BRPI1015324A2 - sistema curável, método para a fabricação de um produto curado, produto curado, e, usos do produto curado e do sistema curável - Google Patents

sistema curável, método para a fabricação de um produto curado, produto curado, e, usos do produto curado e do sistema curável

Info

Publication number
BRPI1015324A2
BRPI1015324A2 BRPI1015324-1A BRPI1015324A BRPI1015324A2 BR PI1015324 A2 BRPI1015324 A2 BR PI1015324A2 BR PI1015324 A BRPI1015324 A BR PI1015324A BR PI1015324 A2 BRPI1015324 A2 BR PI1015324A2
Authority
BR
Brazil
Prior art keywords
cured product
curable system
manufacturing
system uses
curable
Prior art date
Application number
BRPI1015324-1A
Other languages
English (en)
Inventor
Grindling Josef
Beisele Christian
Beigel Astrid
Beard Cliff
Original Assignee
Huntsman Advanced Materials (Switzerland) Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Advanced Materials (Switzerland) Gmbh filed Critical Huntsman Advanced Materials (Switzerland) Gmbh
Publication of BRPI1015324A2 publication Critical patent/BRPI1015324A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/156—Heterocyclic compounds having oxygen in the ring having two oxygen atoms in the ring
    • C08K5/1575—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/205—Compounds containing groups, e.g. carbamates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

sistema curável, método para a fabricação de um produto curado, produto curado, e, usos do produto curado e do sistema curável é descrito um sistema curável compreendendo pelo menos duas composições (a) e (b), um método para a fabricação de um produto curado, bem como produtos curados que podem ser obtidos pelo método. ainda é descrito o uso dos produtos curados como isolante elétrico, bem corno o uso do sistema curável para a fabricar os componentes ou partes do equipamento elétrico.
BRPI1015324-1A 2009-05-05 2010-03-25 sistema curável, método para a fabricação de um produto curado, produto curado, e, usos do produto curado e do sistema curável BRPI1015324A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP09159360 2009-05-05
EP09159360.8 2009-05-05
PCT/EP2010/053874 WO2010127907A1 (en) 2009-05-05 2010-03-25 Curable system

Publications (1)

Publication Number Publication Date
BRPI1015324A2 true BRPI1015324A2 (pt) 2019-04-09

Family

ID=41138617

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1015324-1A BRPI1015324A2 (pt) 2009-05-05 2010-03-25 sistema curável, método para a fabricação de um produto curado, produto curado, e, usos do produto curado e do sistema curável

Country Status (13)

Country Link
US (1) US9546260B2 (pt)
EP (1) EP2427517B1 (pt)
JP (1) JP5476461B2 (pt)
KR (1) KR101699255B1 (pt)
CN (1) CN102421845B (pt)
AU (1) AU2010244641B2 (pt)
BR (1) BRPI1015324A2 (pt)
ES (1) ES2423602T3 (pt)
PL (1) PL2427517T3 (pt)
PT (1) PT2427517E (pt)
RU (1) RU2534653C2 (pt)
TW (1) TWI503342B (pt)
WO (1) WO2010127907A1 (pt)

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Publication number Priority date Publication date Assignee Title
CN103045142B (zh) * 2011-10-24 2014-03-19 北京天山新材料技术股份有限公司 环氧耐磨陶瓷片粘接胶及其制备方法
CN104136532B (zh) * 2012-03-01 2016-05-18 住友电木株式会社 转子固定用树脂组合物、转子和汽车
JP2014101414A (ja) * 2012-11-16 2014-06-05 Kaneka Corp 感温ゲル化剤含有熱硬化性樹脂組成物
JP2014129466A (ja) * 2012-12-28 2014-07-10 Hitachi Industrial Equipment Systems Co Ltd 高電圧機器用絶縁樹脂材およびそれを用いた高電圧機器
JP6394115B2 (ja) * 2014-06-27 2018-09-26 三菱ケミカル株式会社 樹脂組成物、樹脂組成物からなる放熱シート、及び放熱シートを含むパワーデバイス装置
CN108290998A (zh) 2015-11-23 2018-07-17 亨斯迈先进材料许可(瑞士)有限公司 用于制备户外制品的可固化聚氨酯组合物和由其获得的制品
KR102716321B1 (ko) 2016-05-24 2024-10-14 주식회사 아모그린텍 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛
CN111356715B (zh) 2017-11-14 2023-05-23 株式会社弘辉 补强用树脂组合物及电子零件装置
US20220135862A1 (en) * 2019-04-11 2022-05-05 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Curable Two-Component Resin-Based System
WO2022136330A1 (en) * 2020-12-22 2022-06-30 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Curable two-part resin system
CN117682796A (zh) * 2023-12-20 2024-03-12 华能中天节能科技集团有限责任公司 一种防水岩棉保温板及其制备方法
CN119371379A (zh) * 2024-10-24 2025-01-28 南京林业大学 一种β-甲基缩水甘油醚类环氧化合物及其制备方法、改性环氧树脂

