BRPI0905387A2 - Composição curável, resina termofixa enrijecida, compósito, processo para formar uma composição curável e processo para formar uma resina termofixa - Google Patents
Composição curável, resina termofixa enrijecida, compósito, processo para formar uma composição curável e processo para formar uma resina termofixaInfo
- Publication number
- BRPI0905387A2 BRPI0905387A2 BRPI0905387-5A BRPI0905387A BRPI0905387A2 BR PI0905387 A2 BRPI0905387 A2 BR PI0905387A2 BR PI0905387 A BRPI0905387 A BR PI0905387A BR PI0905387 A2 BRPI0905387 A2 BR PI0905387A2
- Authority
- BR
- Brazil
- Prior art keywords
- forming
- curable composition
- thermoset resin
- stiffened
- composite
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title 2
- 239000004634 thermosetting polymer Substances 0.000 title 2
- 239000002131 composite material Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5093—Complexes of amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1978808P | 2008-01-08 | 2008-01-08 | |
| US61/019,788 | 2008-01-08 | ||
| PCT/US2009/030096 WO2009089145A1 (en) | 2008-01-08 | 2009-01-05 | High tg epoxy systems for composite application |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BRPI0905387A2 true BRPI0905387A2 (pt) | 2015-06-30 |
| BRPI0905387B1 BRPI0905387B1 (pt) | 2019-08-06 |
Family
ID=40342384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0905387-5A BRPI0905387B1 (pt) | 2008-01-08 | 2009-01-05 | Composição curável e resina termofixa enrijecida |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8742018B2 (pt) |
| EP (1) | EP2229416B1 (pt) |
| JP (1) | JP2011509339A (pt) |
| KR (1) | KR101571184B1 (pt) |
| CN (1) | CN101910238B (pt) |
| BR (1) | BRPI0905387B1 (pt) |
| TW (1) | TW200936683A (pt) |
| WO (1) | WO2009089145A1 (pt) |
Families Citing this family (73)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009089145A1 (en) * | 2008-01-08 | 2009-07-16 | Dow Global Technologies Inc. | High tg epoxy systems for composite application |
| US20090197003A1 (en) * | 2008-02-01 | 2009-08-06 | Thomas Van Zandt | Anti-fouling coatings, Compounds, and methods |
| JP5136573B2 (ja) * | 2009-02-24 | 2013-02-06 | 日立化成工業株式会社 | ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板 |
| US9169386B2 (en) * | 2009-10-27 | 2015-10-27 | Eco Green Resins, Llc | Organic vegetable oil based resin and preparation method thereof |
| CA2723359C (en) | 2009-12-22 | 2015-03-17 | Dow Global Technologies, Inc. | Diamino-alcohol compounds, their manufacture and use in epoxy resins |
| US20120301714A1 (en) * | 2010-01-27 | 2012-11-29 | Dow Global Technologies Llc | Multilayer structure, and a method for making the same |
| WO2011091585A1 (en) * | 2010-01-27 | 2011-08-04 | Dow Global Technologies Inc. | A multilayer structure, and a method for making the same |
| WO2015070018A1 (en) * | 2013-11-07 | 2015-05-14 | Ndsu Research Foundation | Bio-based resins with high content of ethylenically unsaturated functional groups and thermosets thereof |
| ES2642061T3 (es) * | 2010-04-16 | 2017-11-15 | Valspar Sourcing, Inc. | Composiciones de recubrimiento para artículos de envasado y métodos de recubrimiento |
