BRPI0917051A2 - conjunto modular flexível e método para a fabricação de um conjunto modular flexível - Google Patents

conjunto modular flexível e método para a fabricação de um conjunto modular flexível

Info

Publication number
BRPI0917051A2
BRPI0917051A2 BRPI0917051A BRPI0917051A BRPI0917051A2 BR PI0917051 A2 BRPI0917051 A2 BR PI0917051A2 BR PI0917051 A BRPI0917051 A BR PI0917051A BR PI0917051 A BRPI0917051 A BR PI0917051A BR PI0917051 A2 BRPI0917051 A2 BR PI0917051A2
Authority
BR
Brazil
Prior art keywords
modular assembly
flexible modular
manufacturing
flexible
assembly
Prior art date
Application number
BRPI0917051A
Other languages
English (en)
Inventor
Erwin Altewischer
Guido Lamerichs
Liesbeth Van Pieterson
Martijn Krans
Rabin Bhattacharya
Thomas Schuler
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of BRPI0917051A2 publication Critical patent/BRPI0917051A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
BRPI0917051A 2008-12-09 2009-12-03 conjunto modular flexível e método para a fabricação de um conjunto modular flexível BRPI0917051A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08171032 2008-12-09
PCT/IB2009/055478 WO2010067273A1 (en) 2008-12-09 2009-12-03 Flexible modular assembly

Publications (1)

Publication Number Publication Date
BRPI0917051A2 true BRPI0917051A2 (pt) 2016-02-16

Family

ID=41694658

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0917051A BRPI0917051A2 (pt) 2008-12-09 2009-12-03 conjunto modular flexível e método para a fabricação de um conjunto modular flexível

Country Status (8)

Country Link
US (1) US8760877B2 (pt)
EP (1) EP2377374B1 (pt)
JP (2) JP2012511811A (pt)
KR (1) KR20110098810A (pt)
CN (1) CN102246606B (pt)
BR (1) BRPI0917051A2 (pt)
RU (1) RU2529488C2 (pt)
WO (1) WO2010067273A1 (pt)

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KR101861675B1 (ko) * 2012-01-03 2018-05-29 엘지전자 주식회사 플렉서블 디스플레이의 배면 플레이트 및 이를 구비한 플렉서블 디스플레이 단말기
EP2640168A1 (en) 2012-03-15 2013-09-18 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Submount, assembly including submount, method of assembling and assembling device
US20160073530A1 (en) * 2014-09-08 2016-03-10 Intel Corporation Design and apparatus for a segmented device enclosure
US20170303388A1 (en) * 2014-09-23 2017-10-19 Koninklijke Philips N.V. Flat cable strain relief with controlled mechanical resistance
US9657484B2 (en) 2015-02-12 2017-05-23 The United States Of America, As Represented By The Secretary Of The Army Rapid deployment communications tile
CN107405499A (zh) * 2015-02-26 2017-11-28 夏普株式会社 光照射用基板及光照射装置
US10463875B2 (en) * 2015-02-26 2019-11-05 Sharp Kabushiki Kaisha Light irradiation substrate
US9840189B1 (en) * 2016-12-09 2017-12-12 Towmate, Llc Method and apparatus of a foldable-reinstallable wireless warning system for transporting oversize loads
WO2018170599A1 (en) * 2017-03-22 2018-09-27 10644137 Canada Inc. Apparatus having a flexible led display module and a method of employing same
CN108271314A (zh) * 2018-01-18 2018-07-10 郑州云海信息技术有限公司 一种超大尺寸背板的制作方法及背板
WO2019221913A1 (en) * 2018-05-15 2019-11-21 Illumina, Inc. Flow cell with flexible connection
US20210393976A1 (en) * 2019-04-09 2021-12-23 Arbor Grace, Inc. Phototherapy device
DE102020116917A1 (de) 2020-06-26 2021-12-30 Carpetlight Gmbh Beleuchtungseinheit mit flexiblem Flächenbeleuchtungskörper
WO2023015257A1 (en) * 2021-08-05 2023-02-09 Compound Photonics U.S. Corporation Systems and methods for configuring a display device and display system
CN113687734B (zh) * 2021-08-09 2024-06-11 维沃移动通信有限公司 电子织物和具有电子织物的终端设备
KR20240107853A (ko) * 2022-12-30 2024-07-09 엘지디스플레이 주식회사 표시장치

