CA1055164A - Plaquette de circuits multicouche - Google Patents

Plaquette de circuits multicouche

Info

Publication number: CA1055164A
Authority: CA; Canada
Prior art keywords: circuit; layout; artwork; master; board
Prior art date: 1975-07-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA255,356A

Other languages

English (en)

Inventor

Robert Miller

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NCR Voyix Corp

Original Assignee

NCR Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-07-03

Filing date

1976-06-21

Publication date

1979-05-22

1976-06-21 Application filed by NCR Corp filed Critical NCR Corp

1979-05-22 Application granted granted Critical

1979-05-22 Publication of CA1055164A publication Critical patent/CA1055164A/fr

Status Expired legal-status Critical Current

Links

238000000034 method Methods 0.000 claims abstract description 38
239000004020 conductor Substances 0.000 claims abstract description 11
239000011159 matrix material Substances 0.000 claims abstract description 11
238000004519 manufacturing process Methods 0.000 claims abstract description 10
230000008569 process Effects 0.000 claims description 17
239000010410 layer Substances 0.000 abstract description 72
239000011229 interlayer Substances 0.000 abstract description 4
239000002131 composite material Substances 0.000 abstract description 3
238000013461 design Methods 0.000 description 13
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
229910052802 copper Inorganic materials 0.000 description 7
239000010949 copper Substances 0.000 description 7
230000004075 alteration Effects 0.000 description 5
238000009826 distribution Methods 0.000 description 5
238000007747 plating Methods 0.000 description 5
239000000758 substrate Substances 0.000 description 5
230000000875 corresponding effect Effects 0.000 description 4
238000005553 drilling Methods 0.000 description 3
239000011521 glass Substances 0.000 description 3
238000012360 testing method Methods 0.000 description 3
-1 Signal Plane Substances 0.000 description 2
238000010420 art technique Methods 0.000 description 2
230000000593 degrading effect Effects 0.000 description 2
238000009413 insulation Methods 0.000 description 2
238000002955 isolation Methods 0.000 description 2
JCCNYMKQOSZNPW-UHFFFAOYSA-N loratadine Chemical compound C1CN(C(=O)OCC)CCC1=C1C2=NC=CC=C2CCC2=CC(Cl)=CC=C21 JCCNYMKQOSZNPW-UHFFFAOYSA-N 0.000 description 2
238000012986 modification Methods 0.000 description 2
230000004048 modification Effects 0.000 description 2
238000007540 photo-reduction reaction Methods 0.000 description 2
230000009467 reduction Effects 0.000 description 2
238000006722 reduction reaction Methods 0.000 description 2
SGTNSNPWRIOYBX-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-{[2-(3,4-dimethoxyphenyl)ethyl](methyl)amino}-2-(propan-2-yl)pentanenitrile Chemical compound C1=C(OC)C(OC)=CC=C1CCN(C)CCCC(C#N)(C(C)C)C1=CC=C(OC)C(OC)=C1 SGTNSNPWRIOYBX-UHFFFAOYSA-N 0.000 description 1
229920002799 BoPET Polymers 0.000 description 1
241000272470 Circus Species 0.000 description 1
239000005041 Mylar™ Substances 0.000 description 1
230000000712 assembly Effects 0.000 description 1
238000000429 assembly Methods 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
230000008878 coupling Effects 0.000 description 1
238000010168 coupling process Methods 0.000 description 1
238000005859 coupling reaction Methods 0.000 description 1
238000011161 development Methods 0.000 description 1
239000000839 emulsion Substances 0.000 description 1
229910000078 germane Inorganic materials 0.000 description 1
239000011810 insulating material Substances 0.000 description 1
238000010030 laminating Methods 0.000 description 1
239000000463 material Substances 0.000 description 1
239000002184 metal Substances 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002674 ointment Substances 0.000 description 1
229920000136 polysorbate Polymers 0.000 description 1
230000008439 repair process Effects 0.000 description 1
238000007790 scraping Methods 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
239000007787 solid Substances 0.000 description 1
230000002311 subsequent effect Effects 0.000 description 1
239000000126 substance Substances 0.000 description 1
230000002195 synergetic effect Effects 0.000 description 1
238000009827 uniform distribution Methods 0.000 description 1
230000035899 viability Effects 0.000 description 1
239000011800 void material Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Structure Of Printed Boards (AREA)

CA255,356A 1975-07-03 1976-06-21 Plaquette de circuits multicouche Expired CA1055164A (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US59334175A	1975-07-03	1975-07-03

Publications (1)