| CN102101935B (zh) * | 2010-12-23 | 2012-06-27 | 广东生益科技股份有限公司 | 无卤环氧树脂组合物以及使用其制备的挠性覆铜板 |
| JP5733301B2 (ja) * | 2011-01-27 | 2015-06-10 | 東レ株式会社 | 繊維強化複合材料rtm成形用エポキシ樹脂組成物、繊維強化複合材料およびその製造方法 |
| WO2012109278A2 (en) | 2011-02-07 | 2012-08-16 | Valspar Sourcing, Inc. | Coating compositions for containers and other articles and methods of coating |
| US9309381B2 (en) | 2011-06-24 | 2016-04-12 | Air Products And Chemicals, Inc. | Epoxy resin compositions using solvated solids |
| US9651189B2 (en) * | 2011-07-08 | 2017-05-16 | Blue Cube Ip Llc | Cured-in place pipe rehabilitation process |
| US9321881B2 (en) | 2011-08-12 | 2016-04-26 | Air Products And Chemicals, Inc. | Liquid methylenedianiline compositions |
| WO2013053100A1 (en) * | 2011-10-11 | 2013-04-18 | Henkel China Co. Ltd. | Gel time controllable two part epoxy adhesive |
| JP2014532800A (ja) * | 2011-11-10 | 2014-12-08 | ダウ グローバル テクノロジーズ エルエルシー | エポキシ硬化用途の潜在性触媒としてのカルボン酸アンモニウム基を有するポリマー |
| CN103421273B (zh) * | 2012-05-22 | 2016-02-10 | 中山台光电子材料有限公司 | 无卤素树脂组成物 |
| AU2013299578A1 (en) | 2012-08-09 | 2015-02-19 | Valspar Sourcing, Inc. | Compositions for containers and other articles and methods of using same |
| US20150232620A1 (en) * | 2012-10-15 | 2015-08-20 | Daicel Corporation | Curable resin composition, and cured product thereof |
| BR112015008431A2 (pt) * | 2012-10-19 | 2017-07-04 | Dow Global Technologies Llc | composição de resina curável, processo para preparar uma composição de resina curável, composição de resina curada e artigo |
| CN103881059A (zh) * | 2012-12-21 | 2014-06-25 | 台光电子材料(昆山)有限公司 | 低介电树脂组合物及其应用 |
| US9080007B2 (en) | 2013-02-28 | 2015-07-14 | Air Products And Chemicals, Inc. | Anhydride accelerators for epoxy resin systems |
| US20150368457A1 (en) * | 2013-03-15 | 2015-12-24 | Blue Cube Llc | Toughened epoxy thermosets containing core shell rubbers and polyols |
| EP2981565B1 (en) | 2013-04-05 | 2017-10-04 | Evonik Degussa GmbH | One component epoxy curing agents comprising hydroxyalkylamino cycloalkanes |
| US9546243B2 (en) | 2013-07-17 | 2017-01-17 | Air Products And Chemicals, Inc. | Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions |
| JP2015086249A (ja) * | 2013-10-28 | 2015-05-07 | スリーボンドファインケミカル株式会社 | マイクロカプセル型硬化性樹脂組成物 |
| EP3080170B1 (en) | 2013-12-13 | 2020-02-05 | Transfert Plus, S.E.C. | Insertion polynorbornene-based thermoset resins |
| KR102171397B1 (ko) | 2013-12-30 | 2020-10-29 | 엘지디스플레이 주식회사 | 터치장치의 제조방법 및 그 수지 조성물 |
| CN103724809B (zh) * | 2013-12-31 | 2016-07-06 | 张锦碧 | 一种环氧树脂助剂制备方法 |
| MX358938B (es) | 2014-01-21 | 2018-09-10 | Centro De Investig En Polimeros S A De C V | Una resina cicloalifática, su método de obtención y su aplicación en un recubrimiento de alta resistencia. |
| JP6746501B2 (ja) | 2014-04-14 | 2020-08-26 | ヴァルスパー・ソーシング・インコーポレーテッド | 容器及び他の物品のための組成物の調製方法並びにその使用方法 |
| FR3020368B1 (fr) * | 2014-04-24 | 2017-10-27 | Arkema France | Composition pour la fabrication de resines vitrimeres de type epoxy/anhyride comprenant un polyol |
