BRPI1005918A2 - composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivo - Google Patents

composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivo

Info

Publication number
BRPI1005918A2
BRPI1005918A2 BRPI1005918A BRPI1005918A BRPI1005918A2 BR PI1005918 A2 BRPI1005918 A2 BR PI1005918A2 BR PI1005918 A BRPI1005918 A BR PI1005918A BR PI1005918 A BRPI1005918 A BR PI1005918A BR PI1005918 A2 BRPI1005918 A2 BR PI1005918A2
Authority
BR
Brazil
Prior art keywords
composite
resin composition
epoxy resin
curable epoxy
adhesive
Prior art date
Application number
BRPI1005918A
Other languages
English (en)
Inventor
Hunter Gary
Jacob George
Pham Ha
Turakhia Rajesh
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of BRPI1005918A2 publication Critical patent/BRPI1005918A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C08G59/502—Polyalkylene polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
BRPI1005918A 2009-02-24 2010-02-08 composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivo BRPI1005918A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15484609P 2009-02-24 2009-02-24
PCT/US2010/023432 WO2010098966A1 (en) 2009-02-24 2010-02-08 Curable epoxy resin compositions and cured products therefrom

Publications (1)

Publication Number Publication Date
BRPI1005918A2 true BRPI1005918A2 (pt) 2019-09-24

Family

ID=42077305

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1005918A BRPI1005918A2 (pt) 2009-02-24 2010-02-08 composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivo

Country Status (8)

