CA1125630A - Conditionnement de polymeres de caprolactame pour le revetement non electrolytique - Google Patents

Conditionnement de polymeres de caprolactame pour le revetement non electrolytique

Info

Publication number: CA1125630A
Authority: CA; Canada
Prior art keywords: solution; caprolactam polymer; polymer substrate; caprolactam; percent
Prior art date: 1978-12-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA342,111A

Other languages

English (en)

Inventor

David A. Dillard

Eileen Maguire

Lawrence P. Donovan

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Crown City Plating Co

Original Assignee

Crown City Plating Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-12-19

Filing date

1979-12-12

Publication date

1982-06-15

1979-12-12 Application filed by Crown City Plating Co filed Critical Crown City Plating Co

1982-06-15 Application granted granted Critical

1982-06-15 Publication of CA1125630A publication Critical patent/CA1125630A/fr

Status Expired legal-status Critical Current

Links

JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 title claims abstract description 69
238000007772 electroless plating Methods 0.000 title claims abstract description 15
229920000642 polymer Polymers 0.000 title claims description 12
230000003750 conditioning effect Effects 0.000 title claims description 6
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Natural products CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims abstract description 33
-1 acetic acid compound Chemical class 0.000 claims abstract description 15
238000005530 etching Methods 0.000 claims abstract description 8
YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 claims abstract description 8
239000007864 aqueous solution Substances 0.000 claims abstract description 6
239000000243 solution Substances 0.000 claims description 49
238000000034 method Methods 0.000 claims description 21
229910052751 metal Inorganic materials 0.000 claims description 17
239000002184 metal Substances 0.000 claims description 17
239000003054 catalyst Substances 0.000 claims description 15
229920000307 polymer substrate Polymers 0.000 claims description 14
229910000510 noble metal Inorganic materials 0.000 claims description 13
229960004319 trichloroacetic acid Drugs 0.000 claims description 7
239000003960 organic solvent Substances 0.000 claims description 5
229910052736 halogen Inorganic materials 0.000 claims description 3
150000002367 halogens Chemical class 0.000 claims description 3
229910052739 hydrogen Inorganic materials 0.000 claims description 3
239000001257 hydrogen Substances 0.000 claims description 3
125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
150000002431 hydrogen Chemical class 0.000 claims 1
239000000758 substrate Substances 0.000 abstract description 18
230000001143 conditioned effect Effects 0.000 abstract description 4
150000007524 organic acids Chemical class 0.000 abstract description 2
125000004432 carbon atom Chemical group C* 0.000 abstract 1
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
239000002253 acid Substances 0.000 description 12
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 11
239000002904 solvent Substances 0.000 description 11
239000003513 alkali Substances 0.000 description 10
238000010899 nucleation Methods 0.000 description 7
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
229910052759 nickel Inorganic materials 0.000 description 6
229910052763 palladium Inorganic materials 0.000 description 6
239000000725 suspension Substances 0.000 description 6
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
150000008044 alkali metal hydroxides Chemical class 0.000 description 5
239000000084 colloidal system Substances 0.000 description 5
229910052802 copper Inorganic materials 0.000 description 5
239000010949 copper Substances 0.000 description 5
239000004033 plastic Substances 0.000 description 5
229920002647 polyamide Polymers 0.000 description 5
239000004952 Polyamide Substances 0.000 description 4
239000012670 alkaline solution Substances 0.000 description 4
239000008367 deionised water Substances 0.000 description 4
229910021641 deionized water Inorganic materials 0.000 description 4
238000007654 immersion Methods 0.000 description 4
HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 4
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
230000002378 acidificating effect Effects 0.000 description 3
239000011248 coating agent Substances 0.000 description 3
238000000576 coating method Methods 0.000 description 3
150000002500 ions Chemical class 0.000 description 3
150000002739 metals Chemical class 0.000 description 3
239000000126 substance Substances 0.000 description 3
ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 2
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
229920002292 Nylon 6 Polymers 0.000 description 2
NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
238000009835 boiling Methods 0.000 description 2
239000003638 chemical reducing agent Substances 0.000 description 2
229910052804 chromium Inorganic materials 0.000 description 2
239000011651 chromium Substances 0.000 description 2
150000001875 compounds Chemical class 0.000 description 2
150000001896 cresols Chemical class 0.000 description 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
229910052737 gold Inorganic materials 0.000 description 2
239000010931 gold Substances 0.000 description 2
BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
150000002989 phenols Chemical class 0.000 description 2
238000007747 plating Methods 0.000 description 2
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
