CA1336061C - High-oxygen-content silicon monocrystal substrate for semiconductor devices and production method therefor - Google Patents

High-oxygen-content silicon monocrystal substrate for semiconductor devices and production method therefor

Info

Publication number
CA1336061C
CA1336061C CA000520610A CA520610A CA1336061C CA 1336061 C CA1336061 C CA 1336061C CA 000520610 A CA000520610 A CA 000520610A CA 520610 A CA520610 A CA 520610A CA 1336061 C CA1336061 C CA 1336061C
Authority
CA
Canada
Prior art keywords
silicon
monocrystal
crucible
set forth
melt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA000520610A
Other languages
English (en)
French (fr)
Inventor
Yasaburo Kato
Motonobu Futagami
Toshihiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Application granted granted Critical
Publication of CA1336061C publication Critical patent/CA1336061C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2902Materials being Group IVA materials
    • H10P14/2905Silicon, silicon germanium or germanium
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/30Mechanisms for rotating or moving either the melt or the crystal
    • C30B15/305Stirring of the melt
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
CA000520610A 1985-10-31 1986-10-16 High-oxygen-content silicon monocrystal substrate for semiconductor devices and production method therefor Expired - Fee Related CA1336061C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60244562A JPS62105998A (ja) 1985-10-31 1985-10-31 シリコン基板の製法
JP60-244562 1985-10-31

Publications (1)

Publication Number Publication Date
CA1336061C true CA1336061C (en) 1995-06-27

Family

ID=17120560

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000520610A Expired - Fee Related CA1336061C (en) 1985-10-31 1986-10-16 High-oxygen-content silicon monocrystal substrate for semiconductor devices and production method therefor

Country Status (14)

Country Link
JP (1) JPS62105998A (it)
KR (1) KR870004498A (it)
CN (1) CN1016191B (it)
AT (1) ATA289086A (it)
AU (1) AU597599B2 (it)
CA (1) CA1336061C (it)
DE (1) DE3637006A1 (it)
DK (1) DK518486A (it)
FR (1) FR2589489B1 (it)
GB (1) GB2182262B (it)
IT (1) IT1198454B (it)
MY (1) MY100449A (it)
NL (1) NL8602738A (it)
SE (1) SE8604627L (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9938634B2 (en) 2013-05-29 2018-04-10 Shin-Etsu Handotai Co., Ltd. Method of producing silicon single crystal

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196085A (en) * 1990-12-28 1993-03-23 Massachusetts Institute Of Technology Active magnetic flow control in Czochralski systems
JP2613498B2 (ja) * 1991-03-15 1997-05-28 信越半導体株式会社 Si単結晶ウエーハの熱処理方法
JPH07247197A (ja) * 1994-03-09 1995-09-26 Fujitsu Ltd 半導体装置とその製造方法
JP3443822B2 (ja) * 1996-03-27 2003-09-08 信越半導体株式会社 シリコン単結晶の製造方法
DE19711922A1 (de) * 1997-03-21 1998-09-24 Wacker Siltronic Halbleitermat Vorrichtung und Verfahren zum Ziehen eines Einkristalls
EP1273684B1 (en) 1997-04-09 2005-09-14 MEMC Electronic Materials, Inc. Low defect density, vacancy dominated silicon
US6379642B1 (en) 1997-04-09 2002-04-30 Memc Electronic Materials, Inc. Vacancy dominated, defect-free silicon
MY135749A (en) 1997-04-09 2008-06-30 Memc Electronic Materials Process for producing low defect density, ideal oxygen precipitating silicon
JPH11268987A (ja) * 1998-03-20 1999-10-05 Shin Etsu Handotai Co Ltd シリコン単結晶およびその製造方法
JP2003517412A (ja) 1998-06-26 2003-05-27 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 任意に大きい直径を有する無欠陥シリコン結晶の成長方法
KR100581305B1 (ko) 1998-09-02 2006-05-22 엠이엠씨 일렉트로닉 머티리얼즈 인코포레이티드 저결함 밀도 단결정 실리콘으로부터의 soi 구조체
US6312516B2 (en) 1998-10-14 2001-11-06 Memc Electronic Materials, Inc. Process for preparing defect free silicon crystals which allows for variability in process conditions
KR20010034789A (ko) 1998-10-14 2001-04-25 헨넬리 헬렌 에프 실질적으로 성장 결점이 없는 에피택시얼 실리콘 웨이퍼
US6416836B1 (en) 1998-10-14 2002-07-09 Memc Electronic Materials, Inc. Thermally annealed, low defect density single crystal silicon
UA70313C2 (en) * 2000-08-21 2004-10-15 Close Corp Pillar Close Corp P A method for growing silicon monocrystals of the ma method for growing silicon monocrystals of the melt elt
US6858307B2 (en) 2000-11-03 2005-02-22 Memc Electronic Materials, Inc. Method for the production of low defect density silicon
US7105050B2 (en) 2000-11-03 2006-09-12 Memc Electronic Materials, Inc. Method for the production of low defect density silicon
US6846539B2 (en) 2001-01-26 2005-01-25 Memc Electronic Materials, Inc. Low defect density silicon having a vacancy-dominated core substantially free of oxidation induced stacking faults
DE10103691A1 (de) * 2001-01-26 2002-08-08 Crystal Growing Systems Gmbh Elektrische Energieversorgung für eine elektrische Heizung
WO2007137182A2 (en) 2006-05-19 2007-11-29 Memc Electronic Materials, Inc. Controlling agglomerated point defect and oxygen cluster formation induced by the lateral surface of a silicon single crystal during cz growth
CN105780113B (zh) * 2016-03-10 2017-11-28 江西赛维Ldk太阳能高科技有限公司 一种表征晶体硅生长界面和生长速度的方法
CN112095154B (zh) * 2019-06-18 2021-05-14 上海新昇半导体科技有限公司 一种半导体晶体生长装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5556098A (en) * 1978-10-17 1980-04-24 Chiyou Lsi Gijutsu Kenkyu Kumiai Method and apparatus for producing si single crystal rod
EP0042901B1 (fr) * 1980-06-26 1984-10-31 International Business Machines Corporation Procédé pour contrôler la teneur en oxygène des barreaux de silicium tirés selon la méthode de Czochralski
GB2084046B (en) * 1980-08-27 1984-07-25 Secr Defence Method and apparatus for crystal growth
CA1191075A (en) * 1980-12-29 1985-07-30 Roger A. Frederick Method for regulating concentration and distribution of oxygen in czochralski grown silicon
NL8102102A (nl) * 1981-04-29 1982-11-16 Philips Nv Werkwijze voor het optrekken van een siliciumstaaf en halfgeleiderinrichting vervaardigd uit de siliciumstaaf.
JPH0244799B2 (ja) * 1981-10-26 1990-10-05 Sony Corp Ketsushoseichohoho
US4511428A (en) * 1982-07-09 1985-04-16 International Business Machines Corporation Method of controlling oxygen content and distribution in grown silicon crystals
JPS6027684A (ja) * 1983-07-26 1985-02-12 Fujitsu Ltd 単結晶製造装置
JPS6033289A (ja) * 1983-07-29 1985-02-20 Toshiba Corp シリコン単結晶の製造方法
JPS6094722A (ja) * 1983-08-16 1985-05-27 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション シリコン・ウエハ
JPS6153187A (ja) * 1984-08-24 1986-03-17 Sony Corp 単結晶成長装置
IT1207497B (it) * 1985-05-29 1989-05-25 Montedison Spa Monocristalli di arseniuro di gallio a bassa densita' di dislocazioni e di elevata purezza.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9938634B2 (en) 2013-05-29 2018-04-10 Shin-Etsu Handotai Co., Ltd. Method of producing silicon single crystal

Also Published As

Publication number Publication date
SE8604627L (sv) 1987-05-01
GB8626074D0 (en) 1986-12-03
DK518486D0 (da) 1986-10-30
CN1016191B (zh) 1992-04-08
DK518486A (da) 1987-05-01
IT8648592A1 (it) 1988-04-28
SE8604627D0 (sv) 1986-10-30
CN86106346A (zh) 1987-06-17
IT1198454B (it) 1988-12-21
AU6455086A (en) 1987-05-07
KR870004498A (ko) 1987-05-09
JPS62105998A (ja) 1987-05-16
FR2589489A1 (fr) 1987-05-07
FR2589489B1 (fr) 1994-06-10
ATA289086A (de) 1996-01-15
GB2182262A (en) 1987-05-13
MY100449A (en) 1990-10-15
IT8648592A0 (it) 1986-10-28
GB2182262B (en) 1989-09-27
AU597599B2 (en) 1990-06-07
NL8602738A (nl) 1987-05-18
DE3637006A1 (de) 1987-05-07

Similar Documents

Publication Publication Date Title
CA1336061C (en) High-oxygen-content silicon monocrystal substrate for semiconductor devices and production method therefor
KR100582240B1 (ko) 실리콘 단결정 웨이퍼 및 그 제조방법
EP2142686B1 (en) Method for producing a single crystal
US6702892B2 (en) Production device for high-quality silicon single crystals
EP1310583B1 (en) Method for manufacturing of silicon single crystal wafer
KR100364555B1 (ko) 고품질 실리콘 단결정의 제조방법
EP0140509B1 (en) An lec method and apparatus for growing single crystal
US8920560B2 (en) Method for manufacturing epitaxial wafer
KR100453850B1 (ko) 웨이퍼주변부에결정결함이없는실리콘단결정
KR100582241B1 (ko) 질소 도프된 저결함 실리콘 단결정의 제조방법
KR100840751B1 (ko) 고품질 실리콘 단결정 잉곳 제조 방법, 성장 장치 및그로부터 제조된 잉곳 , 웨이퍼
US7258744B2 (en) Graphite heater for producing single crystal, apparatus for producing single crystal, and method for producing single crystal
KR100793950B1 (ko) 실리콘 단결정 잉곳 및 그 성장방법
JP3086850B2 (ja) 単結晶の成長方法及び装置
US6267817B1 (en) Methods of forming semiconductor wafers, methods of treating semiconductor wafers to alleviate slip generation, ingots of semiconductive material, and wafers of semiconductive material
US7374614B2 (en) Method for manufacturing single crystal semiconductor
CN114808112B (zh) 一种单晶生长方法及晶圆
US5611857A (en) Apparatus for producing single crystals
JP2000044387A (ja) シリコン単結晶製造方法
KR100221087B1 (ko) 실리콘 단결정 성장 방법 및 실리콘 단결정
JPS6033297A (ja) 単結晶半導体引上装置
RU2177513C1 (ru) Способ выращивания монокристаллов кремния
JPH08333189A (ja) 結晶引き上げ装置
JPH0782084A (ja) 単結晶成長方法及び単結晶成長装置
JP2000264785A (ja) シリコン単結晶の製造方法およびその製造装置

Legal Events

Date Code Title Description
MKLA Lapsed