CA2000382A1 - Connecteur a haute densite, et integrite accrue de signal - Google Patents

Connecteur a haute densite, et integrite accrue de signal

Info

Publication number
CA2000382A1
CA2000382A1 CA2000382A CA2000382A CA2000382A1 CA 2000382 A1 CA2000382 A1 CA 2000382A1 CA 2000382 A CA2000382 A CA 2000382A CA 2000382 A CA2000382 A CA 2000382A CA 2000382 A1 CA2000382 A1 CA 2000382A1
Authority
CA
Canada
Prior art keywords
connector
signal integrity
heat
memory alloy
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2000382A
Other languages
English (en)
Other versions
CA2000382C (fr
Inventor
Michael Perry
Gary Yasumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beta Phase Inc
Original Assignee
Beta Phase Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/255,500 external-priority patent/US4881908A/en
Application filed by Beta Phase Inc filed Critical Beta Phase Inc
Publication of CA2000382A1 publication Critical patent/CA2000382A1/fr
Application granted granted Critical
Publication of CA2000382C publication Critical patent/CA2000382C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/01—Connections using shape memory materials, e.g. shape memory metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/83—Coupling devices connected with low or zero insertion force connected with pivoting of printed circuits or like after insertion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
CA002000382A 1988-10-11 1989-10-10 Connecteur a haute densite, et integrite accrue de signal Expired - Fee Related CA2000382C (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US255,500 1988-10-11
US07/255,500 US4881908A (en) 1988-10-11 1988-10-11 High density and high signal integrity connector
US388,832 1989-08-03
US07/388,832 US4911643A (en) 1988-10-11 1989-08-03 High density and high signal integrity connector

Publications (2)

Publication Number Publication Date
CA2000382A1 true CA2000382A1 (fr) 1990-04-11
CA2000382C CA2000382C (fr) 2000-04-18

Family

ID=26944736

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002000382A Expired - Fee Related CA2000382C (fr) 1988-10-11 1989-10-10 Connecteur a haute densite, et integrite accrue de signal

Country Status (6)

Country Link
US (2) US4911643A (fr)
EP (2) EP0438504B1 (fr)
JP (1) JP2848464B2 (fr)
CA (1) CA2000382C (fr)
DE (2) DE68929198T2 (fr)
WO (1) WO1990004270A1 (fr)

Families Citing this family (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5038201A (en) * 1988-11-08 1991-08-06 Westinghouse Electric Corp. Wafer scale integrated circuit apparatus
US5044980A (en) * 1990-01-16 1991-09-03 Beta Phase, Inc. High density and multiple insertion connector
US5159751A (en) * 1990-02-05 1992-11-03 Motorola, Inc. Method of manufacturing electronic module assembly
US5156553A (en) * 1990-05-29 1992-10-20 Kel Corporation Connector assembly for film circuitry
US5040997A (en) * 1990-06-08 1991-08-20 The Foxboro Company Flex circuit connector assembly and method for manufacturing the same
NL9001347A (nl) * 1990-06-14 1992-01-02 Burndy Electra Nv Contactsamenstel.
US5364277A (en) * 1990-09-11 1994-11-15 Hughes Aircraft Company Three-dimensional electroformed circuitry
US5102343A (en) * 1991-02-22 1992-04-07 International Business Machines Corporation Fluid pressure actuated electrical connector
US5507651A (en) * 1991-04-22 1996-04-16 Kel Corporation Connector assembly for film circuitry
SE468535B (sv) * 1991-06-14 1993-02-01 Ericsson Telefon Ab L M Anordning foer kontaktering av skaermade ledningar
US5133667A (en) * 1991-06-20 1992-07-28 Digital Equipment Corporation Flexible circuit connector
US5161986A (en) * 1991-10-15 1992-11-10 Ceridian Corporation Low inductance circuit apparatus with controlled impedance cross-unders and connector for connecting to backpanels
JPH07505007A (ja) * 1991-11-18 1995-06-01 バーグ・テクノロジー・インコーポレーテッド フレキシブル回路用低挿入力コネクタシステム
US5240420A (en) * 1992-03-31 1993-08-31 Research Organization For Circuit Knowledge Self-aligning high-density printed circuit connector
US6205654B1 (en) * 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US5308257A (en) * 1993-02-01 1994-05-03 The Whitaker Corporation ZIF card edge connector utilizing flexible film circuitry
US5409384A (en) * 1993-04-08 1995-04-25 The Whitaker Corporation Low profile board-to-board electrical connector
US5499924A (en) * 1993-07-12 1996-03-19 Kel Comporation Butt joint connector assembly
DE69423360T2 (de) * 1993-07-29 2000-12-07 Beta Phase Inc., Menlo Park Verbindungsvorrichtung zur elektrischen verbindung zwischen leiterplattenähnlichen elementen
JPH07312469A (ja) * 1994-05-16 1995-11-28 Nippon Mektron Ltd 多層フレキシブル回路基板の屈曲部構造
US5505625A (en) * 1994-05-17 1996-04-09 Beta Phase, Inc. Connector assembly for electrically interconnecting two printed circuit board like members
US5564931A (en) * 1994-05-24 1996-10-15 The Whitaker Corporation. Card edge connector using flexible film circuitry
US5501612A (en) * 1994-06-17 1996-03-26 The Whitaker Corporation Low profile board-to-board electrical connector
US5697794A (en) * 1994-10-18 1997-12-16 Itt Corporation High density connector assembly
US5622505A (en) * 1994-10-21 1997-04-22 Japan Aviation Electronics Industry, Limited Multi-row connector comprising flexible contact sheets with insulating resilient pieces
US5616050A (en) * 1995-01-19 1997-04-01 Ast Research Inc. Flexible circuit connector
JP2717380B2 (ja) * 1995-05-30 1998-02-18 日本航空電子工業株式会社 カード型電子装置接続用コネクタ
US6139364A (en) * 1995-09-08 2000-10-31 Motorola, Inc. Apparatus for coupling RF signals
SG71046A1 (en) 1996-10-10 2000-03-21 Connector Systems Tech Nv High density connector and method of manufacture
US6077090A (en) * 1997-06-10 2000-06-20 International Business Machines Corporation Flexible circuit connector with floating alignment frame
EP0929915B1 (fr) 1997-07-29 2006-03-29 Hybricon Corporation Connecteurs a caracteristiques ameliorees de diaphonie et de transmission des signaux
US5971806A (en) * 1997-11-26 1999-10-26 Berg Technology, Inc. Electrical connector for connecting conductor areas of a flexible circuit with associated conductor pads of a circuit board
US5984704A (en) * 1998-04-13 1999-11-16 Japan Aviation Electronics Industry, Ltd. Zif connector having means for keeping flexible contact sheet in tensile condition
JP2002534363A (ja) * 1999-01-08 2002-10-15 エミスフェアー・テクノロジーズ・インク ポリマー性デリバリー剤及びデリバリー剤化合物
US6323060B1 (en) 1999-05-05 2001-11-27 Dense-Pac Microsystems, Inc. Stackable flex circuit IC package and method of making same
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US20030170092A1 (en) * 1999-12-22 2003-09-11 Chiodo Joseph David Releasable fasteners
US6262895B1 (en) 2000-01-13 2001-07-17 John A. Forthun Stackable chip package with flex carrier
AU6190800A (en) * 2000-04-20 2001-11-07 Vladimir Nikolaevich Davidov Pressure actuated zero insertion force socket
US6368146B2 (en) 2000-08-23 2002-04-09 Russell Abbott Alignment mechanism for a high density electrical connector
JP2002175855A (ja) * 2000-12-08 2002-06-21 Japan Aviation Electronics Industry Ltd コネクタ
US7371609B2 (en) * 2001-10-26 2008-05-13 Staktek Group L.P. Stacked module systems and methods
US20060255446A1 (en) * 2001-10-26 2006-11-16 Staktek Group, L.P. Stacked modules and method
US20050009234A1 (en) * 2001-10-26 2005-01-13 Staktek Group, L.P. Stacked module systems and methods for CSP packages
US6576992B1 (en) 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method
US6940729B2 (en) * 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
US7310458B2 (en) 2001-10-26 2007-12-18 Staktek Group L.P. Stacked module systems and methods
US20030234443A1 (en) * 2001-10-26 2003-12-25 Staktek Group, L.P. Low profile stacking system and method
US20040195666A1 (en) * 2001-10-26 2004-10-07 Julian Partridge Stacked module systems and methods
US20050056921A1 (en) * 2003-09-15 2005-03-17 Staktek Group L.P. Stacked module systems and methods
US6956284B2 (en) * 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US7202555B2 (en) * 2001-10-26 2007-04-10 Staktek Group L.P. Pitch change and chip scale stacking system and method
US6914324B2 (en) * 2001-10-26 2005-07-05 Staktek Group L.P. Memory expansion and chip scale stacking system and method
US7656678B2 (en) 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
US7053478B2 (en) * 2001-10-26 2006-05-30 Staktek Group L.P. Pitch change and chip scale stacking system
US7485951B2 (en) * 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method
US7026708B2 (en) * 2001-10-26 2006-04-11 Staktek Group L.P. Low profile chip scale stacking system and method
US7081373B2 (en) 2001-12-14 2006-07-25 Staktek Group, L.P. CSP chip stack with flex circuit
US6884120B1 (en) 2002-06-27 2005-04-26 Siliconpipe, Inc. Array connector with deflectable coupling structure for mating with other components
DE10236128A1 (de) * 2002-08-07 2004-02-26 Daimlerchrysler Ag Elektrische Kontaktierung zwischen einer Komponente und einem biegsamen Leitungssatz
US6833696B2 (en) * 2003-03-04 2004-12-21 Xandex, Inc. Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
US6841029B2 (en) * 2003-03-27 2005-01-11 Advanced Cardiovascular Systems, Inc. Surface modification of expanded ultra high molecular weight polyethylene (eUHMWPE) for improved bondability
US20040245615A1 (en) * 2003-06-03 2004-12-09 Staktek Group, L.P. Point to point memory expansion system and method
US7542304B2 (en) * 2003-09-15 2009-06-02 Entorian Technologies, Lp Memory expansion and integrated circuit stacking system and method
US20060033187A1 (en) * 2004-08-12 2006-02-16 Staktek Group, L.P. Rugged CSP module system and method
US20060043558A1 (en) * 2004-09-01 2006-03-02 Staktek Group L.P. Stacked integrated circuit cascade signaling system and method
US7423885B2 (en) * 2004-09-03 2008-09-09 Entorian Technologies, Lp Die module system
US20060049513A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method with thermal management
US7289327B2 (en) * 2006-02-27 2007-10-30 Stakick Group L.P. Active cooling methods and apparatus for modules
US7606050B2 (en) * 2004-09-03 2009-10-20 Entorian Technologies, Lp Compact module system and method
US7511968B2 (en) * 2004-09-03 2009-03-31 Entorian Technologies, Lp Buffered thin module system and method
US7606049B2 (en) * 2004-09-03 2009-10-20 Entorian Technologies, Lp Module thermal management system and method
US7606040B2 (en) * 2004-09-03 2009-10-20 Entorian Technologies, Lp Memory module system and method
US7468893B2 (en) * 2004-09-03 2008-12-23 Entorian Technologies, Lp Thin module system and method
US7446410B2 (en) 2004-09-03 2008-11-04 Entorian Technologies, Lp Circuit module with thermal casing systems
US7616452B2 (en) 2004-09-03 2009-11-10 Entorian Technologies, Lp Flex circuit constructions for high capacity circuit module systems and methods
US20060261449A1 (en) * 2005-05-18 2006-11-23 Staktek Group L.P. Memory module system and method
US7522421B2 (en) * 2004-09-03 2009-04-21 Entorian Technologies, Lp Split core circuit module
US7760513B2 (en) * 2004-09-03 2010-07-20 Entorian Technologies Lp Modified core for circuit module system and method
US20060050492A1 (en) 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US7542297B2 (en) 2004-09-03 2009-06-02 Entorian Technologies, Lp Optimized mounting area circuit module system and method
US7443023B2 (en) * 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US7579687B2 (en) 2004-09-03 2009-08-25 Entorian Technologies, Lp Circuit module turbulence enhancement systems and methods
US7324352B2 (en) 2004-09-03 2008-01-29 Staktek Group L.P. High capacity thin module system and method
US20060055024A1 (en) * 2004-09-14 2006-03-16 Staktek Group, L.P. Adapted leaded integrated circuit module
US20060072297A1 (en) * 2004-10-01 2006-04-06 Staktek Group L.P. Circuit Module Access System and Method
US7520965B2 (en) * 2004-10-12 2009-04-21 Southwest Research Institute Magnetron sputtering apparatus and method for depositing a coating using same
US20060118936A1 (en) * 2004-12-03 2006-06-08 Staktek Group L.P. Circuit module component mounting system and method
US7309914B2 (en) * 2005-01-20 2007-12-18 Staktek Group L.P. Inverted CSP stacking system and method
US20060175693A1 (en) * 2005-02-04 2006-08-10 Staktek Group, L.P. Systems, methods, and apparatus for generating ball-out matrix configuration output for a flex circuit
JP2006228453A (ja) 2005-02-15 2006-08-31 Japan Aviation Electronics Industry Ltd コネクタ
US20060244114A1 (en) * 2005-04-28 2006-11-02 Staktek Group L.P. Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam
US20060250780A1 (en) * 2005-05-06 2006-11-09 Staktek Group L.P. System component interposer
US7033861B1 (en) 2005-05-18 2006-04-25 Staktek Group L.P. Stacked module systems and method
US7576995B2 (en) * 2005-11-04 2009-08-18 Entorian Technologies, Lp Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area
US7605454B2 (en) 2006-01-11 2009-10-20 Entorian Technologies, Lp Memory card and method for devising
US7508069B2 (en) 2006-01-11 2009-03-24 Entorian Technologies, Lp Managed memory component
US20070158821A1 (en) * 2006-01-11 2007-07-12 Leland Szewerenko Managed memory component
US7304382B2 (en) 2006-01-11 2007-12-04 Staktek Group L.P. Managed memory component
US7608920B2 (en) * 2006-01-11 2009-10-27 Entorian Technologies, Lp Memory card and method for devising
US7508058B2 (en) * 2006-01-11 2009-03-24 Entorian Technologies, Lp Stacked integrated circuit module
US20070164416A1 (en) * 2006-01-17 2007-07-19 James Douglas Wehrly Managed memory component
US20070176615A1 (en) * 2006-01-27 2007-08-02 Xandex, Inc. Active probe contact array management
US7511969B2 (en) * 2006-02-02 2009-03-31 Entorian Technologies, Lp Composite core circuit module system and method
US7252520B1 (en) * 2006-04-25 2007-08-07 Tyco Electronics Corporation Flex film card edge connector and cable assembly
US20070262429A1 (en) * 2006-05-15 2007-11-15 Staktek Group, L.P. Perimeter stacking system and method
US7468553B2 (en) * 2006-10-20 2008-12-23 Entorian Technologies, Lp Stackable micropackages and stacked modules
US7417310B2 (en) 2006-11-02 2008-08-26 Entorian Technologies, Lp Circuit module having force resistant construction
CN101740916B (zh) * 2008-11-19 2012-04-18 富士康(昆山)电脑接插件有限公司 电连接器及其组件
EP2197254B1 (fr) * 2008-12-09 2011-08-31 Siemens Aktiengesellschaft Module électronique pour un module d'installations
WO2011002186A2 (fr) * 2009-06-29 2011-01-06 휴먼전자 주식회사 Connecteur carte à carte
KR20130069076A (ko) * 2011-12-16 2013-06-26 삼성전기주식회사 터치패널용 기판과 ｆｐｃｂ의 연결구조
JP6016244B2 (ja) * 2013-06-11 2016-10-26 日本航空電子工業株式会社 コネクタ
JP6581408B2 (ja) * 2015-07-03 2019-09-25 矢崎総業株式会社 ジョイント接続構造
JP6521775B2 (ja) * 2015-07-13 2019-05-29 矢崎総業株式会社 ケーブル固定構造
DE102016122577A1 (de) * 2016-11-23 2018-05-24 Endress+Hauser SE+Co. KG Leiterplatte und Verfahren zur Herstellung der Leiterplatte
US10056660B2 (en) * 2016-12-02 2018-08-21 International Business Machines Corporation Flexible electronic circuits including shape memory materials
EP4366474A4 (fr) * 2022-06-10 2025-04-23 Lg Energy Solution, Ltd. Carte de circuit imprimé flexible ayant une fonction de protection contre les surintensités

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3319216A (en) * 1965-03-25 1967-05-09 Fischer & Porter Co Connector for flat cables
DE1802130A1 (de) * 1968-10-09 1970-04-23 Siemens Ag Vielfachstecker
US3569901A (en) * 1968-10-25 1971-03-09 Trw Inc Thermal-mating bimetal rollpins
US3740839A (en) * 1971-06-29 1973-06-26 Raychem Corp Cryogenic connection method and means
US3913444A (en) * 1972-11-08 1975-10-21 Raychem Corp Thermally deformable fastening pin
JPS53288A (en) * 1976-06-23 1978-01-05 Nippon Synthetic Chem Ind Co Ltd:The Preparation of fiber sizing resin
US4080027A (en) * 1976-07-30 1978-03-21 Gte Sylvania Incorporated Electrical contact and connector
US4085990A (en) * 1977-03-25 1978-04-25 Gte Sylvania, Incorporated Longitudinally actuated zero force connector
US4116516A (en) * 1977-06-24 1978-09-26 Gte Sylvania Incorporated Multiple layered connector
JPS5453288A (en) * 1977-10-04 1979-04-26 Fujitsu Ltd Zero-force connector
EP0026568B1 (fr) * 1979-09-07 1983-03-30 AMP INCORPORATED (a New Jersey corporation) Connecteur pour connecter des conducteurs d'un câble plat à des conducteurs sur un substrat
US4303294A (en) * 1980-03-17 1981-12-01 Amp Incorporated Compound spring contact
FR2508720A1 (fr) * 1981-06-26 1982-12-31 Thomson Csf Dispositif de connexion pour carte de circuit imprime
US4487465A (en) * 1981-12-07 1984-12-11 Raychem Corporation Heat recoverable connecting device
GB2120466A (en) * 1982-05-14 1983-11-30 Itt Printed circuit board connector
US4517625A (en) * 1983-11-09 1985-05-14 Lockheed Corporation Circuit board housing with zero insertion force connector
FR2554977B1 (fr) * 1983-11-10 1986-02-07 App Meca Prec Const Connecteur pour carte de circuit electrique, notamment du genre carte accreditive a circuit electrique incorpore
EP0151253B1 (fr) * 1984-02-06 1990-09-12 International Business Machines Corporation Mécanisme de contact
US4587596A (en) * 1984-04-09 1986-05-06 Amp Incorporated High density mother/daughter circuit board connector
US4621882A (en) * 1984-05-14 1986-11-11 Beta Phase, Inc. Thermally responsive electrical connector
US4629270A (en) * 1984-07-16 1986-12-16 Amp Incorporated Zero insertion force card edge connector with flexible film circuitry
US4643500A (en) * 1985-11-13 1987-02-17 Beta Phase, Inc. Shape memory actuators for multi-contact electrical connectors
EP0260132B1 (fr) * 1986-09-10 1994-06-15 The Furukawa Electric Co., Ltd. Connecteur électronique
JPS6372079A (ja) 1986-09-12 1988-04-01 古河電気工業株式会社 電子コネクタ
US4846709A (en) * 1987-10-22 1989-07-11 The Furukawa Electric Co., Ltd Reinforced connection for a chemical connector and method of constructing therefor

Also Published As

Publication number Publication date
US5015193A (en) 1991-05-14
JPH04501338A (ja) 1992-03-05
DE68929198D1 (de) 2000-05-31
JP2848464B2 (ja) 1999-01-20
DE68929198T2 (de) 2001-02-15
EP0683549A3 (fr) 1996-06-12
CA2000382C (fr) 2000-04-18
DE68926509T2 (de) 1996-10-02
US4911643A (en) 1990-03-27
DE68926509D1 (de) 1996-06-20
EP0683549A2 (fr) 1995-11-22
EP0438504A1 (fr) 1991-07-31
EP0438504A4 (en) 1992-08-05
WO1990004270A1 (fr) 1990-04-19
EP0683549B1 (fr) 2000-04-26
EP0438504B1 (fr) 1996-05-15

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