CA1145423A - Condensateur en pastille soudable de maniere non rigide - Google Patents

Condensateur en pastille soudable de maniere non rigide

Info

Publication number
CA1145423A
CA1145423A CA000338300A CA338300A CA1145423A CA 1145423 A CA1145423 A CA 1145423A CA 000338300 A CA000338300 A CA 000338300A CA 338300 A CA338300 A CA 338300A CA 1145423 A CA1145423 A CA 1145423A
Authority
CA
Canada
Prior art keywords
electrodes
capacitor
portions
ceramic
support means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000338300A
Other languages
English (en)
Inventor
John L. Galvagni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Avx Components Corp
Original Assignee
AVX Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AVX Corp filed Critical AVX Corp
Application granted granted Critical
Publication of CA1145423A publication Critical patent/CA1145423A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CA000338300A 1978-11-16 1979-10-24 Condensateur en pastille soudable de maniere non rigide Expired CA1145423A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US96124778A 1978-11-16 1978-11-16
US961,247 1978-11-16

Publications (1)

Publication Number Publication Date
CA1145423A true CA1145423A (fr) 1983-04-26

Family

ID=25504239

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000338300A Expired CA1145423A (fr) 1978-11-16 1979-10-24 Condensateur en pastille soudable de maniere non rigide

Country Status (5)

Country Link
JP (1) JPS5571018A (fr)
CA (1) CA1145423A (fr)
DE (1) DE2942704A1 (fr)
FR (1) FR2441912A1 (fr)
GB (1) GB2034521B (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58196007A (ja) * 1982-05-12 1983-11-15 日本電気株式会社 微小電子部品
US4618911A (en) * 1984-11-19 1986-10-21 Sfe Technologies End termination for chip capacitor
JP2915716B2 (ja) * 1992-08-26 1999-07-05 ティーディーケイ株式会社 電子部品
JP3747940B2 (ja) * 2004-06-03 2006-02-22 株式会社村田製作所 積層コンデンサおよびその製造方法
JP4803451B2 (ja) * 2006-12-26 2011-10-26 Ｔｄｋ株式会社 電子部品及びその実装構造
CN114241905B (zh) * 2021-12-04 2024-01-23 昆山国显光电有限公司 显示模组及显示装置
KR102736853B1 (ko) * 2022-07-04 2024-11-29 이성재 방수기능을 갖는 바닥 코어용 멀티코어장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1826276U (de) * 1959-06-23 1961-02-09 Messwandler Bau Gmbh Elektrischer flachwickelkondensator, insbesondere fuer hochspannungs- und hochstrom-stosspruefanlagen.
GB1117437A (en) * 1965-10-05 1968-06-19 Gen Electric Improvements in molded electronic component
FR1495139A (fr) * 1966-09-23 1967-09-15 Gen Electric Eléments moulés pour circuits électriques ou électroniques
US3590348A (en) * 1969-12-29 1971-06-29 Erie Technological Prod Inc Radial lead ceramic capacitor with integral standoff feet
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit

Also Published As

Publication number Publication date
FR2441912A1 (fr) 1980-06-13
GB2034521B (en) 1983-07-27
JPS5571018A (en) 1980-05-28
DE2942704A1 (de) 1980-05-29
FR2441912B1 (fr) 1984-04-20
JPS6133246B2 (fr) 1986-08-01
GB2034521A (en) 1980-06-04

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Legal Events

Date Code Title Description
MKEX Expiry