230000001681 protective effect Effects 0.000 description 2
150000003839 salts Chemical class 0.000 description 2
TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
MIMUSZHMZBJBPO-UHFFFAOYSA-N 6-methoxy-8-nitroquinoline Chemical compound N1=CC=CC2=CC(OC)=CC([N+]([O-])=O)=C21 MIMUSZHMZBJBPO-UHFFFAOYSA-N 0.000 description 1
102100035683 Axin-2 Human genes 0.000 description 1
101700047552 Axin-2 Proteins 0.000 description 1
229920006051 Capron® Polymers 0.000 description 1
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
UOACKFBJUYNSLK-XRKIENNPSA-N Estradiol Cypionate Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H](C4=CC=C(O)C=C4CC3)CC[C@@]21C)C(=O)CCC1CCCC1 UOACKFBJUYNSLK-XRKIENNPSA-N 0.000 description 1
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
239000004115 Sodium Silicate Substances 0.000 description 1
229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 1
240000004543 Vicia ervilia Species 0.000 description 1
229960000583 acetic acid Drugs 0.000 description 1
125000000218 acetic acid group Chemical class C(C)(=O)* 0.000 description 1
239000003929 acidic solution Substances 0.000 description 1
150000007513 acids Chemical class 0.000 description 1
230000004913 activation Effects 0.000 description 1
239000012190 activator Substances 0.000 description 1
230000001464 adherent effect Effects 0.000 description 1
229910001854 alkali hydroxide Inorganic materials 0.000 description 1
229910000147 aluminium phosphate Inorganic materials 0.000 description 1
150000001408 amides Chemical class 0.000 description 1
239000012736 aqueous medium Substances 0.000 description 1
239000002585 base Substances 0.000 description 1
239000003637 basic solution Substances 0.000 description 1
229910021538 borax Inorganic materials 0.000 description 1
RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
KDPAWGWELVVRCH-UHFFFAOYSA-N bromoacetic acid Chemical compound OC(=O)CBr KDPAWGWELVVRCH-UHFFFAOYSA-N 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
230000003197 catalytic effect Effects 0.000 description 1
FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 description 1
239000008139 complexing agent Substances 0.000 description 1
150000001879 copper Chemical class 0.000 description 1
229910000365 copper sulfate Inorganic materials 0.000 description 1
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
230000008021 deposition Effects 0.000 description 1
JXTHNDFMNIQAHM-UHFFFAOYSA-N dichloroacetic acid Chemical compound OC(=O)C(Cl)Cl JXTHNDFMNIQAHM-UHFFFAOYSA-N 0.000 description 1
229960005215 dichloroacetic acid Drugs 0.000 description 1
PBWZKZYHONABLN-UHFFFAOYSA-N difluoroacetic acid Chemical compound OC(=O)C(F)F PBWZKZYHONABLN-UHFFFAOYSA-N 0.000 description 1
MCWXGJITAZMZEV-UHFFFAOYSA-N dimethoate Chemical compound CNC(=O)CSP(=S)(OC)OC MCWXGJITAZMZEV-UHFFFAOYSA-N 0.000 description 1
239000006185 dispersion Substances 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
239000000945 filler Substances 0.000 description 1
QEWYKACRFQMRMB-UHFFFAOYSA-N fluoroacetic acid Chemical compound OC(=O)CF QEWYKACRFQMRMB-UHFFFAOYSA-N 0.000 description 1
235000019253 formic acid Nutrition 0.000 description 1
229960004275 glycolic acid Drugs 0.000 description 1
150000007529 inorganic bases Chemical class 0.000 description 1
239000002609 medium Substances 0.000 description 1
239000002923 metal particle Substances 0.000 description 1
229910017604 nitric acid Inorganic materials 0.000 description 1
150000007530 organic bases Chemical class 0.000 description 1
230000001590 oxidative effect Effects 0.000 description 1
229910052697 platinum Inorganic materials 0.000 description 1
LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
230000002035 prolonged effect Effects 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000012266 salt solution Substances 0.000 description 1
230000001235 sensitizing effect Effects 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
229910000029 sodium carbonate Inorganic materials 0.000 description 1
235000017550 sodium carbonate Nutrition 0.000 description 1
235000019795 sodium metasilicate Nutrition 0.000 description 1
239000001488 sodium phosphate Substances 0.000 description 1
235000011006 sodium potassium tartrate Nutrition 0.000 description 1
NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
229910052911 sodium silicate Inorganic materials 0.000 description 1
239000004328 sodium tetraborate Substances 0.000 description 1
235000010339 sodium tetraborate Nutrition 0.000 description 1
239000001119 stannous chloride Substances 0.000 description 1
235000011150 stannous chloride Nutrition 0.000 description 1
230000008646 thermal stress Effects 0.000 description 1
RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
229910000406 trisodium phosphate Inorganic materials 0.000 description 1
235000019801 trisodium phosphate Nutrition 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/14—Chemical modification with acids, their salts or anhydrides
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Chemically Coating (AREA)
ing And Chemical Polishing (AREA)

CA342,111A 1978-12-19 1979-12-12 Conditionnement de polymeres de caprolactame pour le revetement non electrolytique Expired CA1125630A (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US97092978A	1978-12-19	1978-12-19
US970,929		1978-12-19

Publications (1)

Publication Number	Publication Date
CA1125630A true CA1125630A (fr)	1982-06-15

Family

ID=25517722

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA342,111A Expired CA1125630A (fr)	1978-12-19	1979-12-12	Conditionnement de polymeres de caprolactame pour le revetement non electrolytique

