BRPI0921170A2 - adesivos termo fundidos de cura por umidade - Google Patents
adesivos termo fundidos de cura por umidadeInfo
- Publication number
- BRPI0921170A2 BRPI0921170A2 BRPI0921170A BRPI0921170A BRPI0921170A2 BR PI0921170 A2 BRPI0921170 A2 BR PI0921170A2 BR PI0921170 A BRPI0921170 A BR PI0921170A BR PI0921170 A BRPI0921170 A BR PI0921170A BR PI0921170 A2 BRPI0921170 A2 BR PI0921170A2
- Authority
- BR
- Brazil
- Prior art keywords
- moisture curing
- thermoset adhesives
- curing thermoset
- adhesives
- moisture
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 238000013008 moisture curing Methods 0.000 title 1
- 229920001187 thermosetting polymer Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6603—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
- C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3212—Polyhydroxy compounds containing cycloaliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
- C08G18/3819—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/20—Compositions for hot melt adhesives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008302038A JP5580982B2 (ja) | 2008-11-27 | 2008-11-27 | 湿気硬化型ホットメルト接着剤 |
| PCT/JP2009/069534 WO2010061759A1 (ja) | 2008-11-27 | 2009-11-18 | 湿気硬化型ホットメルト接着剤 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0921170A2 true BRPI0921170A2 (pt) | 2018-08-07 |
Family
ID=42225635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0921170A BRPI0921170A2 (pt) | 2008-11-27 | 2009-11-18 | adesivos termo fundidos de cura por umidade |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8324299B2 (pt) |
| EP (1) | EP2380939A1 (pt) |
| JP (1) | JP5580982B2 (pt) |
| CN (1) | CN102264856B (pt) |
| BR (1) | BRPI0921170A2 (pt) |
| WO (1) | WO2010061759A1 (pt) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6067969B2 (ja) * | 2011-12-12 | 2017-01-25 | 日東電工株式会社 | 熱伝導性粘着樹脂組成物および熱伝導性粘着シート |
| CN103320045A (zh) * | 2013-07-11 | 2013-09-25 | 苏州毫邦新材料有限公司 | 一种反应型异方导电热熔胶粘剂 |
| JP6111190B2 (ja) * | 2013-12-25 | 2017-04-05 | 株式会社ブリヂストン | サイド補強式ランフラットタイヤ |
| JP6660545B2 (ja) * | 2014-12-16 | 2020-03-11 | Dic株式会社 | 湿気硬化型ホットメルトウレタン組成物及び接着剤 |
| CN106499152B (zh) * | 2016-10-21 | 2019-08-06 | 肖文辉 | Pvc复合地板 |
| JP7006803B2 (ja) * | 2018-09-28 | 2022-01-24 | 大日本印刷株式会社 | 化粧シート及びこれを用いた化粧材 |
| CN110229645B (zh) * | 2019-07-12 | 2021-10-08 | 重庆韩拓科技有限公司 | 高初粘单组份湿气固化反应型聚氨酯热熔胶及其制备方法 |
| CN114144491B (zh) * | 2019-08-26 | 2024-04-16 | H.B.富乐公司 | 快速固化可湿固化热熔融粘合剂组合物和包含快速固化可湿固化热熔融粘合剂组合物的制品 |
| KR20240132455A (ko) * | 2022-01-07 | 2024-09-03 | 헨켈 아게 운트 코. 카게아아 | 반응성 핫 멜트 접착제 조성물 및 그의 용도 |
| CN116238014B (zh) * | 2023-04-12 | 2026-03-24 | 邦弗特新材料股份有限公司 | 一种饰面板材的制备方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4377510A (en) * | 1981-11-30 | 1983-03-22 | Arizona Chemical Company | Urethane-modified rosin ester and process for preparing the same |
| US4693846A (en) * | 1986-05-09 | 1987-09-15 | Ppg Industries, Inc. | Urethane-modified rosin esters |
| US5518571A (en) * | 1990-08-24 | 1996-05-21 | Henkel Kommanditgesellschaft Auf Aktien | Use of polyester resins as hot-melt adhesives |
| JP3317698B2 (ja) | 1990-11-28 | 2002-08-26 | 積水化学工業株式会社 | 反応性ホットメルト型接着剤組成物 |
| JPH05214312A (ja) * | 1992-02-07 | 1993-08-24 | Sunstar Eng Inc | 湿気硬化性熱溶融型ポリウレタン系接着剤 |
| JPH0751282A (ja) | 1993-08-09 | 1995-02-28 | Olympus Optical Co Ltd | レーザ治療用具 |
| JP3158828B2 (ja) * | 1993-12-24 | 2001-04-23 | 荒川化学工業株式会社 | ロジン骨格を有するポリウレタンおよび該ポリウレタンを含有してなるポリウレタン系接着剤 |
| JP3717533B2 (ja) * | 1994-04-11 | 2005-11-16 | ハリマ化成株式会社 | 感圧性接着剤の粘着付与剤及び感圧性接着剤組成物 |
| CA2214311A1 (en) * | 1996-09-06 | 1998-03-06 | Air Products And Chemicals, Inc. | Hot melt adhesives comprising low free monomer, low oligomer isocyanate prepolymers |
| US6387449B1 (en) | 1999-12-01 | 2002-05-14 | H. B. Fuller Licensing & Financing, Inc. | Reactive hot melt adhesive |
| US6660376B1 (en) * | 2000-06-06 | 2003-12-09 | H. B. Fuller Licensing & Financing Inc. | Method of bonding permeable substrates with hot melt moisture cure adhesive having low viscosity and high green strength |
| JP2007051282A (ja) * | 2005-07-21 | 2007-03-01 | Sanyo Chem Ind Ltd | 反応性ホットメルト接着剤 |
| CN1300274C (zh) * | 2005-09-28 | 2007-02-14 | 东北林业大学 | 湿固化聚氨酯热熔胶黏剂的制备方法 |
-
2008
- 2008-11-27 JP JP2008302038A patent/JP5580982B2/ja not_active Expired - Fee Related
-
2009
- 2009-11-18 WO PCT/JP2009/069534 patent/WO2010061759A1/ja not_active Ceased
- 2009-11-18 BR BRPI0921170A patent/BRPI0921170A2/pt not_active IP Right Cessation
- 2009-11-18 EP EP20090829007 patent/EP2380939A1/en not_active Withdrawn
- 2009-11-18 CN CN200980152897.7A patent/CN102264856B/zh not_active Expired - Fee Related
-
2011
- 2011-05-26 US US13/116,573 patent/US8324299B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20110275767A1 (en) | 2011-11-10 |
| WO2010061759A1 (ja) | 2010-06-03 |
| CN102264856A (zh) | 2011-11-30 |
| JP5580982B2 (ja) | 2014-08-27 |
| EP2380939A1 (en) | 2011-10-26 |
| US8324299B2 (en) | 2012-12-04 |
| JP2010126615A (ja) | 2010-06-10 |
| CN102264856B (zh) | 2015-11-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B15I | Others concerning applications: loss of priority | ||
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] | ||
| B25A | Requested transfer of rights approved |
Owner name: HENKEL US IP LLC (US) |
|
| B25A | Requested transfer of rights approved |
Owner name: HENKEL IP AND HOLDING GMBH (DE) |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2485 DE 21-08-2018 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |