CA1243131A - Self-registration method of manufacturing a semiconductor device - Google Patents

Self-registration method of manufacturing a semiconductor device

Info

Publication number
CA1243131A
CA1243131A CA000490539A CA490539A CA1243131A CA 1243131 A CA1243131 A CA 1243131A CA 000490539 A CA000490539 A CA 000490539A CA 490539 A CA490539 A CA 490539A CA 1243131 A CA1243131 A CA 1243131A
Authority
CA
Canada
Prior art keywords
opening
layer
semiconductor
edge
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000490539A
Other languages
English (en)
French (fr)
Inventor
Johannes A. Appels
Henricus G.R. Maas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA1243131A publication Critical patent/CA1243131A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00—Bipolar junction transistors [BJT]
    • H10D10/01—Manufacture or treatment
    • H10D10/051—Manufacture or treatment of vertical BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
    • H10P32/1408—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers
    • H10P32/1414—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers the applied layer being silicon, silicide or SIPOS, e.g. polysilicon or porous silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
    • H10P32/171—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
    • H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4451—Semiconductor materials, e.g. polysilicon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/011—Bipolar transistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/051—Etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/103—Mask, dual function, e.g. diffusion and oxidation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/911—Differential oxidation and etching

Landscapes

  • Bipolar Transistors (AREA)
CA000490539A 1984-09-18 1985-09-12 Self-registration method of manufacturing a semiconductor device Expired CA1243131A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8402856A NL8402856A (nl) 1984-09-18 1984-09-18 Werkwijze voor het vervaardigen van een halfgeleiderinrichting.
NL8402856 1984-09-18

Publications (1)

Publication Number Publication Date
CA1243131A true CA1243131A (en) 1988-10-11

Family

ID=19844483

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000490539A Expired CA1243131A (en) 1984-09-18 1985-09-12 Self-registration method of manufacturing a semiconductor device

Country Status (6)

Country Link
US (1) US4689872A (2)
EP (1) EP0180256B1 (2)
JP (1) JPS6174370A (2)
CA (1) CA1243131A (2)
DE (1) DE3574525D1 (2)
NL (1) NL8402856A (2)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4722908A (en) * 1986-08-28 1988-02-02 Fairchild Semiconductor Corporation Fabrication of a bipolar transistor with a polysilicon ribbon
GB8621535D0 (en) * 1986-09-08 1986-10-15 British Telecomm Bipolar fabrication process
GB8621536D0 (en) * 1986-09-08 1986-10-15 British Telecomm Bipolar fabrication process
US5067002A (en) * 1987-01-30 1991-11-19 Motorola, Inc. Integrated circuit structures having polycrystalline electrode contacts
US4837176A (en) * 1987-01-30 1989-06-06 Motorola Inc. Integrated circuit structures having polycrystalline electrode contacts and process
GB2204992A (en) * 1987-05-05 1988-11-23 British Telecomm Bipolar transistor
US4772566A (en) * 1987-07-01 1988-09-20 Motorola Inc. Single tub transistor means and method
US5132765A (en) * 1989-09-11 1992-07-21 Blouse Jeffrey L Narrow base transistor and method of fabricating same
US5008207A (en) * 1989-09-11 1991-04-16 International Business Machines Corporation Method of fabricating a narrow base transistor
GB2236901A (en) * 1989-09-20 1991-04-17 Philips Nv A method of manufacturing a semiconductor device
NL9100062A (nl) * 1991-01-14 1992-08-03 Philips Nv Werkwijze ter vervaardiging van een halfgeleiderinrichting.
US5171705A (en) * 1991-11-22 1992-12-15 Supertex, Inc. Self-aligned structure and process for DMOS transistor
US5414283A (en) * 1993-11-19 1995-05-09 Ois Optical Imaging Systems, Inc. TFT with reduced parasitic capacitance
US6110798A (en) 1996-01-05 2000-08-29 Micron Technology, Inc. Method of fabricating an isolation structure on a semiconductor substrate
US6465865B1 (en) * 1996-01-05 2002-10-15 Micron Technology, Inc. Isolated structure and method of fabricating such a structure on a substrate
US6656845B2 (en) * 2002-02-15 2003-12-02 Taiwan Semiconductor Manufacturing Co., Ltd Method for forming semiconductor substrate with convex shaped active region
US6784076B2 (en) * 2002-04-08 2004-08-31 Micron Technology, Inc. Process for making a silicon-on-insulator ledge by implanting ions from silicon source
JP2004335662A (ja) 2003-05-06 2004-11-25 Canon Inc 部材及び部材の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3886569A (en) * 1970-01-22 1975-05-27 Ibm Simultaneous double diffusion into a semiconductor substrate
US4127931A (en) * 1974-10-04 1978-12-05 Nippon Electric Co., Ltd. Semiconductor device
US4074304A (en) * 1974-10-04 1978-02-14 Nippon Electric Company, Ltd. Semiconductor device having a miniature junction area and process for fabricating same
JPS5293278A (en) * 1976-01-30 1977-08-05 Matsushita Electronics Corp Manufacture for mos type semiconductor intergrated circuit
US4506437A (en) * 1978-05-26 1985-03-26 Rockwell International Corporation Process for and structure of high density VLSI circuits, having self-aligned gates and contacts for FET devices and conducting lines
US4305760A (en) * 1978-12-22 1981-12-15 Ncr Corporation Polysilicon-to-substrate contact processing
US4285117A (en) * 1979-09-06 1981-08-25 Teletype Corporation Method of manufacturing a device in a silicon wafer
FR2508704B1 (fr) * 1981-06-26 1985-06-07 Thomson Csf Procede de fabrication de transistors bipolaires integres de tres petites dimensions
JPS5946105B2 (ja) * 1981-10-27 1984-11-10 日本電信電話株式会社 バイポ−ラ型トランジスタ装置及びその製法
NL8105920A (nl) * 1981-12-31 1983-07-18 Philips Nv Halfgeleiderinrichting en werkwijze voor het vervaardigen van een dergelijke halfgeleiderinrichting.
US4507171A (en) * 1982-08-06 1985-03-26 International Business Machines Corporation Method for contacting a narrow width PN junction region
US4545114A (en) * 1982-09-30 1985-10-08 Fujitsu Limited Method of producing semiconductor device
JPS5975661A (ja) * 1982-10-22 1984-04-28 Fujitsu Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
NL8402856A (nl) 1986-04-16
DE3574525D1 (de) 1990-01-04
JPS6174370A (ja) 1986-04-16
EP0180256B1 (en) 1989-11-29
EP0180256A1 (en) 1986-05-07
JPH0521338B2 (2) 1993-03-24
US4689872A (en) 1987-09-01

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