BRPI1011223A2 - fluido de corte aquoso e agente de corte aquoso - Google Patents

fluido de corte aquoso e agente de corte aquoso

Info

Publication number
BRPI1011223A2
BRPI1011223A2 BRPI1011223A BRPI1011223A BRPI1011223A2 BR PI1011223 A2 BRPI1011223 A2 BR PI1011223A2 BR PI1011223 A BRPI1011223 A BR PI1011223A BR PI1011223 A BRPI1011223 A BR PI1011223A BR PI1011223 A2 BRPI1011223 A2 BR PI1011223A2
Authority
BR
Brazil
Prior art keywords
aqueous cutting
agent
fluid
aqueous
cutting fluid
Prior art date
Application number
BRPI1011223A
Other languages
English (en)
Inventor
Ichiro Tani
Takashi Kimura
Takayuki Hayashi
Toru Mizusaki
Original Assignee
Nissin Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissin Chemical Ind filed Critical Nissin Chemical Ind
Publication of BRPI1011223A2 publication Critical patent/BRPI1011223A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C08K5/053—Polyhydroxylic alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00—Lubricating compositions containing more than 10% water
    • C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/02—Hydroxy compounds
    • C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M2207/022—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
    • C10M2229/04—Siloxanes with specific structure
    • C10M2229/047—Siloxanes with specific structure containing alkylene oxide groups
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
    • C10M2229/04—Siloxanes with specific structure
    • C10M2229/048—Siloxanes with specific structure containing carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
    • C10M2229/04—Siloxanes with specific structure
    • C10M2229/05—Siloxanes with specific structure containing atoms other than silicon, hydrogen, oxygen or carbon
    • C10M2229/052—Siloxanes with specific structure containing atoms other than silicon, hydrogen, oxygen or carbon containing nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Lubricants (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
BRPI1011223A 2009-06-12 2010-06-09 fluido de corte aquoso e agente de corte aquoso BRPI1011223A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009141070 2009-06-12
PCT/JP2010/059752 WO2010143649A1 (ja) 2009-06-12 2010-06-09 水性切削液及び水性切削剤

Publications (1)

Publication Number Publication Date
BRPI1011223A2 true BRPI1011223A2 (pt) 2016-03-15

Family

ID=43308904

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1011223A BRPI1011223A2 (pt) 2009-06-12 2010-06-09 fluido de corte aquoso e agente de corte aquoso

Country Status (9)

Country Link
US (1) US8591611B2 (pt)
EP (1) EP2441550B1 (pt)
JP (1) JP5408251B2 (pt)
KR (2) KR20120036796A (pt)
CN (1) CN101921648B (pt)
BR (1) BRPI1011223A2 (pt)
MY (1) MY152049A (pt)
TW (1) TW201113357A (pt)
WO (1) WO2010143649A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5538044B2 (ja) * 2010-04-16 2014-07-02 Ｊｘ日鉱日石エネルギー株式会社 耐摩耗性に優れる潤滑油組成物
CN103525528A (zh) * 2013-02-14 2014-01-22 郑州新安华砂轮有限公司 一种切削液及其配制方法
JP6078397B2 (ja) * 2013-03-29 2017-02-08 シーシーアイ株式会社 作動液
RU2016118559A (ru) * 2013-10-16 2017-11-21 Конинклейке Филипс Н.В. Устройство для обнаружения зубного налета
KR102062341B1 (ko) 2017-06-01 2020-01-03 영창케미칼 주식회사 절삭유 조성물 및 그를 이용한 절삭방법
WO2018221972A2 (ko) * 2017-06-01 2018-12-06 영창케미칼 주식회사 절삭유 조성물
CN112877124B (zh) * 2020-09-09 2022-05-31 武汉宜田科技发展有限公司 一种金刚石线线切割用水性切割液及其制备和使用方法
CN118620680A (zh) * 2024-05-27 2024-09-10 通威微电子有限公司 用于碳化硅多线切割的水系砂浆及其制备方法和应用

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3009083B2 (ja) * 1993-05-14 2000-02-14 信越化学工業株式会社 泡抑制剤組成物
JPH07157792A (ja) 1993-11-01 1995-06-20 Xerox Corp 水性ベース切削油剤
JP3259516B2 (ja) * 1994-04-25 2002-02-25 信越化学工業株式会社 パルプ黒液用消泡剤
JP2000327838A (ja) 1999-05-18 2000-11-28 Super Silicon Kenkyusho:Kk ワイヤソー又はバンドソー用水性研削液
EP1077233A3 (de) * 1999-08-19 2001-08-16 Wacker-Chemie GmbH Trennmittel gegen bituminöse Stoffe
JP2001164240A (ja) 1999-12-06 2001-06-19 Ishii Hyoki Corp 水性切削液
JP2004247605A (ja) * 2003-02-14 2004-09-02 Toshiba Corp Ｃｍｐ用スラリーおよび半導体装置の製造方法
JP2004260123A (ja) * 2003-02-28 2004-09-16 Sanyo Chem Ind Ltd シリコンインゴットスライス用クーラント
US7387970B2 (en) * 2003-05-07 2008-06-17 Freescale Semiconductor, Inc. Method of using an aqueous solution and composition thereof
JP4564735B2 (ja) * 2003-10-22 2010-10-20 旭硝子株式会社 研磨スラリーおよび半導体集積回路の製造方法
JP4515071B2 (ja) * 2003-10-30 2010-07-28 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 毛髪化粧料組成物
KR100611064B1 (ko) * 2004-07-15 2006-08-10 삼성전자주식회사 화학 기계적 연마 공정용 슬러리 조성물, 상기 슬러리조성물을 이용한 화학 기계적 연마 방법 및 상기 방법을이용한 게이트 패턴의 형성 방법
JP4566045B2 (ja) * 2005-03-29 2010-10-20 ユシロ化学工業株式会社 水性砥粒分散媒組成物
JP4481898B2 (ja) 2005-07-25 2010-06-16 ユシロ化学工業株式会社 水性砥粒分散媒組成物
JP4735844B2 (ja) * 2005-08-03 2011-07-27 日信化学工業株式会社 硝子繊維処理浸透剤及び硝子繊維処理剤組成物
US8216673B2 (en) * 2005-08-03 2012-07-10 Nissin Chemical Industry Co., Ltd. Glass fiber-treating agent and glass fiber-treating composition
JP2007231384A (ja) * 2006-03-02 2007-09-13 Matsumura Sekiyu Kenkyusho:Kk 非鉄金属用防食剤および非鉄金属用水溶性切削・研削加工油剤組成物

Also Published As

Publication number Publication date
CN101921648B (zh) 2014-07-30
TW201113357A (en) 2011-04-16
US8591611B2 (en) 2013-11-26
US20110113699A1 (en) 2011-05-19
KR20100133907A (ko) 2010-12-22
KR20120036796A (ko) 2012-04-18
CN101921648A (zh) 2010-12-22
WO2010143649A1 (ja) 2010-12-16
EP2441550A1 (en) 2012-04-18
EP2441550A4 (en) 2012-11-21
EP2441550B1 (en) 2016-09-07
JP5408251B2 (ja) 2014-02-05
JPWO2010143649A1 (ja) 2012-11-29
MY152049A (en) 2014-08-15

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 6A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2385 DE 20-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.