BRPI0905387A2 - Composição curável, resina termofixa enrijecida, compósito, processo para formar uma composição curável e processo para formar uma resina termofixa - Google Patents

Composição curável, resina termofixa enrijecida, compósito, processo para formar uma composição curável e processo para formar uma resina termofixa

Info

Publication number
BRPI0905387A2
BRPI0905387A2 BRPI0905387-5A BRPI0905387A BRPI0905387A2 BR PI0905387 A2 BRPI0905387 A2 BR PI0905387A2 BR PI0905387 A BRPI0905387 A BR PI0905387A BR PI0905387 A2 BRPI0905387 A2 BR PI0905387A2
Authority
BR
Brazil
Prior art keywords
forming
curable composition
thermoset resin
stiffened
composite
Prior art date
Application number
BRPI0905387-5A
Other languages
English (en)
Inventor
Jeff Reynolds
Rajesh H Turakhia
George Chennakattu Jacob
Marty J Null
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of BRPI0905387A2 publication Critical patent/BRPI0905387A2/pt
Publication of BRPI0905387B1 publication Critical patent/BRPI0905387B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5093—Complexes of amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI0905387-5A 2008-01-08 2009-01-05 Composição curável e resina termofixa enrijecida BRPI0905387B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US1978808P 2008-01-08 2008-01-08
US61/019,788 2008-01-08
PCT/US2009/030096 WO2009089145A1 (en) 2008-01-08 2009-01-05 High tg epoxy systems for composite application

Publications (2)

Publication Number Publication Date
BRPI0905387A2 true BRPI0905387A2 (pt) 2015-06-30
BRPI0905387B1 BRPI0905387B1 (pt) 2019-08-06

Family

ID=40342384

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0905387-5A BRPI0905387B1 (pt) 2008-01-08 2009-01-05 Composição curável e resina termofixa enrijecida

Country Status (8)

Country Link
US (2) US8742018B2 (pt)
EP (1) EP2229416B1 (pt)
JP (1) JP2011509339A (pt)
KR (1) KR101571184B1 (pt)
CN (1) CN101910238B (pt)
BR (1) BRPI0905387B1 (pt)
TW (1) TW200936683A (pt)
WO (1) WO2009089145A1 (pt)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8742018B2 (en) * 2008-01-08 2014-06-03 Dow Global Technologies Llc High Tg epoxy systems for composite applications
US20090197003A1 (en) * 2008-02-01 2009-08-06 Thomas Van Zandt Anti-fouling coatings, Compounds, and methods
JP5136573B2 (ja) 2009-02-24 2013-02-06 日立化成工業株式会社 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
US9169386B2 (en) * 2009-10-27 2015-10-27 Eco Green Resins, Llc Organic vegetable oil based resin and preparation method thereof
CA2723359C (en) 2009-12-22 2015-03-17 Dow Global Technologies, Inc. Diamino-alcohol compounds, their manufacture and use in epoxy resins
JP5657700B2 (ja) * 2010-01-27 2015-01-21 ダウ グローバル テクノロジーズ エルエルシー 多層構造体およびその製造方法
EP2528734A4 (en) * 2010-01-27 2014-01-15 Dow Global Technologies Llc MULTILAYER STRUCTURE AND PROCESS FOR THEIR PRODUCTION
WO2015070018A1 (en) * 2013-11-07 2015-05-14 Ndsu Research Foundation Bio-based resins with high content of ethylenically unsaturated functional groups and thermosets thereof
KR102032749B1 (ko) 2010-04-16 2019-10-16 에스더블유아이엠씨 엘엘씨 패키징 용품을 위한 코팅 조성물 및 코팅 방법
CN102101935B (zh) * 2010-12-23 2012-06-27 广东生益科技股份有限公司 无卤环氧树脂组合物以及使用其制备的挠性覆铜板
JP5733301B2 (ja) * 2011-01-27 2015-06-10 東レ株式会社 繊維強化複合材料rtm成形用エポキシ樹脂組成物、繊維強化複合材料およびその製造方法
WO2012161758A2 (en) 2011-02-07 2012-11-29 Valspar Sourcing, Inc. Coating compositions for containers and other articles and methods of coating
US9309381B2 (en) 2011-06-24 2016-04-12 Air Products And Chemicals, Inc. Epoxy resin compositions using solvated solids
US9651189B2 (en) * 2011-07-08 2017-05-16 Blue Cube Ip Llc Cured-in place pipe rehabilitation process
US9321881B2 (en) 2011-08-12 2016-04-26 Air Products And Chemicals, Inc. Liquid methylenedianiline compositions
WO2013053100A1 (en) * 2011-10-11 2013-04-18 Henkel China Co. Ltd. Gel time controllable two part epoxy adhesive
BR112014008695A2 (pt) * 2011-11-10 2017-04-25 Dow Global Technologies Llc composição de epóxi monocomponente
CN103421273B (zh) * 2012-05-22 2016-02-10 中山台光电子材料有限公司 无卤素树脂组成物
RU2618704C2 (ru) 2012-08-09 2017-05-11 Вэлспар Сорсинг, Инк. Композиции для контейнеров и других изделий и способы их применения
EP3225644A1 (en) * 2012-10-15 2017-10-04 Daicel Corporation Curable resin composition, and cured product thereof
EP2909252B1 (en) 2012-10-19 2017-06-21 Blue Cube IP LLC Toughened epoxy thermosets containing core shell rubbers and polyols
CN103881059A (zh) * 2012-12-21 2014-06-25 台光电子材料(昆山)有限公司 低介电树脂组合物及其应用
US9080007B2 (en) 2013-02-28 2015-07-14 Air Products And Chemicals, Inc. Anhydride accelerators for epoxy resin systems
CN105121496A (zh) * 2013-03-15 2015-12-02 蓝立方知识产权有限责任公司 含有核壳橡胶和多元醇的韧化环氧树脂热固物
EP3199564A1 (en) 2013-04-05 2017-08-02 Air Products And Chemicals, Inc. One component epoxy curing agents comprising hydroxyalkylamino cycloalkanes
US9546243B2 (en) 2013-07-17 2017-01-17 Air Products And Chemicals, Inc. Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions
JP2015086249A (ja) * 2013-10-28 2015-05-07 スリーボンドファインケミカル株式会社 マイクロカプセル型硬化性樹脂組成物
WO2015085428A1 (en) 2013-12-13 2015-06-18 Transfert Plus, Société En Commandite Insertion polynorbornene-based thermoset resins
KR102171397B1 (ko) 2013-12-30 2020-10-29 엘지디스플레이 주식회사 터치장치의 제조방법 및 그 수지 조성물
CN103724809B (zh) * 2013-12-31 2016-07-06 张锦碧 一种环氧树脂助剂制备方法
MX358938B (es) 2014-01-21 2018-09-10 Centro De Investig En Polimeros S A De C V Una resina cicloalifática, su método de obtención y su aplicación en un recubrimiento de alta resistencia.
EP3131965B1 (en) 2014-04-14 2024-06-12 Swimc Llc Methods of preparing compositions for containers and other articles and methods of using same
FR3020368B1 (fr) * 2014-04-24 2017-10-27 Arkema France Composition pour la fabrication de resines vitrimeres de type epoxy/anhyride comprenant un polyol
CN106414543A (zh) * 2014-05-14 2017-02-15 亨斯迈先进材料美国有限责任公司 用于防护涂层的多官能聚酰胺
BR112017000219A2 (pt) 2014-07-08 2018-01-16 Dow Global Technologies Llc adesivo durável à falha de alta tg de cura retardada
US10081704B2 (en) 2015-03-24 2018-09-25 Evonik Degussa Gmbh Epoxy systems having improved fracture toughness
DE102016006694B4 (de) 2015-05-31 2018-07-12 Karim El Kudsi Innenbeschichtungen von Trinkwasserrohren auf Epoxydharzbasis
EP3101063A1 (de) 2015-05-31 2016-12-07 Karim El Kudsi Innenbeschichtungen von trinkwasserrohren auf epoxydbasis und ein verfahren zu ihrer herstellung
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
KR101638574B1 (ko) 2015-12-15 2016-07-11 도레이첨단소재 주식회사 저점도 액상 에폭시 수지 조성물 및 이로부터 제조되는 압력용기
TWI557177B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 低介電無溶劑型樹脂組成物及基板結構
CN106117973A (zh) * 2016-06-23 2016-11-16 安徽酷米智能科技有限公司 一种线路板用环氧树脂组合物
CN106009529A (zh) * 2016-06-23 2016-10-12 安徽酷米智能科技有限公司 一种耐热易含浸线路板用改性环氧树脂
CN109563240A (zh) 2016-08-15 2019-04-02 赢创德固赛有限公司 用于环氧树脂体系的具有咪唑盐添加剂的酸酐环氧固化剂
US9902801B1 (en) 2016-10-17 2018-02-27 Warren Environmental, Inc. Delayed curing resin composition
CA3037147C (en) * 2016-10-17 2021-07-13 Danny Warren Method of lining a pipeline with a delayed curing resin composition
WO2018074992A1 (en) * 2016-10-17 2018-04-26 Danny Warren Delayed curing resin composition
JP2018080304A (ja) * 2016-11-18 2018-05-24 旭化成株式会社 熱硬化性エポキシ樹脂組成物、繊維強化熱硬化性エポキシ樹脂組成物、及び硬化物
WO2018111884A1 (en) 2016-12-12 2018-06-21 Evonik Degussa Gmbh Novel low temperature anhydride epoxy cured systems
JP7106543B2 (ja) 2016-12-21 2022-07-26 エボニック オペレーションズ ゲーエムベーハー N-ヒドロキシエチルピペリジン(nhep):エポキシ系のための新しい硬化剤
EP3339391B1 (en) 2016-12-23 2020-02-05 Evonik Operations GmbH Apcha as a building block in curing agent formulations for structural adhesives
MX2019014065A (es) 2017-06-09 2020-02-07 Hexion Inc Sistemas de resina epoxidica para materiales compuestos.
CA3078344A1 (en) * 2017-10-09 2019-04-18 Cytec Industries Inc. Curable resin composition and fiber reinforced resin matrix composite material
WO2019170563A1 (en) 2018-03-05 2019-09-12 Evonik Degussa Gmbh Cycloaliphatic amines for epoxy formulations: a novel curing agent for epoxy systems
CN113165147A (zh) * 2018-12-18 2021-07-23 3M创新有限公司 快速固化的粘结磨料制品前体
US11472913B2 (en) 2019-01-11 2022-10-18 Evonik Operations Gmbh Mono-alkylated diamines for epoxy formulations: novel curing agents for epoxy systems
DE102019209346A1 (de) * 2019-06-27 2020-12-31 Siemens Aktiengesellschaft Imprägnierformulierung, Isolationsmaterial, Verfahren zum Herstellen eines Isolationsmaterials und elektrische Maschine mit einem Isolationsmaterial
EP3825341A1 (de) * 2019-11-22 2021-05-26 Henkel AG & Co. KGaA Matrixharz für laminate mit hoher transparenz, geringer vergilbung und hohen glasübergangstemperaturen
US11970575B2 (en) 2020-10-05 2024-04-30 Alliance For Sustainable Energy, Llc Bioderived recyclable epoxy-anhydride thermosetting polymers and resins
MX2023009170A (es) 2021-02-25 2023-08-18 Huntsman Adv Mat Licensing Switzerland Gmbh Composicion polimerizable de un componente para impregnacion por goteo.
US12049557B2 (en) * 2021-07-07 2024-07-30 CNPC USA Corp. Bi-continuos epoxy microstructure for fabrication of degradable thermoset composite used in HTHP downhole conditions
CN118302471A (zh) 2021-11-30 2024-07-05 迈图高新材料有限责任公司 能固化的环氧树脂组合物
CN114633389A (zh) * 2022-03-29 2022-06-17 上海喆航航空科技有限公司 一种制备双组分混合物的方法及应用
US12202932B2 (en) * 2022-04-07 2025-01-21 Cnpc Usa Corporation Formulation and processing of degradable high Tg epoxy composite that can be degradable at extremely low temperature
CN115058099B (zh) * 2022-08-18 2022-11-11 北京玻钢院复合材料有限公司 一种具有两相海岛结构的环氧树脂组合物、复合材料及其制备方法
US20240327567A1 (en) 2023-03-31 2024-10-03 Evonik Operations Gmbh Low Temperature Curable One Component Epoxy Compositions containing Resin-Blocked Urea Curatives
US20240327610A1 (en) 2023-03-31 2024-10-03 Evonik Operations Gmbh Solutions of amines in functional and non-functional resins
US20240327615A1 (en) 2023-03-31 2024-10-03 Evonik Operations Gmbh Solutions of amines in polymeric phenols in combination with other resins
CN118834371A (zh) * 2023-04-25 2024-10-25 中国石油天然气集团有限公司 一种高Tg值可降解的热固性复合材料及其制备的可降解井下封堵工具
CN116836663A (zh) * 2023-08-14 2023-10-03 韦尔通科技股份有限公司 一种高耐热高粘接的单组分环氧胶黏剂及其制备方法和应用
GB202412535D0 (en) 2024-08-27 2024-10-09 Fergussons Advanced Composite Tech Limited Improvements relating to epoxy resin compositions
WO2026085810A1 (en) 2024-10-24 2026-04-30 Evonik Operations Gmbh A latent curing accelerator composition containing isocyanate blocked tertiary amine

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1187700B (de) * 1962-03-28 1965-02-25 Ciba Geigy Verwendung eines Kunststoffmaterials fuer witterungsbestaendige elektrische Freiluftisolatoren
DE2642465C3 (de) * 1976-09-21 1981-01-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung einer VerguBmasse
JPS53144958A (en) * 1977-05-24 1978-12-16 Toshiba Corp Epoxy resin composition
US4532299A (en) 1982-01-12 1985-07-30 Ameron, Inc. Flexibilized chemically resistant epoxy resin
JPS596442A (ja) * 1982-06-30 1984-01-13 Toyota Motor Corp 自動車用frp製板ばね
US4665111A (en) * 1984-10-12 1987-05-12 Siemens Aktiengesellschaft Casting compound for electrical and electronic components and modules
JPH0627182B2 (ja) 1987-08-31 1994-04-13 ソマール株式会社 含浸に好適な液状エポキシ樹脂組成物
US5066735A (en) 1987-11-16 1991-11-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
CN1040810A (zh) 1988-04-30 1990-03-28 三井东圧化学株式会社 多硫化合物基树脂透镜及其制备方法
JPH02169620A (ja) * 1988-12-22 1990-06-29 Mitsui Petrochem Ind Ltd 硬化用エポキシ樹脂組成物、ならびに、この組成物からなる透明樹脂板、半導体装置用透明窓材および液晶パネル用透明基板
US4981941A (en) * 1989-03-27 1991-01-01 The United States Of America As Represented By The Secretary Of The Navy Fluorinated epoxy resins with high glass transition temperatures
US5189080A (en) * 1989-04-25 1993-02-23 Robert Bosch Gmbh Epoxy resin composition for encapsulating electric circuit components
DE3913488C2 (de) * 1989-04-25 1994-02-03 Bosch Gmbh Robert Vergußmasse für elektrische und elektronische Bauteile
GB8912952D0 (en) 1989-06-06 1989-07-26 Dow Rheinmuenster Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones
US5789482A (en) * 1990-03-30 1998-08-04 Ciba Specialty Chemicals Corporation Epoxy resin with anhydride, toughener and active hydrogen-containing compound
US5262507A (en) 1990-09-11 1993-11-16 Dow Corning Corporation High modulus silicones as toughening agents for epoxy resins
JP2728106B2 (ja) * 1991-09-05 1998-03-18 インターナショナル・ビジネス・マシーンズ・コーポレイション 電子パッケージングにおける除去可能なデバイス保護のための開裂性ジエポキシド
US6329475B1 (en) 1992-08-12 2001-12-11 The Dow Chemical Company Curable epoxy vinylester composition having a low peak exotherm during cure
US5385990A (en) 1992-11-02 1995-01-31 Lord Corporation Structural adhesive composition having high temperature resistance
DE4342722A1 (de) 1993-12-15 1995-06-22 Hoechst Ag Elastisches Epoxidharz-Härter-System
DE4342721A1 (de) 1993-12-15 1995-06-22 Hoechst Ag Elastisches Epoxidharz-Härter-System
DE4410785A1 (de) 1994-03-28 1995-10-05 Hoechst Ag Amin-modifizierte Epoxidharz-Zusammensetzung
GB9411367D0 (en) 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
US5629379A (en) * 1994-09-27 1997-05-13 Harper; John D. Anhydride-hardened epoxy resin with polybutadiene-maleic anhydride adduct
US5962586A (en) * 1994-09-27 1999-10-05 Harper; John D. Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct
US5646315A (en) 1995-06-07 1997-07-08 National Starch And Chemical Investment Holding Corporation Polyglydicylphenyl ethers of alkyloxy chains for use in microelectronics adhesives
KR19990066959A (ko) 1995-10-23 1999-08-16 나닌크 요하네스 에프,베르너 페터 요트 중합체 폴리올 및 예비성형된 안정화제 시스템
JPH09137041A (ja) * 1995-11-16 1997-05-27 Hitachi Ltd 含浸用樹脂組成物およびそれを用いた電気絶縁線輪
US5932682A (en) * 1995-12-19 1999-08-03 International Business Machines Corporation Cleavable diepoxide for removable epoxy compositions
US6245835B1 (en) 1996-02-29 2001-06-12 The Dow Chemical Company Polymeric amines and reactive epoxy polymer compositions
US5741847A (en) 1996-05-23 1998-04-21 The Dow Chemical Company Polymer polyols containing halogenated aromatic monomers and polyurethane foam made therefrom
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
EP0906927B1 (en) 1997-10-02 2000-12-20 Hexcel Corporation Epoxy resin curing agents
JPH11140277A (ja) 1997-11-10 1999-05-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及びこれを用いた半導体装置
US6153719A (en) 1998-02-04 2000-11-28 Lord Corporation Thiol-cured epoxy composition
KR100589300B1 (ko) 1998-04-27 2006-06-14 에섹스 스페시얼티 프로덕츠, 인코오포레이티드 실란 작용성 접착제 조성물을 사용하여 창유리를 기재에접착시키는 방법
US6455603B1 (en) 1998-06-30 2002-09-24 Dow Global Technologies Inc. Polymer polyols and a process for the production thereof
US6057402A (en) * 1998-08-12 2000-05-02 Johnson Matthey, Inc. Long and short-chain cycloaliphatic epoxy resins with cyanate ester
US7679534B2 (en) 1998-12-04 2010-03-16 Tegic Communications, Inc. Contextual prediction of user words and user actions
GB9827367D0 (en) 1998-12-11 1999-02-03 Dow Deutschland Inc Adhesive resin composition
US6632893B2 (en) 1999-05-28 2003-10-14 Henkel Loctite Corporation Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
US6462108B1 (en) 2000-07-20 2002-10-08 National Starch And Chemical Investment Holding Corporation High Tg potting compound
US6572971B2 (en) 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
US6632860B1 (en) 2001-08-24 2003-10-14 Texas Research International, Inc. Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener
GB0212062D0 (en) 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
US7163973B2 (en) 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
US7087304B1 (en) 2003-02-19 2006-08-08 Henkel Corporation Polysulfide-based toughening agents, compositions containing same and methods for the use thereof
CN1239587C (zh) 2003-04-03 2006-02-01 中国石油化工股份有限公司 一种复合粉末及其制备方法和用途
US6887574B2 (en) 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
BRPI0508158B1 (pt) 2004-04-02 2015-10-27 Dow Global Technologies Inc composição, compósito, composição de revestimento em pó, processo para preparar laminados, processo para preparar compósito, revestimentos, laminados elétricos, cola de fibra de vidro, auxiliares de redução de brilho, encapsulantes
BRPI0516699A (pt) 2004-11-10 2008-09-16 Dow Global Technologies Inc composição de resina epóxi adesiva curável, processo para preparar uma composição de resina epóxi adesiva curável e dois ou mais substratos
US7670649B2 (en) 2004-11-10 2010-03-02 Dow Global Technologies, Inc. Amphiphilic block copolymer-toughened epoxy resins and ambient cure high-solids coatings made therefrom
ATE453687T1 (de) 2004-11-10 2010-01-15 Dow Global Technologies Inc Mit amphiphilem blockcoplymer gehärtete epoxidharze
JP5248860B2 (ja) 2004-11-10 2013-07-31 ダウ グローバル テクノロジーズ エルエルシー 両親媒性ブロックコポリマーにより靭性を付与したエポキシ樹脂及びそれらから製造された電気用積層板
US20060205856A1 (en) 2004-12-22 2006-09-14 Williamson David T Compositions of polyesters and sepiolite-type clays
US8048819B2 (en) 2005-06-23 2011-11-01 Momentive Performance Materials Inc. Cure catalyst, composition, electronic device and associated method
WO2007142140A1 (ja) * 2006-06-06 2007-12-13 Hitachi Chemical Company, Ltd. 酸性置換基と不飽和マレイミド基を有する硬化剤の製造法並びに熱硬化性樹脂組成物、プリプレグ及び積層板
US8742018B2 (en) * 2008-01-08 2014-06-03 Dow Global Technologies Llc High Tg epoxy systems for composite applications
JP5638812B2 (ja) * 2010-02-01 2014-12-10 株式会社ダイセル 硬化性エポキシ樹脂組成物

Also Published As

Publication number Publication date
US8742018B2 (en) 2014-06-03
EP2229416B1 (en) 2018-04-04
CN101910238B (zh) 2013-03-27
JP2011509339A (ja) 2011-03-24
KR101571184B1 (ko) 2015-11-23
US20100292415A1 (en) 2010-11-18
EP2229416A1 (en) 2010-09-22
WO2009089145A1 (en) 2009-07-16
KR20100113555A (ko) 2010-10-21
CN101910238A (zh) 2010-12-08
US9315664B2 (en) 2016-04-19
BRPI0905387B1 (pt) 2019-08-06
TW200936683A (en) 2009-09-01
US20140235792A1 (en) 2014-08-21

Similar Documents

Publication Publication Date Title
BR112012006241A2 (pt) composição de compósito de resina epóxi curável, processo para produzir um produto curado, produto de compósito curado e processo para produzir uma composição de resina epóxi curável
BRPI1005918A2 (pt) composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivo
BRPI0907273A2 (pt) Composição curável baseada em epóxi, processo para formar uma composição curável baseada em epóxi, resina termofixa e peça baseada em epóxi
BRPI0810290A2 (pt) "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito."
FI20095893A7 (fi) Kovetettava koostumus, kovetettu tuote ja laminaatti
BRPI0923216A2 (pt) composição de resina, artigo moldado, e, processo para produzir uma composição de resina.
BRPI0813201A2 (pt) "composição curável, compósito e método para formar um compósito"
BRPI0924000A2 (pt) composição termofixavel, produto termofixo, processo para preparar uma composição termofixavel e produto termofixo curado
BRPI0905080A2 (pt) Composições, processo para reparar uma composição e produto
BR112013006989A2 (pt) composição de resina epóxi polifuncional reepoxidada, processo para preparar uma composição de resina epóxi polifuncional reepoxidada, composição de resina epóxi curável, produto termofixo, processo para preparar uma composição e artigo
BR112013005646A2 (pt) composição de resina de poliéster epóxi, composição de resina de poliéster epóxi(éster epóxi) curável, resina curada, e processo para preparar composição de resina de poliéster epóxi(éster epóxi) curável
BR112012033390A2 (pt) composição curável por uv, processo para preparar uma composição de resina de dióxido de divinilareno curável e produto curado
BRPI0907275A2 (pt) Processo para formar um catalisador de epóxi-imidazol sólido, catalisador de epóxi-imidazol sólido, composição curável, processo para formar uma composição curável e processo para formar uma composição termofixa
BR112012010870A2 (pt) composição de resina de oxazolidona com funcionalidade epóxi,composição de resina epóxi curável ,processo para reparar uma composição de resina de oxazolodona com funcionalidadde epóxi,processo para preparar uma composição de resina epóxi curável e produto termofixo curado
EP2341106A4 (en) CURABLE COMPOSITION AND CURED PRODUCT OBTAINED THEREFROM
BR112014010528A2 (pt) composição de resina de expóxi curável, e, métodos para curar um sistema de resina de expóxi e para fabricar uma estrutura de compósito
EP2253666A4 (en) HARDENABLE RESIN COMPOSITION AND CURED RESIN
BRPI0912384A2 (pt) composição, e, método para preparar uma composição
BR112012032981A2 (pt) composição de resina epóxi curável livre de diluente para preparar um compósito, processo para preparar uma composição ou sistema de resina curável, livre de diluente, produto compósito curado e processo para preparar produto compósito curado
BR112013001848A2 (pt) estrutura compósita, processo para produzir uma estrutura compósita, estrutura compósita sobremoldada e processo para produzir uma estrutura compósita sobremoldada
BRPI1008127A2 (pt) "composição e processo para a preparação de uma espuma termoplástica ou termofixa"
BRPI1015276A2 (pt) composição de resina curável, composição adesiva, objeto curado ou compósito
BR112014003754A2 (pt) composição de resina epóxil curável e processo
BR112012029587A2 (pt) composição de resina epóxi contendo dióxido de divinilareno curável, processo para preparar uma composição de resina epóxi contendo dióxido de divinilareno curável, processo para preparar um termofixo curado e produto termofixo curado
BR112013001851A2 (pt) estrutura compósita, processo para a produção de uma estrutura compósita, estrutura compósita sobremoldada e processo para a produção de uma estrutura compósita sobremoldada

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 06/08/2019, OBSERVADAS AS CONDICOES LEGAIS. (CO) 10 (DEZ) ANOS CONTADOS A PARTIR DE 06/08/2019, OBSERVADAS AS CONDICOES LEGAIS

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 12A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2612 DE 26-01-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.