| ES2964342T3 (es) * | 2014-05-14 | 2024-04-05 | Huntsman Advanced Mat Americas Llc | Poliamidas multifuncionales para recubrimientos protectores |
| BR112017000219A2 (pt) | 2014-07-08 | 2018-01-16 | Dow Global Technologies Llc | adesivo durável à falha de alta tg de cura retardada |
| US10081704B2 (en) | 2015-03-24 | 2018-09-25 | Evonik Degussa Gmbh | Epoxy systems having improved fracture toughness |
| EP3101063A1 (de) | 2015-05-31 | 2016-12-07 | Karim El Kudsi | Innenbeschichtungen von trinkwasserrohren auf epoxydbasis und ein verfahren zu ihrer herstellung |
| DE102016006694B4 (de) | 2015-05-31 | 2018-07-12 | Karim El Kudsi | Innenbeschichtungen von Trinkwasserrohren auf Epoxydharzbasis |
| TWI614275B (zh) | 2015-11-03 | 2018-02-11 | Valspar Sourcing Inc | 用於製備聚合物的液體環氧樹脂組合物 |
| KR101638574B1 (ko) * | 2015-12-15 | 2016-07-11 | 도레이첨단소재 주식회사 | 저점도 액상 에폭시 수지 조성물 및 이로부터 제조되는 압력용기 |
| TWI557177B (zh) | 2015-12-16 | 2016-11-11 | 財團法人工業技術研究院 | 低介電無溶劑型樹脂組成物及基板結構 |
| CN106009529A (zh) * | 2016-06-23 | 2016-10-12 | 安徽酷米智能科技有限公司 | 一种耐热易含浸线路板用改性环氧树脂 |
| CN106117973A (zh) * | 2016-06-23 | 2016-11-16 | 安徽酷米智能科技有限公司 | 一种线路板用环氧树脂组合物 |
| JP2019524967A (ja) | 2016-08-15 | 2019-09-05 | エボニック デグサ ゲーエムベーハーEvonik Degussa GmbH | エポキシ樹脂系用のイミダゾール塩添加剤を含有する酸無水物エポキシ硬化剤 |
| US9902801B1 (en) | 2016-10-17 | 2018-02-27 | Warren Environmental, Inc. | Delayed curing resin composition |
| ES2942268T3 (es) * | 2016-10-17 | 2023-05-31 | Warren Env & Coating Llc | Método de revestimiento de una tubería con una composición de resina de curado retardado |
| CA3037132C (en) * | 2016-10-17 | 2021-08-10 | Danny Warren | Delayed curing resin composition |
| JP2018080304A (ja) * | 2016-11-18 | 2018-05-24 | 旭化成株式会社 | 熱硬化性エポキシ樹脂組成物、繊維強化熱硬化性エポキシ樹脂組成物、及び硬化物 |
| US11286336B2 (en) | 2016-12-12 | 2022-03-29 | Evonik Operations Gmbh | Low temperature anhydride epoxy cured systems |
| KR102395468B1 (ko) | 2016-12-21 | 2022-05-09 | 에보니크 오퍼레이션즈 게엠베하 | N-히드록실 에틸 피페리딘 (nhep): 에폭시 시스템을 위한 신규 경화제 |
| EP3339391B1 (en) | 2016-12-23 | 2020-02-05 | Evonik Operations GmbH | Apcha as a building block in curing agent formulations for structural adhesives |
| CN110740997A (zh) | 2017-06-09 | 2020-01-31 | 瀚森公司 | 用于复合材料的环氧树脂体系 |
| EP3694902B1 (en) * | 2017-10-09 | 2026-03-18 | Cytec Industries Inc. | Curable resin composition and fiber reinforced resin matrix composite material |
| KR102702734B1 (ko) | 2018-03-05 | 2024-09-05 | 에보니크 오퍼레이션즈 게엠베하 | 에폭시 배합물을 위한 시클로지방족 아민: 에폭시 시스템을 위한 신규 경화제 |
| EP3898097A1 (en) * | 2018-12-18 | 2021-10-27 | 3M Innovative Properties Company | Rapid curing bonded abrasive article precursor |
| US11472913B2 (en) | 2019-01-11 | 2022-10-18 | Evonik Operations Gmbh | Mono-alkylated diamines for epoxy formulations: novel curing agents for epoxy systems |
| DE102019209346A1 (de) * | 2019-06-27 | 2020-12-31 | Siemens Aktiengesellschaft | Imprägnierformulierung, Isolationsmaterial, Verfahren zum Herstellen eines Isolationsmaterials und elektrische Maschine mit einem Isolationsmaterial |
| EP3825341A1 (de) * | 2019-11-22 | 2021-05-26 | Henkel AG & Co. KGaA | Matrixharz für laminate mit hoher transparenz, geringer vergilbung und hohen glasübergangstemperaturen |