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SU1564741A1 (ru) * 1988-04-29 1990-05-15 Московский Институт Электронного Машиностроения Ткана коммутационна плата
JPH05299533A (ja) * 1992-04-17 1993-11-12 Nippon Steel Corp 電子部品実装用の基板及びこの基板を用いた電子部品装置
RU2037279C1 (ru) * 1993-01-28 1995-06-09 Виталий Васильевич Андриенко Радиоэлектронный блок
JPH07142834A (ja) * 1993-11-19 1995-06-02 Nippon Telegr & Teleph Corp <Ntt> 電子装置の実装構造
RU2096693C1 (ru) * 1995-12-20 1997-11-20 Александр Семенович Криворотов Устройство солнечной батареи
JP3895407B2 (ja) * 1996-10-14 2007-03-22 三菱電機マイコン機器ソフトウエア株式会社 回路基板装置
US5982284A (en) * 1997-09-19 1999-11-09 Avery Dennison Corporation Tag or label with laminated thin, flat, flexible device
US6498592B1 (en) * 1999-02-16 2002-12-24 Sarnoff Corp. Display tile structure using organic light emitting materials
CA2426110C (en) * 2000-10-16 2010-06-29 Foster-Miller, Inc. A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article
GB2396252A (en) * 2002-10-01 2004-06-16 Steven Leftly Textile light system
JP2004303195A (ja) * 2003-03-19 2004-10-28 Seiko Epson Corp シートコンピュータ、ウェアラブルコンピュータ、ディスプレイ装置及びこれらの製造方法並びに電子機器
US7559902B2 (en) * 2003-08-22 2009-07-14 Foster-Miller, Inc. Physiological monitoring garment
US7108392B2 (en) 2004-05-04 2006-09-19 Eastman Kodak Company Tiled flat panel lighting system
WO2006035385A2 (en) * 2004-09-29 2006-04-06 Koninklijke Philips Electronics, N.V. Modular wearable circuit
US7673528B2 (en) * 2005-05-12 2010-03-09 Euisik Yoon Flexible modular sensor systems
US20080196783A1 (en) 2005-05-31 2008-08-21 Koninklijke Philips Electronics, N.V. Fully Textile Electrode Lay-Out Allowing Passive and Active Matrix Addressing
JP2008542834A (ja) 2005-05-31 2008-11-27 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 柔軟なディスプレイデバイス
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US8022307B2 (en) * 2006-07-10 2011-09-20 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Fabric circuits and method of manufacturing fabric circuits
US20080074049A1 (en) * 2006-09-26 2008-03-27 Nanolumens Acquisition, Inc. Electroluminescent apparatus and display incorporating same
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FI20070313A0 (fi) 2007-04-23 2007-04-23 Neule Apu Oy Valaistusjärjestely tekstiilirakenteen yhteydessä
DE102007023651A1 (de) * 2007-05-22 2008-11-27 Osram Gesellschaft mit beschränkter Haftung Beleuchtungseinrichtung, Hinterleuchtungsvorrichtung und Anzeigevorrichtung
WO2008152575A1 (en) * 2007-06-14 2008-12-18 Koninklijke Philips Electronics N.V. Flexible electronics package and method for manufacturing such a package
WO2009030068A1 (fr) * 2007-09-04 2009-03-12 Yang, Tzu-Lin Toile présentant une zone inductive séparée

Also Published As

Publication number Publication date
EP2377374B1 (en) 2013-08-21
EP2377374A1 (en) 2011-10-19
CN102246606A (zh) 2011-11-16
US20110242771A1 (en) 2011-10-06
US8760877B2 (en) 2014-06-24
KR20110098810A (ko) 2011-09-01
RU2529488C2 (ru) 2014-09-27
CN102246606B (zh) 2016-08-17
WO2010067273A1 (en) 2010-06-17
JP2015165307A (ja) 2015-09-17
JP2012511811A (ja) 2012-05-24
RU2011128409A (ru) 2013-01-20

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Legal Events

Date Code Title Description
B25D Requested change of name of applicant approved

Owner name: KONINKLIJKE PHILIPS N.V. (NL)

B25G Requested change of headquarter approved

Owner name: KONINKLIJKE PHILIPS N.V. (NL)

B25A Requested transfer of rights approved

Owner name: PHILIPS LIGHTING HOLDING B.V. (NL)

B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 9A ANUIDADE.

B06T Formal requirements before examination [chapter 6.20 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2494 DE 23-10-2018 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.