CA1018677A - Metallization patterns using the lift-off method - Google Patents

Metallization patterns using the lift-off method

Info

Publication number
CA1018677A
CA1018677A CA215,317A CA215317A CA1018677A CA 1018677 A CA1018677 A CA 1018677A CA 215317 A CA215317 A CA 215317A CA 1018677 A CA1018677 A CA 1018677A
Authority
CA
Canada
Prior art keywords
lift
metallization patterns
metallization
patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA215,317A
Other languages
English (en)
Other versions
CA215317S (en
Inventor
Bohuslav Symersky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA1018677A publication Critical patent/CA1018677A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/482—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes for individual devices provided for in groups H10D8/00 - H10D48/00, e.g. for power transistors
    • H10W20/484—Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
CA215,317A 1973-12-10 1974-12-05 Metallization patterns using the lift-off method Expired CA1018677A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7316851A NL7316851A (nl) 1973-12-10 1973-12-10 Werkwijze voor het vervaardigen van een inrich- ting, in het bijzonder een halfgeleiderinrichting, met een geleiderpatroon op een dragerlichaam, en inrichting, vervaardigd volgens de werkwijze.

Publications (1)

Publication Number Publication Date
CA1018677A true CA1018677A (en) 1977-10-04

Family

ID=19820155

Family Applications (1)

Application Number Title Priority Date Filing Date
CA215,317A Expired CA1018677A (en) 1973-12-10 1974-12-05 Metallization patterns using the lift-off method

Country Status (12)

Country Link
JP (1) JPS5646263B2 (it)
BE (1) BE823138A (it)
BR (1) BR7410276A (it)
CA (1) CA1018677A (it)
CH (1) CH588164A5 (it)
DE (1) DE2455963A1 (it)
ES (1) ES432700A1 (it)
FR (1) FR2254105B1 (it)
GB (1) GB1490715A (it)
IT (1) IT1026859B (it)
NL (1) NL7316851A (it)
SE (1) SE405429B (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111727490A (zh) * 2018-03-02 2020-09-29 东京毅力科创株式会社 用于将图案转移到层的方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5370688A (en) * 1976-12-06 1978-06-23 Toshiba Corp Production of semoconductor device
CN108235597B (zh) * 2018-02-08 2024-02-23 惠州奔达电子有限公司 一种pcb的制作方法及pcb
CN112259455B (zh) * 2020-10-19 2024-01-26 扬州扬杰电子科技股份有限公司 一种改善带钝化层结构的Ag面产品金属残留的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111727490A (zh) * 2018-03-02 2020-09-29 东京毅力科创株式会社 用于将图案转移到层的方法

Also Published As

Publication number Publication date
SE7415380L (it) 1975-06-11
ES432700A1 (es) 1977-03-01
BR7410276A (pt) 1976-06-29
SE405429B (sv) 1978-12-04
BE823138A (fr) 1975-06-09
AU7621174A (en) 1976-06-10
GB1490715A (en) 1977-11-02
JPS5092089A (it) 1975-07-23
CH588164A5 (it) 1977-05-31
NL7316851A (nl) 1975-06-12
FR2254105A1 (it) 1975-07-04
IT1026859B (it) 1978-10-20
JPS5646263B2 (it) 1981-10-31
DE2455963A1 (de) 1975-06-12
FR2254105B1 (it) 1978-06-23

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