BRPI0915782A2 - conjunto comutador de circuitos elétricos - Google Patents

conjunto comutador de circuitos elétricos

Info

Publication number
BRPI0915782A2
BRPI0915782A2 BRPI0915782A BRPI0915782A BRPI0915782A2 BR PI0915782 A2 BRPI0915782 A2 BR PI0915782A2 BR PI0915782 A BRPI0915782 A BR PI0915782A BR PI0915782 A BRPI0915782 A BR PI0915782A BR PI0915782 A2 BRPI0915782 A2 BR PI0915782A2
Authority
BR
Brazil
Prior art keywords
switch circuit
circuit assembly
assembly
switch
circuit
Prior art date
Application number
BRPI0915782A
Other languages
English (en)
Inventor
Andre Lischeck
Juergen Stein
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of BRPI0915782A2 publication Critical patent/BRPI0915782A2/pt
Publication of BRPI0915782B1 publication Critical patent/BRPI0915782B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Multi-Conductor Connections (AREA)
BRPI0915782-4A 2008-07-17 2009-06-15 Conjunto de circuitos elétricos com elemento de base, uma placa de circuito impresso e um dispositivo de fixação para fixar a placa de circuito impresso no elemento de base BRPI0915782B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008040504A DE102008040504A1 (de) 2008-07-17 2008-07-17 Elektrische Schaltungsanordnung
DE102008040504.3 2008-07-17
PCT/EP2009/057357 WO2010006862A1 (de) 2008-07-17 2009-06-15 Elektrische schaltungsanordnung

Publications (2)

Publication Number Publication Date
BRPI0915782A2 true BRPI0915782A2 (pt) 2015-11-10
BRPI0915782B1 BRPI0915782B1 (pt) 2019-05-28

Family

ID=40942461

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0915782-4A BRPI0915782B1 (pt) 2008-07-17 2009-06-15 Conjunto de circuitos elétricos com elemento de base, uma placa de circuito impresso e um dispositivo de fixação para fixar a placa de circuito impresso no elemento de base

Country Status (8)

Country Link
US (1) US8575498B2 (pt)
EP (1) EP2305010B1 (pt)
JP (1) JP5260739B2 (pt)
KR (1) KR101581175B1 (pt)
CN (1) CN102100129B (pt)
BR (1) BRPI0915782B1 (pt)
DE (1) DE102008040504A1 (pt)
WO (1) WO2010006862A1 (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI424216B (zh) 2011-06-28 2014-01-21 Largan Precision Co 光學影像鏡組
DE102013227224A1 (de) 2013-12-30 2015-07-02 Robert Bosch Gmbh Leiterplattenanordnung
JP6113219B2 (ja) * 2015-04-27 2017-04-12 三菱電機株式会社 電子機器筐体およびリモートキーレスエントリー装置
CN109461635B (zh) * 2018-12-29 2024-03-19 厦门大恒科技有限公司 一种滑动式触头装置以及安全型断路器
EP4287793A1 (en) * 2022-06-03 2023-12-06 TE Connectivity Germany GmbH Housing assembly, assembled part, and method for assembling a substrate in a housing

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US217768A (en) * 1879-07-22 Improvement in ear-muffs
US4969827A (en) * 1989-06-12 1990-11-13 Motorola, Inc. Modular interconnecting electronic circuit blocks
US5156552A (en) 1990-02-23 1992-10-20 General Electric Company Circuit board edge connector
US5547287A (en) 1993-12-07 1996-08-20 Kmc, Inc. Method and bearing construction for control of hot oil carryover and loss of lubricant
JPH09214152A (ja) * 1996-01-30 1997-08-15 Sanyo Electric Co Ltd プリント基板収容枠体
JP2001024360A (ja) * 1999-07-06 2001-01-26 Mitsumi Electric Co Ltd 基板取付機構
SG87905A1 (en) 2000-02-28 2002-04-16 Johnstech Int Corp Interconnect contact
KR20040042300A (ko) 2002-11-13 2004-05-20 엘지전자 주식회사 씨디엠에이 모듈의 피씨비 휨 방지구조
JP2004259834A (ja) * 2003-02-25 2004-09-16 Nikon Corp フレキシブルプリント基板およびこれを有する電子機器
US6965245B2 (en) * 2003-05-01 2005-11-15 K&S Interconnect, Inc. Prefabricated and attached interconnect structure
KR101124015B1 (ko) * 2003-07-16 2012-03-26 그리픽스, 인코포레이티드 상호 결합 접촉 시스템을 구비한 전기 상호 연결 조립체
TWI249269B (en) 2004-03-09 2006-02-11 Hon Hai Prec Ind Co Ltd Electrical connector
JP4368237B2 (ja) * 2004-04-28 2009-11-18 パナソニック株式会社 電気コネクタ
FR2906088B1 (fr) 2006-09-15 2008-11-28 Magneti Marelli France Soc Par Dispositif de connexion electrique
EP2006160B1 (en) * 2007-05-21 2009-12-16 Magneti Marelli S.p.A. Electronic control unit with expanded blocks
WO2009096960A1 (en) * 2008-01-30 2009-08-06 Hewlett-Packard Development Company, L.P. Printed circuit board (pcb) flexibly connected to a device chassis
US8488334B2 (en) * 2008-02-11 2013-07-16 Avago Technologies General Ip (Singapore) Pte. Ltd. Electromagnetic interference (EMI) absorbing assembly and method for use in an optical transceiver module
US7686620B2 (en) * 2008-05-07 2010-03-30 Hon Hai Precision Ind. Co., Ltd. Electrical connector configured by unit section
US8194400B2 (en) * 2009-12-11 2012-06-05 Kabushiki Kaisha Toshiba Electronic device

Also Published As

Publication number Publication date
CN102100129A (zh) 2011-06-15
US8575498B2 (en) 2013-11-05
DE102008040504A1 (de) 2010-01-21
JP2011528175A (ja) 2011-11-10
CN102100129B (zh) 2013-12-25
US20110168441A1 (en) 2011-07-14
EP2305010B1 (de) 2012-12-05
WO2010006862A1 (de) 2010-01-21
JP5260739B2 (ja) 2013-08-14
KR20110043598A (ko) 2011-04-27
KR101581175B1 (ko) 2015-12-30
BRPI0915782B1 (pt) 2019-05-28
EP2305010A1 (de) 2011-04-06

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 15/06/2009, OBSERVADAS AS CONDICOES LEGAIS. (CO) 20 (VINTE) ANOS CONTADOS A PARTIR DE 15/06/2009, OBSERVADAS AS CONDICOES LEGAIS

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 14A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2727 DE 11-04-2023 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.