Country Status (6)

Country	Link
JP (1)	JPS55100972A (fr)
CA (1)	CA1125630A (fr)
DE (1)	DE2948133A1 (fr)
FR (1)	FR2444692A1 (fr)
GB (1)	GB2040970B (fr)
IT (1)	IT1193252B (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4325991A (en) *	1981-01-05	1982-04-20	Crown City Plating Co.	Electroless plating of polyesters
DE3137587A1 (de) *	1981-09-22	1983-04-14	Schering Ag, 1000 Berlin Und 4619 Bergkamen	Verfahren zur vorbehandlung von formteilen aus polyamiden fuer das aufbringen haftfester, chemisch abgeschiedener metallbeschichtungen
JP2763776B2 (ja) *	1988-05-27	1998-06-11	日本原子力研究所	細孔化コンタクトレンズの製造法
FR2645048B1 (fr) *	1989-04-04	1992-12-11	Ppg Ind France Sa	Procede de traitement de surface de substrats en polyamide pour ameliorer l'adherence des revetements organiques
WO2000015695A1 (fr) *	1998-09-14	2000-03-23	H.B. Fuller Licensing & Financing, Inc.	Composition de primaire et procede d'utilisation correspondant
US7666471B2 (en) *	2006-03-22	2010-02-23	Mark Wojtaszek	Polyimide substrate and method of manufacturing printed wiring board using the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2239539B1 (fr) *	1973-08-01	1976-04-30	Rhone Poulenc Textile

1979
- 1979-11-07 GB GB7938565A patent/GB2040970B/en not_active Expired
- 1979-11-29 DE DE19792948133 patent/DE2948133A1/de not_active Ceased
- 1979-12-12 CA CA342,111A patent/CA1125630A/fr not_active Expired
- 1979-12-17 IT IT28066/79A patent/IT1193252B/it active
- 1979-12-18 FR FR7930962A patent/FR2444692A1/fr active Granted
- 1979-12-19 JP JP16548279A patent/JPS55100972A/ja active Granted

Also Published As

Publication number	Publication date
DE2948133A1 (de)	1980-06-26
JPS55100972A (en)	1980-08-01
FR2444692A1 (fr)	1980-07-18
GB2040970A (en)	1980-09-03
IT1193252B (it)	1988-06-15
JPS639019B2 (fr)	1988-02-25
GB2040970B (en)	1983-07-20
FR2444692B1 (fr)	1984-08-24
IT7928066A0 (it)	1979-12-17

Legal Events

Date	Code	Title	Description
1999-06-15	MKEX	Expiry

Publication	Publication Date	Title
US4335164A (en)	1982-06-15	Conditioning of polyamides for electroless plating
CA1191745A (fr)	1985-08-13	Conditionnement d'un substrat pour le plaquage direct non electrolytique de ses trous et surfaces
CA1246535A (fr)	1988-12-13	Particules de metal catalytique de taille reduite
US6861097B1 (en)	2005-03-01	Electroless plating processes
TWI253481B (en)	2006-04-21	Method for electroless metal plating
CA1081405A (fr)	1980-07-15	Methode d'electrodeposition sans electrodes, par autocatalyse
US5147692A (en)	1992-09-15	Electroless plating of nickel onto surfaces such as copper or fused tungston
JPWO1998045505A1 (ja)	1999-09-07	非導電性プラスチック成形品への電気めっき方法
US5212138A (en)	1993-05-18	Low corrosivity catalyst for activation of copper for electroless nickel plating
JPH0539580A (ja)	1993-02-19	無電解パラジウムめつき液
US3597266A (en)	1971-08-03	Electroless nickel plating
US4315045A (en)	1982-02-09	Conditioning of polyamides for electroless plating
US4325991A (en)	1982-04-20	Electroless plating of polyesters
CA1125630A (fr)	1982-06-15	Conditionnement de polymeres de caprolactame pour le revetement non electrolytique
US7754062B2 (en)	2010-07-13	Method of pretreatment of material to be electrolessly plated
US4325992A (en)	1982-04-20	Electroless plating of polycarbonates
EP0007577A1 (fr)	1980-02-06	Procédé pour améliorer l'adhésion des revêtements métalliques par voie chimique
US4001470A (en)	1977-01-04	Process and bath for the metallization of synthetic-resin
US4035227A (en)	1977-07-12	Method for treating plastic substrates prior to plating
US5468515A (en)	1995-11-21	Composition and method for selective plating
US5219815A (en)	1993-06-15	Low corrosivity catalyst containing ammonium ions for activation of copper for electroless nickel plating
US4321285A (en)	1982-03-23	Electroless plating
US3769061A (en)	1973-10-30	Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating
CA1143260A (fr)	1983-03-22	Preparation de polyamides pour placage non electrolytique
US4309462A (en)	1982-01-05	Conditioning of caprolactam polymers for electroless plating