Country Link
US (1) US20120010329A1 (pt)
EP (1) EP2401314A1 (pt)
JP (1) JP2012518707A (pt)
KR (1) KR20110131222A (pt)
CN (1) CN102325821A (pt)
BR (1) BRPI1005918A2 (pt)
CA (1) CA2750703A1 (pt)
WO (1) WO2010098966A1 (pt)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2945292B1 (fr) * 2009-05-06 2011-05-27 Electricite De France Reseau interpenetre de polymeres echangeur d'anions, son procede de fabrication et son utilisation
WO2012082224A1 (en) * 2010-12-17 2012-06-21 Dow Global Technologies Llc Curable compositions
CN102558769B (zh) * 2010-12-31 2015-11-25 第一毛织株式会社 用于封装半导体器件的环氧树脂组合物以及由该环氧树脂组合物封装的半导体器件
US20120328811A1 (en) * 2011-06-24 2012-12-27 Air Products And Chemicals, Inc. Epoxy Resin Compositions
US8431444B2 (en) * 2011-08-16 2013-04-30 General Electric Company Epoxy encapsulating and lamination adhesive and method of making same
GB201122296D0 (en) 2011-12-23 2012-02-01 Cytec Tech Corp Composite materials
GB201203341D0 (en) 2012-02-27 2012-04-11 Cytec Technology Group Curable resin composition and short-cure method
CN104812878A (zh) * 2012-10-12 2015-07-29 巴斯夫欧洲公司 包含环硼氧烷以改进含氟聚合物密封件相容性的润滑剂组合物
CN104837887B (zh) * 2012-12-11 2019-01-29 费希尔厂有限责任两合公司 用于固定目的的基于环氧的物料、其用途和特定组分的用途
WO2014151337A1 (en) 2013-03-15 2014-09-25 Plasma Systems Holdings, Inc. Multi-function epoxy casting resin system
CA2865110C (en) * 2013-12-16 2021-11-09 The Boeing Company Composite structures using interpenetrating polymer network adhesives
EP3227363B1 (en) * 2014-11-03 2020-10-07 Cytec Industries Inc. Bonding of composite materials
US9752051B2 (en) 2015-04-06 2017-09-05 Rohm And Haas Electronic Materials Llc Polyarylene polymers
CN107743503B (zh) * 2015-06-25 2020-03-31 陶氏环球技术有限责任公司 用于制造碳纤维复合材料的新型环氧树脂体系
CN106810820B (zh) * 2015-12-02 2020-07-28 广东生益科技股份有限公司 一种热固性烷基多元醇缩水甘油醚树脂组合物及其应用
ES2779882T3 (es) * 2016-01-26 2020-08-20 Toray Industries Composición de resina epoxi, material de composite preimpregnado y reforzado con fibra
JP6829462B2 (ja) * 2017-02-21 2021-02-10 ナミックス株式会社 液状エポキシ樹脂封止材
US11149108B1 (en) 2018-06-26 2021-10-19 National Technology & Engineering Solutions Of Sandia, Llc Self-assembly assisted additive manufacturing of thermosets
JP2021003714A (ja) * 2019-06-26 2021-01-14 国立大学法人 東京大学 線形摩擦接合方法
CN110256991B (zh) * 2019-07-12 2021-07-13 中铁第一勘察设计院集团有限公司 一种混凝土装配式桥梁专用胶及其制备方法
TWI853447B (zh) * 2022-03-18 2024-08-21 日商日本發條股份有限公司 層間絕緣用環氧樹脂組成物、層間絕緣用樹脂片、電路基板用積層體、金屬基底電路基板及電力模組
CN115873546B (zh) * 2022-09-23 2025-02-28 长沙新德航化工有限公司 一种低粘度带水堵漏用的快速固化的环氧注浆液及其制备方法
CN115926115A (zh) * 2022-12-19 2023-04-07 湖南肆玖科技有限公司 改性环氧树脂固化剂、制备方法及其使用方法
CN116162441B (zh) * 2023-03-29 2023-09-19 广州宝捷电子材料科技有限公司 一种复合改性环氧树脂胶粘剂及其制备方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3018262A (en) 1957-05-01 1962-01-23 Shell Oil Co Curing polyepoxides with certain metal salts of inorganic acids
CA1221192A (en) * 1982-08-12 1987-04-28 Andrew Garton Epoxy resin fortification
US5260355A (en) * 1987-07-02 1993-11-09 The Dow Chemical Company Aqueous dispersion of cationic advanced diglycidyl ether blend
US4925901A (en) 1988-02-12 1990-05-15 The Dow Chemical Company Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds
GB8904862D0 (en) * 1989-03-03 1989-04-12 Ciba Geigy Ag Compositions
US5262507A (en) 1990-09-11 1993-11-16 Dow Corning Corporation High modulus silicones as toughening agents for epoxy resins
US5135993A (en) 1990-09-11 1992-08-04 Dow Corning Corporation High modulus silicones as toughening agents for epoxy resins
CA2086770A1 (en) * 1992-01-10 1993-07-11 Jyi-Faa Hwang Epoxy interpenetrating polymer networks having internetwork bonds
GB9411367D0 (en) 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
JPH08165333A (ja) * 1994-12-14 1996-06-25 Sumitomo Bakelite Co Ltd プリプレグの製造方法
EP0723982B1 (de) * 1995-01-26 1999-06-16 Ciba SC Holding AG Härtbares Epoxidharzgemisch
US5688905A (en) * 1995-09-20 1997-11-18 Air Products And Chemicals, Inc. Primary-tertiary diamines mixed with polyamines as epoxy resin hardeners
US6153719A (en) 1998-02-04 2000-11-28 Lord Corporation Thiol-cured epoxy composition
US6248204B1 (en) * 1999-05-14 2001-06-19 Loctite Corporation Two part, reinforced, room temperature curable thermosetting epoxy resin compositions with improved adhesive strength and fracture toughness
US6632893B2 (en) 1999-05-28 2003-10-14 Henkel Loctite Corporation Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
JP2001151862A (ja) * 1999-11-22 2001-06-05 Tosoh Corp エポキシ樹脂組成物
US6572971B2 (en) * 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
US6632860B1 (en) 2001-08-24 2003-10-14 Texas Research International, Inc. Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener
GB0212062D0 (en) 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
US7163973B2 (en) 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
JP3778507B2 (ja) * 2002-11-28 2006-05-24 横浜ゴム株式会社 硬化剤組成物およびそれを含有した硬化性樹脂組成物
US7087304B1 (en) 2003-02-19 2006-08-08 Henkel Corporation Polysulfide-based toughening agents, compositions containing same and methods for the use thereof
US6887574B2 (en) 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
JP4874650B2 (ja) * 2003-08-25 2012-02-15 株式会社カネカ 耐熱性の改善された硬化性組成物
FR2862655B1 (fr) * 2003-11-25 2007-01-05 Arkema Fibre organique a base de resine epoxy et d'agent regulateur de rheologie et tissus correspondants
JP2007530771A (ja) 2004-04-02 2007-11-01 ダウ グローバル テクノロジーズ インコーポレイティド 両親媒性ブロックコポリマー強化熱硬化樹脂
JP4679117B2 (ja) * 2004-11-08 2011-04-27 株式会社東芝 防水用樹脂組成物及びそれを用いた防水金属製品
CN101864261B (zh) 2004-11-10 2012-09-05 陶氏环球技术有限责任公司 两性嵌段共聚物改性的环氧树脂以及由此制造的粘合剂
DE602005018680D1 (de) 2004-11-10 2010-02-11 Dow Global Technologies Inc Mit amphiphilem blockcopolymer schlagzäh modifizierte epoxidharze und daraus hergestellte elektrische laminate
DE602005019190D1 (de) 2004-11-10 2010-03-18 Dow Global Technologies Inc Mit amphiphilem blockcoplymer gehärtete epoxidharze und daraus hergestellte, bei umgebungstemperatur ausgehärtete hochfeste beschichtungen
ES2338680T3 (es) 2004-11-10 2010-05-11 Dow Global Technologies Inc. Resinas epoxidicas endurecidas con copolimeros anfifilicos de bloques y recubrimientos en polvo obtenidos a partir de ellas.
EP1814947B1 (en) 2004-11-10 2009-12-30 Dow Global Technologies Inc. Amphiphilic block copolymer-toughened epoxy resins
US8048819B2 (en) 2005-06-23 2011-11-01 Momentive Performance Materials Inc. Cure catalyst, composition, electronic device and associated method
ES2335531T3 (es) * 2005-07-15 2010-03-29 Huntsman Advanced Materials (Switzerland) Gmbh Composicion de tenacidad a la fractura aumentada.
US7737199B2 (en) * 2007-02-15 2010-06-15 Ashland Licensing & Intellectual Property Llc Two-component adhesive of epoxy resin/polyol pack and polyamide/aliphatic amine/tertiary amine pack
JP2009234852A (ja) * 2008-03-27 2009-10-15 Toray Ind Inc セラミックス成形体の製造方法及びセラミックス焼結体の製造方法

Also Published As

Publication number Publication date
CA2750703A1 (en) 2010-09-02
KR20110131222A (ko) 2011-12-06
WO2010098966A1 (en) 2010-09-02
US20120010329A1 (en) 2012-01-12
CN102325821A (zh) 2012-01-18
EP2401314A1 (en) 2012-01-04
JP2012518707A (ja) 2012-08-16

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2543 DE 01-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.