BRPI0914418A2 - materiais de blindagem contra emi - Google Patents

materiais de blindagem contra emi

Info

Publication number: BRPI0914418A2
Authority: BR; Brazil
Prior art keywords: emi shielding; shielding materials; materials; emi; shielding
Prior art date: 2008-06-23

Application number

BRPI0914418A

Other languages

English (en)

Inventor

Francis Richard

George Watchko

Gerard Brown

Junhua Wu

Robert Steeves

William G Lionetta

Original Assignee

Parker Hannifin Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2008-06-23

Filing date

2009-02-17

Publication date

2016-03-22

2009-02-17 Application filed by Parker Hannifin Corp filed Critical Parker Hannifin Corp

2016-03-22 Publication of BRPI0914418A2 publication Critical patent/BRPI0914418A2/pt

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0075—Magnetic shielding materials
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Electromagnetism (AREA)
Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

BRPI0914418A 2008-06-23 2009-02-17 materiais de blindagem contra emi BRPI0914418A2 (pt)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US7474808P	2008-06-23	2008-06-23
US8816208P	2008-08-12	2008-08-12
PCT/US2009/034242 WO2009158045A1 (en)	2008-06-23	2009-02-17	Emi shielding materials

Publications (1)

Publication Number	Publication Date
BRPI0914418A2 true BRPI0914418A2 (pt)	2016-03-22

Family

ID=40561935

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BRPI0914418A BRPI0914418A2 (pt)	2008-06-23	2009-02-17	materiais de blindagem contra emi

Country Status (9)

Country	Link
US (1)	US20110067918A1 (pt)
EP (1)	EP2291446B1 (pt)
JP (1)	JP2011525703A (pt)
KR (1)	KR20110034604A (pt)
CN (1)	CN102171284A (pt)
BR (1)	BRPI0914418A2 (pt)
ES (1)	ES2654544T3 (pt)
NO (1)	NO2291446T3 (pt)
WO (1)	WO2009158045A1 (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US9049777B2 (en)	2010-11-01	2015-06-02	Plastics Research Corporation	EMI shielded thermoset article
CN202721947U (zh)	2011-11-03	2013-02-06	卢子鬯	电子仪器用之无卤素阻燃电磁干扰防护垫片
EP2764519B1 (de)	2011-12-15	2015-10-28	Siemens Aktiengesellschaft	Verfahren zur herstellung eines glimmschutzes, schnellhärtendes glimmschutzsystem und elektrische maschine
EP2645540A1 (de) *	2012-03-28	2013-10-02	Siemens Aktiengesellschaft	Glimmschutzwerkstoff für eine elektrische Maschine
CN104781362A (zh) *	2012-11-16	2015-07-15	3M创新有限公司	导电弹性中空微球体、粘合剂组合物和粘合剂制品
US20170290145A1 (en) *	2014-08-29	2017-10-05	Tatsuta Electric Wire & Cable Co., Ltd.	Reinforcing member for flexible printed wiring board, and flexible printed wiring board provided with same
CA2981852A1 (en)	2015-04-08	2016-10-13	Aviation Devices & Electronic Components, L.L.C.	A metal mesh with a low electrical resistance conversion coating for use with aircraft structures
JP3216710U (ja)	2015-06-12	2018-06-21	グラフテックインターナショナルホールディングスインコーポレイティド	グラファイト複合材料及び熱管理システム
EP3436512A4 (en)	2016-03-31	2019-12-11	NeoGraf Solutions, LLC	NOISE REDUCTION MEASURES
US12522688B2 (en) *	2019-03-26	2026-01-13	Zephyros, Inc.	Pultrusion with extruded gasket foam
CN110681325B (zh) *	2019-10-23	2020-10-27	杭州见闻录科技有限公司	一种制造复合微球的方法及用于emi屏蔽的核壳型复合微球
CN116162358A (zh) *	2023-03-08	2023-05-26	北京泰派斯特电子技术有限公司	一种铜镀银导电橡胶及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS58182685A (ja) *	1982-04-20	1983-10-25	セイコーエプソン株式会社	表示体パネル
JPS6077151A (ja) *	1983-09-30	1985-05-01	Asahi Glass Co Ltd	金属被覆ガラス繊維を使用したｆｒｐ製品
JPS61141762A (ja) *	1984-12-12	1986-06-28	Kanebo Ltd	導電性成形材料
US4678716A (en) *	1985-08-06	1987-07-07	Chomerics, Inc.	Electromagnetic shielding
US4935296A (en) *	1986-09-26	1990-06-19	Advanced Technology Materials, Inc.	Metal coated fibers containing a sol gel formed porous polysilicate, titania or alumina interlayer and composite material articles reinforced therewith
JP3028972B2 (ja) *	1991-05-31	2000-04-04	日本化学工業株式会社	アルミニウム系無電解めっき粉末並びに導電性フィラーとその製造方法
JPH06306201A (ja) *	1993-04-23	1994-11-01	Toyo Ink Mfg Co Ltd	電磁波遮蔽性樹脂組成物
JP4160138B2 (ja) *	1996-11-14	2008-10-01	ゼネラル・エレクトリック・カンパニイ	熱可塑性樹脂成形品、および成形品用材料、成形品の製造方法
US6485831B1 (en) *	1999-05-13	2002-11-26	Shin-Etsu Chemical Co., Ltd.	Conductive powder and making process
JP3733843B2 (ja) *	2000-07-17	2006-01-11	日本板硝子株式会社	メタリック顔料およびその製造方法、ならびにそれを含有する塗料組成物、インキ組成物および樹脂組成物
JP4864195B2 (ja) *	2000-08-30	2012-02-01	三井金属鉱業株式会社	被覆銅粉
US6809254B2 (en) *	2001-07-20	2004-10-26	Parker-Hannifin Corporation	Electronics enclosure having an interior EMI shielding and cosmetic coating
US7208192B2 (en) *	2002-05-31	2007-04-24	Parker-Hannifin Corporation	Thermally or electrically-conductive form-in-place gap filter
JP4302938B2 (ja) *	2002-06-11	2009-07-29	ダイセル化学工業株式会社	電磁波シールド用樹脂組成物
JP2004189938A (ja) *	2002-12-12	2004-07-08	Nippon Sheet Glass Co Ltd	導電性樹脂成形部品
JP2004327687A (ja) *	2003-04-24	2004-11-18	Daiwa Fine Chemicals Co Ltd (Laboratory)	電磁波障害防止用材料
TWI347643B (en) *	2007-06-13	2011-08-21	Advanced Semiconductor Eng	Under bump metallurgy structure and die structure using the same and method of manufacturing die structure