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US363720A (en) * 1887-05-24 String-instrument
US3914467A (en) * 1971-06-22 1975-10-21 Matsushita Electric Industrial Co Ltd Method of making resin encapsulated electric coil
JPS6220555A (ja) * 1985-07-18 1987-01-29 Mitsubishi Electric Corp エポキシ樹脂組成物
JPH02133421A (ja) * 1988-11-14 1990-05-22 Sunstar Eng Inc エポキシ樹脂組成物
US5616633A (en) * 1991-09-20 1997-04-01 Ciba-Geigy Corporation Liquid epoxy resin composition
GB9120078D0 (en) * 1991-09-20 1991-11-06 Ciba Geigy Ag Resin formulation
DE19601085A1 (de) * 1996-01-13 1997-07-17 Basf Ag Gele mit thermotropen Eigenschaften
ES2189937T3 (es) * 1996-10-30 2003-07-16 Vantico Ag Composiciones reticulables de resina expoxi.
GB2332202A (en) * 1997-12-09 1999-06-16 Courtaulds Coatings Curable epoxy resin compositions
ES2276676T3 (es) * 1999-03-16 2007-07-01 Huntsman Advanced Materials (Switzerland) Gmbh Composicion endurecible con combinacion especial de propiedades.
JP2001158869A (ja) * 1999-09-20 2001-06-12 Sakura Color Prod Corp 筆記具用油性インキ
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US6503960B1 (en) * 2000-11-21 2003-01-07 Loctite Corporation Dispersion stable curable compositions and method for making hollow shells using same
DE10241853B3 (de) * 2002-09-09 2004-01-22 Byk-Chemie Gmbh Polymeres Harnstoffurethan als Rheologiesteuerungsmittel und Verfahren zur Herstellung
DE60312143T2 (de) * 2003-06-16 2007-11-29 Abb Technology Ltd. Epoxyharzzusammensetzungen und Verfahren zur Herstellung von geformten Gegenständen daraus
BRPI0416166A (pt) * 2003-11-04 2007-01-09 Huntsman Adv Mat Switzerland composição, uso de uma composição, e, processo para fabricar um modelo ou protótipo
KR100826210B1 (ko) * 2006-12-20 2008-04-30 (주)디피아이 홀딩스 투명 고분자 수지 조성물 및 투명 고분자막 형성 방법
DE102008029858A1 (de) * 2008-04-23 2009-10-29 Byk-Chemie Gmbh Stabile Dispersionen von anorganischen Nanopartikeln

Also Published As

Publication number Publication date
ES2423602T3 (es) 2013-09-23
KR101699255B1 (ko) 2017-01-25
JP5476461B2 (ja) 2014-04-23
WO2010127907A1 (en) 2010-11-11
US20120065295A1 (en) 2012-03-15
AU2010244641A1 (en) 2011-10-13
JP2012526163A (ja) 2012-10-25
RU2011149329A (ru) 2013-06-10
EP2427517B1 (en) 2013-06-19
CN102421845A (zh) 2012-04-18
RU2534653C2 (ru) 2014-12-10
PL2427517T3 (pl) 2013-11-29
TWI503342B (zh) 2015-10-11
AU2010244641B2 (en) 2015-06-25
KR20140014353A (ko) 2014-02-06
EP2427517A1 (en) 2012-03-14
PT2427517E (pt) 2013-07-23
US9546260B2 (en) 2017-01-17
CN102421845B (zh) 2015-02-25
TW201105697A (en) 2011-02-16

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B25A Requested transfer of rights approved

Owner name: HUNTSMAN ADVANCED MATERIALS LICENSING (SWITZERLAND

B06T Formal requirements before examination [chapter 6.20 patent gazette]
B11E Dismissal acc. art. 34 of ipl - requirements for examination incomplete
B11T Dismissal of application maintained [chapter 11.20 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]