CA2003229A1 - Methode de montage d'un element electronique et carte memoire resultante - Google Patents

Methode de montage d'un element electronique et carte memoire resultante

Info

Publication number
CA2003229A1
CA2003229A1 CA2003229A CA2003229A CA2003229A1 CA 2003229 A1 CA2003229 A1 CA 2003229A1 CA 2003229 A CA2003229 A CA 2003229A CA 2003229 A CA2003229 A CA 2003229A CA 2003229 A1 CA2003229 A1 CA 2003229A1
Authority
CA
Canada
Prior art keywords
layer
mounting
electronic component
memory card
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2003229A
Other languages
English (en)
Other versions
CA2003229C (fr
Inventor
Jan Paul Boucquet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent NV
Original Assignee
Alcatel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel NV filed Critical Alcatel NV
Priority to CA002003229A priority Critical patent/CA2003229C/fr
Publication of CA2003229A1 publication Critical patent/CA2003229A1/fr
Application granted granted Critical
Publication of CA2003229C publication Critical patent/CA2003229C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts

Landscapes

  • Credit Cards Or The Like (AREA)
CA002003229A 1989-11-17 1989-11-17 Methode de montage d'un element electronique et carte memoire resultante Expired - Fee Related CA2003229C (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA002003229A CA2003229C (fr) 1989-11-17 1989-11-17 Methode de montage d'un element electronique et carte memoire resultante

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA002003229A CA2003229C (fr) 1989-11-17 1989-11-17 Methode de montage d'un element electronique et carte memoire resultante

Publications (2)

Publication Number Publication Date
CA2003229A1 true CA2003229A1 (fr) 1991-05-17
CA2003229C CA2003229C (fr) 1994-07-12

Family

ID=4143581

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002003229A Expired - Fee Related CA2003229C (fr) 1989-11-17 1989-11-17 Methode de montage d'un element electronique et carte memoire resultante

Country Status (1)

Country Link
CA (1) CA2003229C (fr)

Also Published As

Publication number Publication date
CA2003229C (fr) 1994-07-12

Similar Documents

Publication Publication Date Title
AU4142789A (en) Memory card
US5561328A (en) Photo-definable template for semiconductor chip alignment
EP0810649A3 (fr) Méthode d'assemblage de substrats et structure associée
EP0551382A4 (en) Semiconductor chip assemblies, methods of making same and components for same
SG45122A1 (en) Low cost and highly reliable chip-sized package
MY109082A (en) Pad array semiconductor device with thermal conductor and process for making the same
EP0223234A3 (fr) Empaquetage d'interconnexion pour dispositifs électroniques et son procédé de fabrication
WO1997040532A3 (fr) Matrice a bulles moulee avec circuits imprimes a substrat souple, et procede de fabrication
IE841669L (en) Assemly of electronic components
CA2110472A1 (fr) Methode et appareil de verification in situ de puces de circuits integres
EP0394588A3 (fr) Borne à souder
EP0084464A3 (fr) Connecteur pour sous-assemblages électroniques
JPS5553446A (en) Container of electronic component
JPS5279773A (en) Bonding method of ic
WO2004056162A8 (fr) Composant electronique de montage de puces a protuberances et procede de production associe, carte de circuit imprime et procede de production associe, et procede de production d'ensemble
CA2003229A1 (fr) Methode de montage d'un element electronique et carte memoire resultante
EP0384586A3 (fr) Emballage plastique à haute fiabilité pour circuits intégrés
JPH03218039A (ja) 半導体素子の実装方法
US4761880A (en) Method of obtaining surface mount component planarity
JPS5518034A (en) Method of fabricating hybrid integrated circuit
SG49779A1 (en) Method of forming solder bumps on an integrated circuit flip chip
JPH01138791A (ja) 混成集積回路装置
KR0169818B1 (ko) 반도체 소자의 마이크로 범프 제조방법
EP0335420A3 (fr) Construction électrique et mécanique d'une jonction entre un support de circuit imprimé et un fil
JPS52149066A (en) Connecting method of silicon semiconductor chip to ceramic substrate

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed