CA1038501A - Interconnexion electrique pour dispositifs ceramiques metallises - Google Patents

Interconnexion electrique pour dispositifs ceramiques metallises

Info

Publication number: CA1038501A
Authority: CA; Canada
Prior art keywords: substrates; ceramic; separation; array; pads
Prior art date: 1975-09-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA235,926A

Other languages

English (en)

Other versions

CA235926S (en

Inventor

Billy M. Hargis

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

3M Co

Original Assignee

Minnesota Mining and Manufacturing Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-09-19

Filing date

1975-09-19

Publication date

1978-09-12

1975-09-19 Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co

1975-09-19 Priority to CA235,926A priority Critical patent/CA1038501A/fr

1978-09-12 Application granted granted Critical

1978-09-12 Publication of CA1038501A publication Critical patent/CA1038501A/fr

Status Expired legal-status Critical Current

Links

239000000919 ceramic Substances 0.000 title claims abstract description 53
238000003491 array Methods 0.000 title abstract description 16
238000000926 separation method Methods 0.000 claims abstract description 31
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 12
229910052737 gold Inorganic materials 0.000 claims abstract description 12
239000010931 gold Substances 0.000 claims abstract description 12
238000009713 electroplating Methods 0.000 claims abstract description 9
239000000758 substrate Substances 0.000 claims description 58
238000000034 method Methods 0.000 claims description 17
238000001465 metallisation Methods 0.000 claims description 5
238000010304 firing Methods 0.000 claims description 4
230000000873 masking effect Effects 0.000 claims 1
229910052751 metal Inorganic materials 0.000 abstract description 6
239000002184 metal Substances 0.000 abstract description 6
238000007747 plating Methods 0.000 description 5
LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 4
239000000463 material Substances 0.000 description 4
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
239000000203 mixture Substances 0.000 description 3
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 description 2
238000010276 construction Methods 0.000 description 2
229910052697 platinum Inorganic materials 0.000 description 2
WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
229910052721 tungsten Inorganic materials 0.000 description 2
239000010937 tungsten Substances 0.000 description 2
101000836150 Homo sapiens Transforming acidic coiled-coil-containing protein 3 Proteins 0.000 description 1
102100027048 Transforming acidic coiled-coil-containing protein 3 Human genes 0.000 description 1
239000011230 binding agent Substances 0.000 description 1
230000009977 dual effect Effects 0.000 description 1
239000004615 ingredient Substances 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
238000003475 lamination Methods 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
239000002674 ointment Substances 0.000 description 1
238000004806 packaging method and process Methods 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
230000035515 penetration Effects 0.000 description 1
239000004033 plastic Substances 0.000 description 1
229920003023 plastic Polymers 0.000 description 1
238000004080 punching Methods 0.000 description 1
238000007650 screen-printing Methods 0.000 description 1
238000012216 screening Methods 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
238000005476 soldering Methods 0.000 description 1

Landscapes

Manufacturing Of Printed Wiring (AREA)
Structure Of Printed Boards (AREA)

CA235,926A 1975-09-19 1975-09-19 Interconnexion electrique pour dispositifs ceramiques metallises Expired CA1038501A (fr)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
CA235,926A CA1038501A (fr)	1975-09-19	1975-09-19	Interconnexion electrique pour dispositifs ceramiques metallises

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CA235,926A CA1038501A (fr)	1975-09-19	1975-09-19	Interconnexion electrique pour dispositifs ceramiques metallises

Publications (1)

Publication Number	Publication Date
CA1038501A true CA1038501A (fr)	1978-09-12

Family

ID=4104099

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA235,926A Expired CA1038501A (fr)	1975-09-19	1975-09-19	Interconnexion electrique pour dispositifs ceramiques metallises

Country Status (1)

Country	Link
CA (1)	CA1038501A (fr)

1975
- 1975-09-19 CA CA235,926A patent/CA1038501A/fr not_active Expired

Similar Documents

Publication	Publication Date	Title
US3926746A (en)	1975-12-16	Electrical interconnection for metallized ceramic arrays
CN1741707B (zh)	2010-04-14	包括具有高介电常数的嵌入式电容器的印刷电路板及其制造方法
JP3014310B2 (ja)	2000-02-28	積層配線基板の構造と製作方法
KR102267242B1 (ko)	2021-06-21	적층형 전자부품 및 적층형 전자부품의 제조 방법
GB2115607A (en)	1983-09-07	Semiconductor device and a method of producing the same
GB1106985A (en)	1968-03-20	Method of making multilayer circuit boards
US4525597A (en)	1985-06-25	Ceramic leadless packages and a process for manufacturing the same
KR20040043736A (ko)	2004-05-27	세라믹 다층기판 및 그 제조방법
JP4676964B2 (ja)	2011-04-27	多数個取り基板
CA1038501A (fr)	1978-09-12	Interconnexion electrique pour dispositifs ceramiques metallises
US6221193B1 (en)	2001-04-24	Defect reduction method for screened greensheets and article produced therefrom
JP4219371B2 (ja)	2009-02-04	多数個取り配線基板
JP2737712B2 (ja)	1998-04-08	チップキャリアとその製造方法および素子のマウント方法
JP3740374B2 (ja)	2006-02-01	多数個取り配線基板
JP4436336B2 (ja)	2010-03-24	多数個取り配線基板およびその製造方法
JPS6024093A (ja)	1985-02-06	セラミツク配線基板の製造法
JP4593704B2 (ja)	2010-12-08	セラミック基板の製造方法
JP2009194000A (ja)	2009-08-27	多数個取り配線基板
JPH0785496B2 (ja)	1995-09-13	セラミツク配線基板の製造法
CN117641765A (zh)	2024-03-01	电路板的制备方法
JP4601151B2 (ja)	2010-12-22	多数個取り配線基板の製造方法
JPH0590754A (ja)	1993-04-09	多層回路基板の製造方法
JPH06140764A (ja)	1994-05-20	コンデンサ内蔵多層回路基板
DE10164879B4 (de)	2006-06-08	Verdrahtungssubstrat
JP3940659B2 (ja)	2007-07-04	多層回路基板の製造方法