| US11970575B2 (en) | 2020-10-05 | 2024-04-30 | Alliance For Sustainable Energy, Llc | Bioderived recyclable epoxy-anhydride thermosetting polymers and resins |
| BR112023017181A2 (pt) | 2021-02-25 | 2023-09-26 | Huntsman Adv Mat Licensing Switzerland Gmbh | Composição polimerizável monocomponente para impregnação por gotejamento |
| US12049557B2 (en) * | 2021-07-07 | 2024-07-30 | CNPC USA Corp. | Bi-continuos epoxy microstructure for fabrication of degradable thermoset composite used in HTHP downhole conditions |
| JP2024543947A (ja) | 2021-11-30 | 2024-11-26 | モメンティブ パフォーマンス マテリアルズ ゲーエムベーハー | 硬化性エポキシ樹脂組成物 |
| CN114633389A (zh) * | 2022-03-29 | 2022-06-17 | 上海喆航航空科技有限公司 | 一种制备双组分混合物的方法及应用 |
| US12202932B2 (en) * | 2022-04-07 | 2025-01-21 | Cnpc Usa Corporation | Formulation and processing of degradable high Tg epoxy composite that can be degradable at extremely low temperature |
| CN115058099B (zh) * | 2022-08-18 | 2022-11-11 | 北京玻钢院复合材料有限公司 | 一种具有两相海岛结构的环氧树脂组合物、复合材料及其制备方法 |
| US20240327567A1 (en) | 2023-03-31 | 2024-10-03 | Evonik Operations Gmbh | Low Temperature Curable One Component Epoxy Compositions containing Resin-Blocked Urea Curatives |
| US20240327615A1 (en) | 2023-03-31 | 2024-10-03 | Evonik Operations Gmbh | Solutions of amines in polymeric phenols in combination with other resins |
| US20240327610A1 (en) | 2023-03-31 | 2024-10-03 | Evonik Operations Gmbh | Solutions of amines in functional and non-functional resins |
| CN118834371A (zh) * | 2023-04-25 | 2024-10-25 | 中国石油天然气集团有限公司 | 一种高Tg值可降解的热固性复合材料及其制备的可降解井下封堵工具 |
| CN116836663B (zh) * | 2023-08-14 | 2026-06-12 | 韦尔通科技股份有限公司 | 一种高耐热高粘接的单组分环氧胶黏剂及其制备方法和应用 |
| GB202412535D0 (en) | 2024-08-27 | 2024-10-09 | Fergussons Advanced Composite Tech Limited | Improvements relating to epoxy resin compositions |
| WO2026085810A1 (en) | 2024-10-24 | 2026-04-30 | Evonik Operations Gmbh | A latent curing accelerator composition containing isocyanate blocked tertiary amine |
| GB202418625D0 (en) | 2024-12-18 | 2025-01-29 | Hexcel Composites Ltd | Improvements in resin compositions |
Family Cites Families (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1187700B (de) | 1962-03-28 | 1965-02-25 | Ciba Geigy | Verwendung eines Kunststoffmaterials fuer witterungsbestaendige elektrische Freiluftisolatoren |
| DE2642465C3 (de) * | 1976-09-21 | 1981-01-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung einer VerguBmasse |
| JPS53144958A (en) | 1977-05-24 | 1978-12-16 | Toshiba Corp | Epoxy resin composition |
| US4532299A (en) * | 1982-01-12 | 1985-07-30 | Ameron, Inc. | Flexibilized chemically resistant epoxy resin |
| JPS596442A (ja) | 1982-06-30 | 1984-01-13 | Toyota Motor Corp | 自動車用frp製板ばね |
| US4665111A (en) * | 1984-10-12 | 1987-05-12 | Siemens Aktiengesellschaft | Casting compound for electrical and electronic components and modules |
| JPH0627182B2 (ja) | 1987-08-31 | 1994-04-13 | ソマール株式会社 | 含浸に好適な液状エポキシ樹脂組成物 |
| US5066735A (en) * | 1987-11-16 | 1991-11-19 | The Dow Chemical Company | Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol |
| CN1040810A (zh) * | 1988-04-30 | 1990-03-28 | 三井东圧化学株式会社 | 多硫化合物基树脂透镜及其制备方法 |
