JPS55100972A - Preparation of caprolactam polymer for nonelectrolytic plating - Google Patents

Preparation of caprolactam polymer for nonelectrolytic plating

Info

Publication number
JPS55100972A
JPS55100972A JP16548279A JP16548279A JPS55100972A JP S55100972 A JPS55100972 A JP S55100972A JP 16548279 A JP16548279 A JP 16548279A JP 16548279 A JP16548279 A JP 16548279A JP S55100972 A JPS55100972 A JP S55100972A
Authority
JP
Japan
Prior art keywords
preparation
nonelectrolytic plating
caprolactam polymer
caprolactam
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16548279A
Other languages
English (en)
Japanese (ja)
Other versions
JPS639019B2 (fr
Inventor
Ei Deiraado Deebitsudo
Magiyuaa Airiin
Pii Donoban Roorensu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Crown City Plating Co
Original Assignee
Crown City Plating Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Crown City Plating Co filed Critical Crown City Plating Co
Publication of JPS55100972A publication Critical patent/JPS55100972A/ja
Publication of JPS639019B2 publication Critical patent/JPS639019B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemically Coating (AREA)
  • ing And Chemical Polishing (AREA)
JP16548279A 1978-12-19 1979-12-19 Preparation of caprolactam polymer for nonelectrolytic plating Granted JPS55100972A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US97092978A 1978-12-19 1978-12-19

Publications (2)

Publication Number Publication Date
JPS55100972A true JPS55100972A (en) 1980-08-01
JPS639019B2 JPS639019B2 (fr) 1988-02-25

Family

ID=25517722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16548279A Granted JPS55100972A (en) 1978-12-19 1979-12-19 Preparation of caprolactam polymer for nonelectrolytic plating

Country Status (6)

Country Link
JP (1) JPS55100972A (fr)
CA (1) CA1125630A (fr)
DE (1) DE2948133A1 (fr)
FR (1) FR2444692A1 (fr)
GB (1) GB2040970B (fr)
IT (1) IT1193252B (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4325991A (en) * 1981-01-05 1982-04-20 Crown City Plating Co. Electroless plating of polyesters
DE3137587A1 (de) * 1981-09-22 1983-04-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zur vorbehandlung von formteilen aus polyamiden fuer das aufbringen haftfester, chemisch abgeschiedener metallbeschichtungen
JP2763776B2 (ja) * 1988-05-27 1998-06-11 日本原子力研究所 細孔化コンタクトレンズの製造法
FR2645048B1 (fr) * 1989-04-04 1992-12-11 Ppg Ind France Sa Procede de traitement de surface de substrats en polyamide pour ameliorer l'adherence des revetements organiques
WO2000015695A1 (fr) * 1998-09-14 2000-03-23 H.B. Fuller Licensing & Financing, Inc. Composition de primaire et procede d'utilisation correspondant
US7666471B2 (en) * 2006-03-22 2010-02-23 Mark Wojtaszek Polyimide substrate and method of manufacturing printed wiring board using the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2239539B1 (fr) * 1973-08-01 1976-04-30 Rhone Poulenc Textile

Also Published As

Publication number Publication date
DE2948133A1 (de) 1980-06-26
FR2444692A1 (fr) 1980-07-18
GB2040970A (en) 1980-09-03
IT1193252B (it) 1988-06-15
JPS639019B2 (fr) 1988-02-25
GB2040970B (en) 1983-07-20
FR2444692B1 (fr) 1984-08-24
CA1125630A (fr) 1982-06-15
IT7928066A0 (it) 1979-12-17

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