Publication Number	Publication Date
CA1055164A true CA1055164A (fr)	1979-05-22

Family

ID=24374344

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA255,356A Expired CA1055164A (fr)	1975-07-03	1976-06-21	Plaquette de circuits multicouche

Country Status (5)

Country	Link
JP (1)	JPS526974A (fr)
CA (1)	CA1055164A (fr)
DE (1)	DE2629303C3 (fr)
FR (1)	FR2316833A1 (fr)
GB (1)	GB1535813A (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3020196C2 (de) *	1980-05-28	1982-05-06	Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern	Mehrebenen-Leiterplatte und Verfahren zu deren Herstellung
US4498122A (en) *	1982-12-29	1985-02-05	At&T Bell Laboratories	High-speed, high pin-out LSI chip package
US4894689A (en) *	1984-12-28	1990-01-16	American Telephone And Telegraph Company, At&T Bell Laboratories	Transferred electron device
JPH0834340B2 (ja) *	1988-12-09	1996-03-29	日立化成工業株式会社	配線板およびその製造法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1919421C3 (de) *	1969-04-17	1975-03-13	Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt	Mehrschichtleiterplatte
GB1310880A (en) *	1969-06-13	1973-03-21	Microponent Dev Ltd	Multi-layer printed circuit board assemblies
DE2059425A1 (de) *	1970-12-02	1972-06-22	Siemens Ag	Partieller Aufbau von gedruckten Mehrlagenschaltungen

1976
- 1976-06-18 GB GB2534476A patent/GB1535813A/en not_active Expired
- 1976-06-21 CA CA255,356A patent/CA1055164A/fr not_active Expired
- 1976-06-30 DE DE19762629303 patent/DE2629303C3/de not_active Expired
- 1976-07-02 FR FR7620215A patent/FR2316833A1/fr active Granted
- 1976-07-02 JP JP7880576A patent/JPS526974A/ja active Pending

Also Published As

Publication number	Publication date
JPS526974A (en)	1977-01-19
DE2629303C3 (de)	1981-03-26
DE2629303A1 (de)	1977-01-20
FR2316833A1 (fr)	1977-01-28
DE2629303B2 (de)	1980-07-17
FR2316833B1 (fr)	1982-01-29
GB1535813A (en)	1978-12-13

Publication	Publication Date	Title
US4543715A (en)	1985-10-01	Method of forming vertical traces on printed circuit board
US4799128A (en)	1989-01-17	Multilayer printed circuit board with domain partitioning
US5038252A (en)	1991-08-06	Printed circuit boards with improved electrical current control
US4030190A (en)	1977-06-21	Method for forming a multilayer printed circuit board
EP0469308B1 (fr)	1996-02-28	Plaquette de circuits à multicouches et son procédé de fabrication
US4417393A (en)	1983-11-29	Method of fabricating high density electronic circuits having very narrow conductors
JP3199592B2 (ja)	2001-08-20	多層印刷回路基板
US4170819A (en)	1979-10-16	Method of making conductive via holes in printed circuit boards
US4772864A (en)	1988-09-20	Multilayer circuit prototyping board
EP0028657A4 (fr)	1982-11-08	Panneau de montage de circuits imprimes creux a couches multiples et son procede de fabrication.
GB1571367A (en)	1980-07-16	Printed circuit boards
JP2001053447A (ja)	2001-02-23	部品内蔵型多層配線基板およびその製造方法
US4487993A (en)	1984-12-11	High density electronic circuits having very narrow conductors
US4884170A (en)	1989-11-28	Multilayer printed circuit board and method of producing the same
US4361634A (en)	1982-11-30	Artwork master for production of multilayer circuit board
EP0719079A1 (fr)	1996-06-26	Panneau à circuit imprimé
CA1055164A (fr)	1979-05-22	Plaquette de circuits multicouche
KR930001621B1 (ko)	1993-03-06	다층배선기판 및 이것을 사용하는 반도체 집적 회로장치
JP2000216513A (ja)	2000-08-04	配線基板及びそれを用いた製造方法
JP3408590B2 (ja)	2003-05-19	多層プリント基板の配線構造
JPH05152702A (ja)	1993-06-18	プリント配線板
EP0203203A1 (fr)	1986-12-03	Substrat milticouche pour circuits imprimes
EP0253833B1 (fr)	1991-01-09	Carte de circuits imprimes multicouches
DE3785355T2 (de)	1993-10-21	Vorrichtung und verfahren fuer hochintegrierte verbindungssubstrate unter verwendung von gestapelten moduln.
JPH01276791A (ja)	1989-11-07	金属芯入りプリント配線板