BRPI0921573A2 - substrato de circuito, painel de exibição e dispositivo de exibição - Google Patents

substrato de circuito, painel de exibição e dispositivo de exibição

Info

Publication number
BRPI0921573A2
BRPI0921573A2 BRPI0921573A BRPI0921573A BRPI0921573A2 BR PI0921573 A2 BRPI0921573 A2 BR PI0921573A2 BR PI0921573 A BRPI0921573 A BR PI0921573A BR PI0921573 A BRPI0921573 A BR PI0921573A BR PI0921573 A2 BRPI0921573 A2 BR PI0921573A2
Authority
BR
Brazil
Prior art keywords
circuit substrate
display device
display panel
display
panel
Prior art date
Application number
BRPI0921573A
Other languages
English (en)
Inventor
Hiroyuki Moriwaki
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of BRPI0921573A2 publication Critical patent/BRPI0921573A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
BRPI0921573A 2008-11-19 2009-07-01 substrato de circuito, painel de exibição e dispositivo de exibição BRPI0921573A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008296055 2008-11-19
PCT/JP2009/062060 WO2010058619A1 (ja) 2008-11-19 2009-07-01 回路基板、表示パネル及び表示装置

Publications (1)

Publication Number Publication Date
BRPI0921573A2 true BRPI0921573A2 (pt) 2016-02-10

Family

ID=42198060

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0921573A BRPI0921573A2 (pt) 2008-11-19 2009-07-01 substrato de circuito, painel de exibição e dispositivo de exibição

Country Status (7)

Country Link
US (1) US20110205716A1 (pt)
EP (1) EP2360661B1 (pt)
JP (1) JP5043202B2 (pt)
CN (1) CN102203840A (pt)
BR (1) BRPI0921573A2 (pt)
RU (1) RU2483389C2 (pt)
WO (1) WO2010058619A1 (pt)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI0920935A2 (pt) * 2008-11-26 2019-09-24 Sharp Kk dispositivo de video
WO2010064468A1 (ja) * 2008-12-05 2010-06-10 シャープ株式会社 表示装置用基板及び表示装置
WO2013047661A1 (ja) * 2011-09-30 2013-04-04 京セラ株式会社 表示装置
KR101980766B1 (ko) * 2012-12-27 2019-05-21 엘지디스플레이 주식회사 터치 패널 내장형 유기 발광 다이오드 표시 장치
KR102000052B1 (ko) * 2012-12-31 2019-07-15 엘지디스플레이 주식회사 유기 발광 다이오드 표시 장치
JP6299445B2 (ja) * 2014-06-04 2018-03-28 日立金属株式会社 コネクタ付きケーブル及びコネクタ
CN104142588B (zh) * 2014-07-30 2017-01-25 深圳市华星光电技术有限公司 液晶显示面板以及液晶显示器
CN104979326B (zh) * 2015-07-09 2017-12-05 深圳市晶泓科技有限公司 Led发光组件、led发光面板和led显示屏
TWI735455B (zh) * 2015-08-10 2021-08-11 南韓商東友精細化工有限公司 電極連接單元及包括其的電裝置
KR102482822B1 (ko) 2017-10-24 2022-12-30 삼성디스플레이 주식회사 표시 장치
CN107658320B (zh) * 2017-10-26 2021-01-15 京东方科技集团股份有限公司 功能面板及其制造方法、显示装置
JP2019086628A (ja) * 2017-11-06 2019-06-06 株式会社ジャパンディスプレイ 表示装置
KR102089474B1 (ko) 2017-12-28 2020-03-17 주식회사 고영테크놀러지 기판에 삽입된 복수의 핀의 삽입 상태를 검사하는 방법 및 기판 검사 장치
CN111480088B (zh) * 2017-12-28 2022-05-27 株式会社高迎科技 检查插入于基板的多个引脚的插入状态的方法及基板检查装置
TWI653748B (zh) * 2018-03-02 2019-03-11 友達光電股份有限公司 陣列基板
JP6958515B2 (ja) * 2018-09-03 2021-11-02 株式会社オートネットワーク技術研究所 回路構造体及び電気接続箱
JP7547866B2 (ja) * 2020-08-26 2024-09-10 セイコーエプソン株式会社 電気光学装置、及び電子機器

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3850510B2 (ja) 1997-04-09 2006-11-29 東芝電子エンジニアリング株式会社 表示装置
TW570203U (en) * 1998-08-03 2004-01-01 Rohm Co Ltd Liquid crystal display element
JP3139549B2 (ja) * 1999-01-29 2001-03-05 日本電気株式会社 アクティブマトリクス型液晶表示装置
JP2002258768A (ja) * 2001-03-02 2002-09-11 Seiko Epson Corp 電気光学装置、その製造方法および電子機器
JP3702859B2 (ja) * 2001-04-16 2005-10-05 セイコーエプソン株式会社 電気光学装置及び電子機器
JP2003007749A (ja) * 2001-06-18 2003-01-10 Sanyo Electric Co Ltd 集積回路及び表示装置
JP3747828B2 (ja) * 2001-09-21 2006-02-22 セイコーエプソン株式会社 電気光学装置及びその製造方法
RU2226293C2 (ru) * 2001-10-02 2004-03-27 ОПТИВА, Инк. Панель дисплея и многослойная пластина для ее изготовления
KR100813019B1 (ko) * 2001-10-19 2008-03-13 삼성전자주식회사 표시기판 및 이를 갖는 액정표시장치
TWI297095B (en) * 2003-10-02 2008-05-21 Au Optronics Corp Bonding pad structure for a display and fabrication method thereof
JP2005183464A (ja) * 2003-12-16 2005-07-07 Nitto Denko Corp 配線回路基板
JP2005309303A (ja) * 2004-04-26 2005-11-04 Seiko Epson Corp 電気光学装置、電気光学装置の製造方法および電子機器
JP4552783B2 (ja) * 2005-07-06 2010-09-29 株式会社デンソー 半導体センサ
JP4343236B2 (ja) * 2007-03-30 2009-10-14 シャープ株式会社 回路基板、および回路基板の形成方法
JP4642888B2 (ja) 2008-09-17 2011-03-02 株式会社ソフイア 遊技機
WO2010064468A1 (ja) * 2008-12-05 2010-06-10 シャープ株式会社 表示装置用基板及び表示装置

Also Published As

Publication number Publication date
EP2360661B1 (en) 2014-01-08
RU2483389C2 (ru) 2013-05-27
CN102203840A (zh) 2011-09-28
JP5043202B2 (ja) 2012-10-10
EP2360661A4 (en) 2013-01-02
WO2010058619A1 (ja) 2010-05-27
US20110205716A1 (en) 2011-08-25
EP2360661A1 (en) 2011-08-24
JPWO2010058619A1 (ja) 2012-04-19
RU2011124958A (ru) 2012-12-27

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2383 DE 06-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.

B350 Update of information on the portal [chapter 15.35 patent gazette]