CA1138562A - Cooling apparatus for semiconductor elements - Google Patents

Cooling apparatus for semiconductor elements

Info

Publication number
CA1138562A
CA1138562A CA000331260A CA331260A CA1138562A CA 1138562 A CA1138562 A CA 1138562A CA 000331260 A CA000331260 A CA 000331260A CA 331260 A CA331260 A CA 331260A CA 1138562 A CA1138562 A CA 1138562A
Authority
CA
Canada
Prior art keywords
cooling
elements
heat conducting
flow
cooling element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000331260A
Other languages
English (en)
French (fr)
Inventor
Peter Knapp
Xaver Vogel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Application granted granted Critical
Publication of CA1138562A publication Critical patent/CA1138562A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H10W40/613—Bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CA000331260A 1978-07-21 1979-07-06 Cooling apparatus for semiconductor elements Expired CA1138562A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH787578 1978-07-21
CH7875/78 1978-07-21
CH1299278 1978-12-21
CH12992/78 1978-12-21

Publications (1)

Publication Number Publication Date
CA1138562A true CA1138562A (en) 1982-12-28

Family

ID=25702383

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000331260A Expired CA1138562A (en) 1978-07-21 1979-07-06 Cooling apparatus for semiconductor elements

Country Status (8)

Country Link
AT (1) AT383228B (de)
BR (1) BR7904617A (de)
CA (1) CA1138562A (de)
DE (1) DE2902771A1 (de)
FR (1) FR2431769B1 (de)
GB (1) GB2026238A (de)
NL (1) NL7905603A (de)
SE (1) SE443475B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057956A (ja) * 1983-09-09 1985-04-03 Furukawa Electric Co Ltd:The 半導体用ヒ−トパイプ放熱器
DE4131739C2 (de) * 1991-09-24 1996-12-19 Behr Industrietech Gmbh & Co Kühleinrichtung für elektrische Bauelemente
JPH0637219A (ja) * 1992-07-16 1994-02-10 Fuji Electric Co Ltd パワー半導体装置の冷却装置
DE4301865A1 (de) * 1993-01-25 1994-07-28 Abb Management Ag Kühldose
JP3090954B2 (ja) * 1996-01-04 2000-09-25 ダイムラークライスラー アクチエンゲゼルシャフト ピンを備えた冷却部材
DE19600166A1 (de) * 1996-01-04 1997-07-17 Daimler Benz Ag Kühlkörper mit verbessertem Strömungswiderstand
DE19727912C1 (de) * 1997-07-01 1998-10-29 Daimler Benz Ag Kühlkörper für Leistungsbauelemente
DE10102621B4 (de) * 2001-01-20 2006-05-24 Conti Temic Microelectronic Gmbh Leistungsmodul
ITTO20040517A1 (it) * 2004-07-23 2004-10-23 Johnson Electric Moncalieri Srl Struttura dissipatrice del calore per dispositivi elettronici e simili
DE102014102262A1 (de) * 2014-02-21 2015-08-27 Maschinenfabrik Reinhausen Gmbh Schalteinrichtung
CN112338207B (zh) * 2020-11-20 2025-01-21 湖北勋基建筑工程有限公司 一种增材工件点阵循环冷却机构
CN116855892B (zh) * 2023-09-05 2023-12-08 上海陛通半导体能源科技股份有限公司 一种高产能AlSi或AlSiCu薄膜的沉积方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1439022B2 (de) * 1960-05-03 1974-03-21 Siemens Ag, 1000 Berlin U. 8000 Muenchen Kühlkörper für ein Halbleiterbauelement
DE2008800A1 (de) * 1970-02-21 1971-09-16 Licentia Gmbh Stromrichterschrank oder gestell
FR2087762A5 (de) * 1970-05-29 1971-12-31 Comp Generale Electricite
CA1026013A (en) * 1975-03-17 1978-02-07 Canadian General Electric Company Limited Heat sink
DE2640000C2 (de) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben

Also Published As

Publication number Publication date
ATA428579A (de) 1986-10-15
FR2431769A1 (fr) 1980-02-15
BR7904617A (pt) 1980-04-08
DE2902771A1 (de) 1980-01-31
AT383228B (de) 1987-06-10
NL7905603A (nl) 1980-01-23
SE443475B (sv) 1986-02-24
SE7906190L (sv) 1980-01-22
GB2026238A (en) 1980-01-30
FR2431769B1 (fr) 1985-06-28

Similar Documents

Publication Publication Date Title
US5239200A (en) Apparatus for cooling integrated circuit chips
EP0603860B1 (de) Leistungsmodulkühlsystem
CA1228893A (en) Semiconductor valve
US5495889A (en) Cooling device for power electronic components
US4675783A (en) Heat pipe heat sink for semiconductor devices
EP1089604A1 (de) Kühlkörper
EP0196863A1 (de) Kühlungssystem für elektronische Schaltungsanlagen
GB2026238A (en) Cooling apparatus for electrical elements
DE4322665A1 (de) Kühlvorrichtung für eine Halbleiterleistungsvorrichtung
KR102492324B1 (ko) 2중 구조를 갖는 복층형 반도체 냉각 장치
WO2015003967A1 (en) Electric converter with compact module arrangement for subsea applications
US6345665B1 (en) Cooling system
US20230284377A1 (en) Power electronics assemblies and methods of fabricating the same
DE9309428U1 (de) Stromrichtermodul
EP0234021B1 (de) Vorrichtung für eine Flüssigkeitskühlung eines elektrischen Bauelementes, insbesondere Halbleiter-Bauelementes
CN218827074U (zh) 一种微通道散热器
DE3740233C2 (de)
CN115942724B (zh) 一种液冷散热板
EP0401743B1 (de) Kühlvorrichtung mit elektrisch isoliertem Wärmerohr für Halbleiter
US3007088A (en) Rectifier and means for mounting the same
CN117790440A (zh) 一种用于3d-ic的微通道相变散热装置
CN212304193U (zh) 一种用于高功率半导体激光器的冷板
CN219718881U (zh) 水冷散热结构以及电子设备
CN217336255U (zh) 冷却器和冷却式电气装置组件
RU228672U1 (ru) Силовой выпрямительный модуль для электротехнических комплексов и систем преобразования электрической энергии

Legal Events

Date Code Title Description
MKEX Expiry