| JPH02169620A (ja) | 1988-12-22 | 1990-06-29 | Mitsui Petrochem Ind Ltd | 硬化用エポキシ樹脂組成物、ならびに、この組成物からなる透明樹脂板、半導体装置用透明窓材および液晶パネル用透明基板 |
| US4981941A (en) * | 1989-03-27 | 1991-01-01 | The United States Of America As Represented By The Secretary Of The Navy | Fluorinated epoxy resins with high glass transition temperatures |
| DE3913488C2 (de) | 1989-04-25 | 1994-02-03 | Bosch Gmbh Robert | Vergußmasse für elektrische und elektronische Bauteile |
| US5189080A (en) * | 1989-04-25 | 1993-02-23 | Robert Bosch Gmbh | Epoxy resin composition for encapsulating electric circuit components |
| GB8912952D0 (en) * | 1989-06-06 | 1989-07-26 | Dow Rheinmuenster | Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones |
| US5789482A (en) * | 1990-03-30 | 1998-08-04 | Ciba Specialty Chemicals Corporation | Epoxy resin with anhydride, toughener and active hydrogen-containing compound |
| US5262507A (en) * | 1990-09-11 | 1993-11-16 | Dow Corning Corporation | High modulus silicones as toughening agents for epoxy resins |
| JP2728106B2 (ja) * | 1991-09-05 | 1998-03-18 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 電子パッケージングにおける除去可能なデバイス保護のための開裂性ジエポキシド |
| US6329475B1 (en) * | 1992-08-12 | 2001-12-11 | The Dow Chemical Company | Curable epoxy vinylester composition having a low peak exotherm during cure |
| US5385990A (en) * | 1992-11-02 | 1995-01-31 | Lord Corporation | Structural adhesive composition having high temperature resistance |
| DE4342721A1 (de) * | 1993-12-15 | 1995-06-22 | Hoechst Ag | Elastisches Epoxidharz-Härter-System |
| DE4342722A1 (de) * | 1993-12-15 | 1995-06-22 | Hoechst Ag | Elastisches Epoxidharz-Härter-System |
| DE4410785A1 (de) * | 1994-03-28 | 1995-10-05 | Hoechst Ag | Amin-modifizierte Epoxidharz-Zusammensetzung |
| GB9411367D0 (en) * | 1994-06-07 | 1994-07-27 | Ici Composites Inc | Curable Composites |
| US5962586A (en) * | 1994-09-27 | 1999-10-05 | Harper; John D. | Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct |
| US5629379A (en) * | 1994-09-27 | 1997-05-13 | Harper; John D. | Anhydride-hardened epoxy resin with polybutadiene-maleic anhydride adduct |
| US5646315A (en) * | 1995-06-07 | 1997-07-08 | National Starch And Chemical Investment Holding Corporation | Polyglydicylphenyl ethers of alkyloxy chains for use in microelectronics adhesives |
| BR9510656A (pt) * | 1995-10-23 | 1999-01-05 | Polyol Int Bv | Composição de poliol polimérico processo para a fabricação de uma composição de poliol polimérico composição para a preparação de uma espuma de poliuretano e espuma de poliuretano |
| JPH09137041A (ja) | 1995-11-16 | 1997-05-27 | Hitachi Ltd | 含浸用樹脂組成物およびそれを用いた電気絶縁線輪 |
| US5932682A (en) * | 1995-12-19 | 1999-08-03 | International Business Machines Corporation | Cleavable diepoxide for removable epoxy compositions |
| US6245835B1 (en) * | 1996-02-29 | 2001-06-12 | The Dow Chemical Company | Polymeric amines and reactive epoxy polymer compositions |
| US5741847A (en) * | 1996-05-23 | 1998-04-21 | The Dow Chemical Company | Polymer polyols containing halogenated aromatic monomers and polyurethane foam made therefrom |
