BRPI1007266A2 - aparelhos e métodos para separação, e para separação e transferência de pastilha. - Google Patents

aparelhos e métodos para separação, e para separação e transferência de pastilha.

Info

Publication number
BRPI1007266A2
BRPI1007266A2 BRPI1007266A BRPI1007266A BRPI1007266A2 BR PI1007266 A2 BRPI1007266 A2 BR PI1007266A2 BR PI1007266 A BRPI1007266 A BR PI1007266A BR PI1007266 A BRPI1007266 A BR PI1007266A BR PI1007266 A2 BRPI1007266 A2 BR PI1007266A2
Authority
BR
Brazil
Prior art keywords
separating
methods
transferring tablets
tablets
transferring
Prior art date
Application number
BRPI1007266A
Other languages
English (en)
Inventor
Ichiki Kusuhara
Kyouhei Tsunashima
Original Assignee
Exa Co Ltd
Watanabe M & Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exa Co Ltd, Watanabe M & Co Ltd filed Critical Exa Co Ltd
Publication of BRPI1007266A2 publication Critical patent/BRPI1007266A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G59/00—De-stacking of articles
    • B65G59/02—De-stacking from the top of the stack
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing & Machinery (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
BRPI1007266A 2009-01-13 2010-01-12 aparelhos e métodos para separação, e para separação e transferência de pastilha. BRPI1007266A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009004709 2009-01-13
PCT/JP2010/050233 WO2010082567A1 (ja) 2009-01-13 2010-01-12 ウエハ分離装置、ウエハ分離搬送装置、ウエハ分離方法、ウエハ分離搬送方法及び太陽電池用ウエハ分離搬送方法

Publications (1)

Publication Number Publication Date
BRPI1007266A2 true BRPI1007266A2 (pt) 2016-02-10

Family

ID=42339821

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1007266A BRPI1007266A2 (pt) 2009-01-13 2010-01-12 aparelhos e métodos para separação, e para separação e transferência de pastilha.

Country Status (10)

Country Link
US (2) US8863957B2 (pt)
EP (1) EP2388809A4 (pt)
JP (1) JP5498398B2 (pt)
KR (1) KR101616765B1 (pt)
CN (1) CN102272913A (pt)
AU (1) AU2010205243A1 (pt)
BR (1) BRPI1007266A2 (pt)
NZ (1) NZ593758A (pt)
SG (1) SG172907A1 (pt)
WO (1) WO2010082567A1 (pt)

