 Bosch Gmbh Robert Verfahren zur Erzeugung einer nanostruktuierten Funktionsbeschichtung und damit herstellbare Beschichtung
US20040057803A1 (en) * 2002-01-08 2004-03-25 Walrath Richard J. Rotary metal cutting tool
US6743342B2 (en) * 2002-03-12 2004-06-01 Applied Materials, Inc. Sputtering target with a partially enclosed vault
US6660133B2 (en) * 2002-03-14 2003-12-09 Kennametal Inc. Nanolayered coated cutting tool and method for making the same
JP4313579B2 (ja) * 2003-01-22 2009-08-12 オーエスジー株式会社 スクエアエンドミル
US7470329B2 (en) * 2003-08-12 2008-12-30 University Of Maryland Method and system for nanoscale plasma processing of objects
US7718983B2 (en) * 2003-08-20 2010-05-18 Veeco Instruments, Inc. Sputtered contamination shielding for an ion source
US7339139B2 (en) * 2003-10-03 2008-03-04 Darly Custom Technology, Inc. Multi-layered radiant thermal evaporator and method of use
US7399943B2 (en) * 2004-10-05 2008-07-15 Applied Materials, Inc. Apparatus for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece
CN1789482A (zh) * 2004-12-17 2006-06-21 上海广电电子股份有限公司 组分渐变薄膜的蒸发装置及方法
US20070034501A1 (en) * 2005-08-09 2007-02-15 Efim Bender Cathode-arc source of metal/carbon plasma with filtration
US20070209932A1 (en) * 2006-03-10 2007-09-13 Veeco Instruments Inc. Sputter deposition system and methods of use

Also Published As

Publication number Publication date
CN102124135A (zh) 2011-07-13
WO2010021811A3 (en) 2010-04-15
EP2326741A2 (en) 2011-06-01
WO2010021811A2 (en) 2010-02-25
IL211287A0 (en) 2011-04-28
CA2731408A1 (en) 2010-02-25
EP2326741A4 (en) 2012-03-21
KR20110042190A (ko) 2011-04-25
US20100047594A1 (en) 2010-02-25
JP2012500339A (ja) 2012-01-05

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 5A E 6A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2344 DE 08-12-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.