| US6613839B1 (en) * | 1997-01-21 | 2003-09-02 | The Dow Chemical Company | Polyepoxide, catalyst/cure inhibitor complex and anhydride |
| EP0906927B1 (en) | 1997-10-02 | 2000-12-20 | Hexcel Corporation | Epoxy resin curing agents |
| JPH11140277A (ja) | 1997-11-10 | 1999-05-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及びこれを用いた半導体装置 |
| US6153719A (en) * | 1998-02-04 | 2000-11-28 | Lord Corporation | Thiol-cured epoxy composition |
| WO1999055794A1 (en) * | 1998-04-27 | 1999-11-04 | The Dow Chemical Company | Cure on demand adhesives and window module with cure on demand adhesive thereon |
| US6455603B1 (en) * | 1998-06-30 | 2002-09-24 | Dow Global Technologies Inc. | Polymer polyols and a process for the production thereof |
| US6057402A (en) * | 1998-08-12 | 2000-05-02 | Johnson Matthey, Inc. | Long and short-chain cycloaliphatic epoxy resins with cyanate ester |
| US7679534B2 (en) * | 1998-12-04 | 2010-03-16 | Tegic Communications, Inc. | Contextual prediction of user words and user actions |
| GB9827367D0 (en) * | 1998-12-11 | 1999-02-03 | Dow Deutschland Inc | Adhesive resin composition |
| US6632893B2 (en) * | 1999-05-28 | 2003-10-14 | Henkel Loctite Corporation | Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners |
| US6462108B1 (en) * | 2000-07-20 | 2002-10-08 | National Starch And Chemical Investment Holding Corporation | High Tg potting compound |
| US6572971B2 (en) * | 2001-02-26 | 2003-06-03 | Ashland Chemical | Structural modified epoxy adhesive compositions |
| US6632860B1 (en) * | 2001-08-24 | 2003-10-14 | Texas Research International, Inc. | Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener |
| GB0212062D0 (en) * | 2002-05-24 | 2002-07-03 | Vantico Ag | Jetable compositions |
| US7163973B2 (en) * | 2002-08-08 | 2007-01-16 | Henkel Corporation | Composition of bulk filler and epoxy-clay nanocomposite |
| US7087304B1 (en) * | 2003-02-19 | 2006-08-08 | Henkel Corporation | Polysulfide-based toughening agents, compositions containing same and methods for the use thereof |
| CN1239587C (zh) * | 2003-04-03 | 2006-02-01 | 中国石油化工股份有限公司 | 一种复合粉末及其制备方法和用途 |
| US6887574B2 (en) * | 2003-06-06 | 2005-05-03 | Dow Global Technologies Inc. | Curable flame retardant epoxy compositions |
| JP2007530771A (ja) | 2004-04-02 | 2007-11-01 | ダウ グローバル テクノロジーズ インコーポレイティド | 両親媒性ブロックコポリマー強化熱硬化樹脂 |
| DE602005018680D1 (de) | 2004-11-10 | 2010-02-11 | Dow Global Technologies Inc | Mit amphiphilem blockcopolymer schlagzäh modifizierte epoxidharze und daraus hergestellte elektrische laminate |
| DE602005019190D1 (de) | 2004-11-10 | 2010-03-18 | Dow Global Technologies Inc | Mit amphiphilem blockcoplymer gehärtete epoxidharze und daraus hergestellte, bei umgebungstemperatur ausgehärtete hochfeste beschichtungen |
| CN101864261B (zh) | 2004-11-10 | 2012-09-05 | 陶氏环球技术有限责任公司 | 两性嵌段共聚物改性的环氧树脂以及由此制造的粘合剂 |
| EP1814947B1 (en) | 2004-11-10 | 2009-12-30 | Dow Global Technologies Inc. | Amphiphilic block copolymer-toughened epoxy resins |
| US20060205856A1 (en) * | 2004-12-22 | 2006-09-14 | Williamson David T | Compositions of polyesters and sepiolite-type clays |