2009
- 2009-02-17 EP EP09770582.6A patent/EP2291446B1/en active Active
- 2009-02-17 BR BRPI0914418A patent/BRPI0914418A2/pt not_active Application Discontinuation
- 2009-02-17 CN CN2009801245022A patent/CN102171284A/zh active Pending
- 2009-02-17 KR KR1020107028753A patent/KR20110034604A/ko not_active Ceased
- 2009-02-17 JP JP2011514635A patent/JP2011525703A/ja not_active Revoked
- 2009-02-17 ES ES09770582.6T patent/ES2654544T3/es active Active
- 2009-02-17 NO NO09770582A patent/NO2291446T3/no unknown
- 2009-02-17 WO PCT/US2009/034242 patent/WO2009158045A1/en not_active Ceased
2010
- 2010-11-30 US US12/956,174 patent/US20110067918A1/en not_active Abandoned

Also Published As

Publication number	Publication date
US20110067918A1 (en)	2011-03-24
ES2654544T3 (es)	2018-02-14
EP2291446A1 (en)	2011-03-09
JP2011525703A (ja)	2011-09-22
EP2291446B1 (en)	2017-10-18
NO2291446T3 (pt)	2018-03-17
CN102171284A (zh)	2011-08-31
WO2009158045A1 (en)	2009-12-30
KR20110034604A (ko)	2011-04-05

Legal Events

Date	Code	Title	Description
2017-12-12	B08F	Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]	Free format text: REFERENTE A 9A ANUIDADE.
2018-01-16	B08G	Application fees: restoration [chapter 8.7 patent gazette]
2018-04-17	B06F	Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
2018-09-18	B06T	Formal requirements before examination [chapter 6.20 patent gazette]
2019-01-22	B11E	Dismissal acc. art. 34 of ipl - requirements for examination incomplete
2019-12-03	B11E	Dismissal acc. art. 34 of ipl - requirements for examination incomplete
2019-12-24	B11N	Dismissal: publication cancelled [chapter 11.14 patent gazette]	Free format text: ANULADA A PUBLICACAO CODIGO 11.5 NA RPI NO 2552 DE 03/12/2019 POR TER SIDO INDEVIDA.

Publication	Publication Date	Title
BRPI0914418A2 (pt)	2016-03-22	materiais de blindagem contra emi
BRPI0920089A2 (pt)	2017-03-28	materiais de processamento
BRPI0813995A2 (pt)	2015-01-06	Disposição de blindagem
EP2269200A4 (en)	2011-07-13	ELECTROMAGNETIC INDUCTION (EMI) / D ENERGY DISSIPATION FILTER, THREAD TERMINAL, THREADED AND BLINDED
IL209664A0 (en)	2011-02-28	5-substtuted isoindoline compounds
BRPI1008947A2 (pt)	2016-08-16	novos materiais
ZA201100804B (en)	2013-07-31	Insecticidal compounds
GB0815344D0 (en)	2008-10-01	Agriculture application machine
BRPI0912808A2 (pt)	2015-10-13	aperfeiçoamentos em poços de alimentação
DE112008002196T8 (de)	2011-02-24	Abschirmleiter
BRPI0916837A2 (pt)	2019-09-24	proteção contra perda de multi-segmentos
BRPI1006008A2 (pt)	2015-09-01	Materiais superabsorventes compreendendo peróxido
GB0812280D0 (en)	2008-08-13	Improved X-Ray shield
EP2245414A4 (en)	2013-11-06	PROTECTION ARMOR PLATES
IL216417A0 (en)	2012-02-29	Compositions and methods to prevent cancer by stabilizing p53 through non mdm2-mediated pathways
BRPI0911474A2 (pt)	2016-07-19	processamento de materiais orgânicos
BRPI0918076A2 (pt)	2015-12-01	dispositivo de proteção contra queda
GB0803716D0 (en)	2008-04-09	Improved nappy
EP2356896A4 (en)	2016-12-07	ARRANGEMENT FOR ELECTRIC SHIELDING
GB0815590D0 (en)	2008-10-01	Anti-electromagnetic interference material arrangement
GB0813042D0 (en)	2008-08-20	Insecticidal compounds
GB0802487D0 (en)	2008-03-19	Improvement relating to firewalls
EP2360554A4 (en)	2012-06-06	MOUSE
GB2437173B (en)	2008-09-17	Electrical-cable shielding
BRPI0913939A2 (pt)	2016-04-26	dose unitária de apadenoson