BRPI0918164A2 - dispositivo de trasnmissão dielétrico de onda milimétrica, método para fabricar um dispositivo de transmissão dielétrico de onda milimétrica, dispositivo de transmissão sem fio, e, método de transmissão sem fio - Google Patents

dispositivo de trasnmissão dielétrico de onda milimétrica, método para fabricar um dispositivo de transmissão dielétrico de onda milimétrica, dispositivo de transmissão sem fio, e, método de transmissão sem fio

Info

Publication number
BRPI0918164A2
BRPI0918164A2 BRPI0918164A BRPI0918164A BRPI0918164A2 BR PI0918164 A2 BRPI0918164 A2 BR PI0918164A2 BR PI0918164 A BRPI0918164 A BR PI0918164A BR PI0918164 A BRPI0918164 A BR PI0918164A BR PI0918164 A2 BRPI0918164 A2 BR PI0918164A2
Authority
BR
Brazil
Prior art keywords
transmission device
millimeter wave
wave dielectric
wireless transmission
manufacturing
Prior art date
Application number
BRPI0918164A
Other languages
English (en)
Inventor
Hirofumi Kawamura
Yasuhiro Okada
Original Assignee
Sony Corp E Sony Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp E Sony Electronics Inc filed Critical Sony Corp E Sony Electronics Inc
Publication of BRPI0918164A2 publication Critical patent/BRPI0918164A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/16—Dielectric waveguides, i.e. without a longitudinal conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/04—Coupling devices of the waveguide type with variable factor of coupling
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B3/00—Line transmission systems
    • H04B3/52—Systems for transmission between fixed stations via waveguides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/037—Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguides (AREA)
  • Radar Systems Or Details Thereof (AREA)
BRPI0918164A 2008-09-25 2009-09-15 dispositivo de trasnmissão dielétrico de onda milimétrica, método para fabricar um dispositivo de transmissão dielétrico de onda milimétrica, dispositivo de transmissão sem fio, e, método de transmissão sem fio BRPI0918164A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008246510 2008-09-25
JP2009200116A JP5526659B2 (ja) 2008-09-25 2009-08-31 ミリ波誘電体内伝送装置
PCT/JP2009/066080 WO2010035660A1 (ja) 2008-09-25 2009-09-15 ミリ波誘電体内伝送装置及びその製造方法、並びに、無線伝送装置および無線伝送方法

Publications (1)

Publication Number Publication Date
BRPI0918164A2 true BRPI0918164A2 (pt) 2015-12-01

Family

ID=42059661

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0918164A BRPI0918164A2 (pt) 2008-09-25 2009-09-15 dispositivo de trasnmissão dielétrico de onda milimétrica, método para fabricar um dispositivo de transmissão dielétrico de onda milimétrica, dispositivo de transmissão sem fio, e, método de transmissão sem fio

Country Status (8)

Country Link
US (1) US8848389B2 (pt)
EP (1) EP2330683B1 (pt)
JP (1) JP5526659B2 (pt)
KR (1) KR101605218B1 (pt)
CN (1) CN102150324B (pt)
BR (1) BRPI0918164A2 (pt)
RU (1) RU2471270C2 (pt)
WO (1) WO2010035660A1 (pt)

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Also Published As

Publication number Publication date
US20110158344A1 (en) 2011-06-30
US8848389B2 (en) 2014-09-30
RU2471270C2 (ru) 2012-12-27
RU2011109036A (ru) 2012-09-20
KR20110061566A (ko) 2011-06-09
CN102150324A (zh) 2011-08-10
EP2330683A1 (en) 2011-06-08
WO2010035660A1 (ja) 2010-04-01
CN102150324B (zh) 2014-07-16
EP2330683A4 (en) 2012-09-05
KR101605218B1 (ko) 2016-04-01
JP2010103978A (ja) 2010-05-06
JP5526659B2 (ja) 2014-06-18
EP2330683B1 (en) 2016-11-02

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Legal Events

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B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2376 DE 19-07-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.