| US8048819B2 (en) * | 2005-06-23 | 2011-11-01 | Momentive Performance Materials Inc. | Cure catalyst, composition, electronic device and associated method |
| WO2007142140A1 (ja) * | 2006-06-06 | 2007-12-13 | Hitachi Chemical Company, Ltd. | 酸性置換基と不飽和マレイミド基を有する硬化剤の製造法並びに熱硬化性樹脂組成物、プリプレグ及び積層板 |
| WO2009089145A1 (en) * | 2008-01-08 | 2009-07-16 | Dow Global Technologies Inc. | High tg epoxy systems for composite application |
| JP5638812B2 (ja) * | 2010-02-01 | 2014-12-10 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物 |
-
2009
- 2009-01-05 WO PCT/US2009/030096 patent/WO2009089145A1/en not_active Ceased
- 2009-01-05 KR KR1020107017618A patent/KR101571184B1/ko not_active Expired - Fee Related
- 2009-01-05 US US12/811,230 patent/US8742018B2/en not_active Expired - Fee Related
- 2009-01-05 EP EP09700380.0A patent/EP2229416B1/en not_active Not-in-force
- 2009-01-05 JP JP2010542302A patent/JP2011509339A/ja active Pending
- 2009-01-05 CN CN200980101800XA patent/CN101910238B/zh active Active
- 2009-01-05 BR BRPI0905387-5A patent/BRPI0905387B1/pt not_active IP Right Cessation
- 2009-01-07 TW TW098100350A patent/TW200936683A/zh unknown
-
2014
- 2014-04-29 US US14/264,105 patent/US9315664B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101910238B (zh) | 2013-03-27 |
| KR20100113555A (ko) | 2010-10-21 |
| KR101571184B1 (ko) | 2015-11-23 |
| US20100292415A1 (en) | 2010-11-18 |
| US8742018B2 (en) | 2014-06-03 |
| JP2011509339A (ja) | 2011-03-24 |
| US9315664B2 (en) | 2016-04-19 |
| US20140235792A1 (en) | 2014-08-21 |
| TW200936683A (en) | 2009-09-01 |
| CN101910238A (zh) | 2010-12-08 |
| EP2229416B1 (en) | 2018-04-04 |
| BRPI0905387B1 (pt) | 2019-08-06 |
| EP2229416A1 (en) | 2010-09-22 |
| WO2009089145A1 (en) | 2009-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| BR112012006241A2 (pt) | composição de compósito de resina epóxi curável, processo para produzir um produto curado, produto de compósito curado e processo para produzir uma composição de resina epóxi curável | |
| BRPI1005918A2 (pt) | composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivo | |
| BRPI0907273A2 (pt) | Composição curável baseada em epóxi, processo para formar uma composição curável baseada em epóxi, resina termofixa e peça baseada em epóxi | |
| BRPI0810290A2 (pt) | "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito." | |
| FI20095893A7 (fi) | Kovetettava koostumus, kovetettu tuote ja laminaatti | |
| BRPI0924000A2 (pt) | composição termofixavel, produto termofixo, processo para preparar uma composição termofixavel e produto termofixo curado | |
| BRPI0923216A2 (pt) | composição de resina, artigo moldado, e, processo para produzir uma composição de resina. | |
| BRPI0813201A2 (pt) | "composição curável, compósito e método para formar um compósito" | |
| BRPI0905080A2 (pt) | Composições, processo para reparar uma composição e produto | |
| BR112013006989A2 (pt) | composição de resina epóxi polifuncional reepoxidada, processo para preparar uma composição de resina epóxi polifuncional reepoxidada, composição de resina epóxi curável, produto termofixo, processo para preparar uma composição e artigo | |