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US7651666B2 (en) 2006-04-20 2010-01-26 S.C. Johnson & Son, Inc. Air treatment device with reservoir refill
JP5646897B2 (ja) * 2010-07-21 2014-12-24 エア・ウォーター株式会社 ウエハの枚葉化方法および装置
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JP2014207250A (ja) * 2011-08-12 2014-10-30 株式会社安永 ウェハ分離装置及びこれを用いたウェハの製造方法
KR101249039B1 (ko) * 2011-09-21 2013-04-01 피에스피 주식회사 웨이퍼 분리장치
JP2013149703A (ja) * 2012-01-18 2013-08-01 Nippon Steel & Sumikin Fine Technology Co Ltd ウエハ搬送装置
JP2013161811A (ja) * 2012-02-01 2013-08-19 Shin Etsu Chem Co Ltd 基板洗浄方法及び基板洗浄装置
JP6016174B2 (ja) * 2012-07-31 2016-10-26 パナソニックＩｐマネジメント株式会社 太陽電池の製造方法
CN103811374B (zh) * 2012-11-06 2016-03-23 沈阳芯源微电子设备有限公司 一种晶圆浸泡装置
JP5849201B2 (ja) * 2013-05-28 2016-01-27 パナソニックＩｐマネジメント株式会社 切り残し部除去装置
JP5982650B2 (ja) * 2013-12-06 2016-08-31 パナソニックＩｐマネジメント株式会社 ウエハ剥離装置
US9562291B2 (en) * 2014-01-14 2017-02-07 Mei, Llc Metal etch system
TWI564951B (zh) * 2014-10-30 2017-01-01 台灣茂矽電子股份有限公司 蝕刻裝置及蝕刻方法
CN106702496B (zh) * 2015-07-20 2019-01-25 有研半导体材料有限公司 一种酸腐蚀去除硅晶圆表面损伤的装置及方法
CN105417168A (zh) * 2015-12-31 2016-03-23 苏州博阳能源设备有限公司 一种用于硅片插片机的供料槽
CN107346753A (zh) * 2016-05-06 2017-11-14 亿力鑫系统科技股份有限公司 浸泡设备
US11220758B2 (en) * 2016-06-15 2022-01-11 Seoul Viosys Co., Ltd. Systems and methods for thermal hydro-synthesis of semiconductor materials by holding a substrate wafer within a chamber in a vertical direction
KR101905692B1 (ko) 2016-11-15 2018-10-12 한국에너지기술연구원 마이크로 버블과 와이어 방전 가공을 이용한 실리콘 잉곳 절단장치, 및 실리콘 잉곳 절단방법
CN106784138B (zh) * 2016-12-05 2018-07-06 浙江尚越新能源开发有限公司 一种太阳能电池切割系统的切割装置
US10631733B2 (en) * 2017-03-13 2020-04-28 Go!Foton Holdings, Inc. Lens combination for an optical probe and assembly thereof
CN110416351A (zh) * 2018-04-27 2019-11-05 北京创昱科技有限公司 晶片加工系统
CN109262869B (zh) * 2018-10-26 2020-11-03 晶科能源有限公司 一种光伏切片的分片辅助液及分片方法
CN109335707A (zh) * 2018-11-01 2019-02-15 浙江中晶新材料研究有限公司 一种硅片自分片传送定位系统
KR102101265B1 (ko) * 2018-11-19 2020-04-16 이충석 슬림로드 디본딩 장치
CN112185841B (zh) * 2019-07-05 2024-11-15 弘塑科技股份有限公司 卡匣旋转设备和卡匣
TWI740175B (zh) * 2019-07-05 2021-09-21 弘塑科技股份有限公司 卡匣旋轉設備和卡匣
JP7303689B2 (ja) * 2019-07-31 2023-07-05 株式会社ディスコ エッチング装置およびウェーハ支持具
KR102751035B1 (ko) * 2019-12-19 2025-01-07 삼성디스플레이 주식회사 박리 장치 및 그를 이용한 표시 장치의 제조 방법
CN111092036B (zh) * 2020-03-23 2020-07-14 杭州众硅电子科技有限公司 一种晶圆清洗干燥装置
KR102368658B1 (ko) * 2020-06-01 2022-02-28 에스케이실트론 주식회사 Asc 공정 자동화 장치
CN213595397U (zh) * 2020-07-10 2021-07-02 深圳市盛利达数控设备有限公司 片料分离装置
CN112371562A (zh) * 2020-10-22 2021-02-19 广东新一代工业互联网创新技术有限公司 一种基于自动化管理的物料筛分方法及装置
TWI835028B (zh) * 2020-11-30 2024-03-11 南韓商細美事有限公司 用於處理基板之設備
CN112847851A (zh) * 2020-12-31 2021-05-28 常州时创能源股份有限公司 一种单晶硅棒的加工方法、硅片、电池片和光伏组件
KR102584510B1 (ko) * 2021-07-29 2023-10-06 세메스 주식회사 기판 처리 장치
JP7720209B2 (ja) * 2021-09-24 2025-08-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、および、基板処理装置
KR102624574B1 (ko) * 2021-09-29 2024-01-16 세메스 주식회사 기판 처리 장치
CN218182182U (zh) * 2022-08-25 2022-12-30 内蒙古中环光伏材料有限公司 一种可用于传输超薄硅片的黑轮
CN115295470B (zh) * 2022-10-08 2022-12-27 四川上特科技有限公司 一种晶圆片转移装置及腐蚀方法
JP7733061B2 (ja) * 2023-06-08 2025-09-02 株式会社Ｓｃｒｅｅｎホールディングス 液中姿勢変換装置及びそれを備えた基板処理装置
JP7796697B2 (ja) * 2023-06-08 2026-01-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7733066B2 (ja) * 2023-06-27 2025-09-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システム
KR102654953B1 (ko) * 2023-06-30 2024-05-08 주식회사 유닉 기판 후처리 장치
JP7796703B2 (ja) * 2023-07-25 2026-01-09 株式会社Ｓｃｒｅｅｎホールディングス 姿勢変換装置及びそれを備えた基板処理装置
CN117283729B (zh) * 2023-11-14 2026-01-30 无锡京运通科技有限公司 单晶硅片的切削清洗装置及方法
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Also Published As

Publication number Publication date
EP2388809A1 (en) 2011-11-23
JP5498398B2 (ja) 2014-05-21
EP2388809A4 (en) 2014-07-09
WO2010082567A1 (ja) 2010-07-22
JPWO2010082567A1 (ja) 2012-07-05
CN102272913A (zh) 2011-12-07
US8863957B2 (en) 2014-10-21
KR101616765B1 (ko) 2016-05-02
NZ593758A (en) 2012-11-30
AU2010205243A1 (en) 2011-07-21
US20150004741A1 (en) 2015-01-01
KR20110104994A (ko) 2011-09-23
SG172907A1 (en) 2011-08-29
US20120006726A1 (en) 2012-01-12

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Legal Events

Date Code Title Description
B25A Requested transfer of rights approved

Owner name: KABUSHIKI KAISHA WATANABE SHOKO (JP)

B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]