| BR112013005646A2 (pt) | composição de resina de poliéster epóxi, composição de resina de poliéster epóxi(éster epóxi) curável, resina curada, e processo para preparar composição de resina de poliéster epóxi(éster epóxi) curável | |
| BR112012033390A2 (pt) | composição curável por uv, processo para preparar uma composição de resina de dióxido de divinilareno curável e produto curado | |
| BRPI0907275A2 (pt) | Processo para formar um catalisador de epóxi-imidazol sólido, catalisador de epóxi-imidazol sólido, composição curável, processo para formar uma composição curável e processo para formar uma composição termofixa | |
| BR112012010870A2 (pt) | composição de resina de oxazolidona com funcionalidade epóxi,composição de resina epóxi curável ,processo para reparar uma composição de resina de oxazolodona com funcionalidadde epóxi,processo para preparar uma composição de resina epóxi curável e produto termofixo curado | |
| EP2341106A4 (en) | CURABLE COMPOSITION AND CURED PRODUCT OBTAINED THEREFROM | |
| BR112014010528A2 (pt) | composição de resina de expóxi curável, e, métodos para curar um sistema de resina de expóxi e para fabricar uma estrutura de compósito | |
| EP2253666A4 (en) | HARDENABLE RESIN COMPOSITION AND CURED RESIN | |
| BRPI0912384A2 (pt) | composição, e, método para preparar uma composição | |
| BR112012032981A2 (pt) | composição de resina epóxi curável livre de diluente para preparar um compósito, processo para preparar uma composição ou sistema de resina curável, livre de diluente, produto compósito curado e processo para preparar produto compósito curado | |
| BR112013001848A2 (pt) | estrutura compósita, processo para produzir uma estrutura compósita, estrutura compósita sobremoldada e processo para produzir uma estrutura compósita sobremoldada | |
| BRPI1008127A2 (pt) | "composição e processo para a preparação de uma espuma termoplástica ou termofixa" | |
| BRPI1015276A2 (pt) | composição de resina curável, composição adesiva, objeto curado ou compósito | |
| BR112014003754A2 (pt) | composição de resina epóxil curável e processo | |
| BR112012029587A2 (pt) | composição de resina epóxi contendo dióxido de divinilareno curável, processo para preparar uma composição de resina epóxi contendo dióxido de divinilareno curável, processo para preparar um termofixo curado e produto termofixo curado | |
| BR112013001851A2 (pt) | estrutura compósita, processo para a produção de uma estrutura compósita, estrutura compósita sobremoldada e processo para a produção de uma estrutura compósita sobremoldada |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
| B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
| B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 06/08/2019, OBSERVADAS AS CONDICOES LEGAIS. (CO) 10 (DEZ) ANOS CONTADOS A PARTIR DE 06/08/2019, OBSERVADAS AS CONDICOES LEGAIS |
|
| B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 12A ANUIDADE. |
|
| B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2612 DE 26-01-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |