CA2014255A1 - Boitier de puce pouvant recevoir un condensateur - Google Patents

Boitier de puce pouvant recevoir un condensateur

Info

Publication number
CA2014255A1
CA2014255A1 CA2014255A CA2014255A CA2014255A1 CA 2014255 A1 CA2014255 A1 CA 2014255A1 CA 2014255 A CA2014255 A CA 2014255A CA 2014255 A CA2014255 A CA 2014255A CA 2014255 A1 CA2014255 A1 CA 2014255A1
Authority
CA
Canada
Prior art keywords
cover
chip package
capacitor cover
mounting
package capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2014255A
Other languages
English (en)
Other versions
CA2014255C (fr
Inventor
Richard K. Spielberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Honeywell Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inc filed Critical Honeywell Inc
Publication of CA2014255A1 publication Critical patent/CA2014255A1/fr
Application granted granted Critical
Publication of CA2014255C publication Critical patent/CA2014255C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/916—Narrow band gap semiconductor material, <<1ev

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CA002014255A 1989-05-08 1990-04-10 Boitier de puce pouvant recevoir un condensateur Expired - Lifetime CA2014255C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/348,999 1989-05-08
US07/348,999 US5043533A (en) 1989-05-08 1989-05-08 Chip package capacitor cover

Publications (2)

Publication Number Publication Date
CA2014255A1 true CA2014255A1 (fr) 1990-11-08
CA2014255C CA2014255C (fr) 2000-12-26

Family

ID=23370456

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002014255A Expired - Lifetime CA2014255C (fr) 1989-05-08 1990-04-10 Boitier de puce pouvant recevoir un condensateur

Country Status (4)

Country Link
US (1) US5043533A (fr)
EP (1) EP0397391A3 (fr)
JP (1) JPH0362954A (fr)
CA (1) CA2014255C (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270488A (en) * 1990-07-27 1993-12-14 Mitsubishi Denki Kabushiki Kaisha Shield construction for electrical devices
JP2772184B2 (ja) * 1991-11-07 1998-07-02 株式会社東芝 半導体装置
JP2704076B2 (ja) * 1991-11-14 1998-01-26 甲府日本電気株式会社 集積回路パッケージ
US5155656A (en) * 1991-12-12 1992-10-13 Micron Technology, Inc. Integrated series capacitors for high reliability electronic applications including decoupling circuits
US5280413A (en) * 1992-09-17 1994-01-18 Ceridian Corporation Hermetically sealed circuit modules having conductive cap anchors
DE4242097C2 (de) * 1992-12-14 2001-03-01 Bosch Gmbh Robert Anordnung zum elektromagnetischen Verträglichkeits(EMV)-Schutz von Hybridbauelementen
AU2371795A (en) * 1994-05-17 1995-12-05 Olin Corporation Electronic packages with improved electrical performance
US5844419A (en) * 1996-05-14 1998-12-01 Micron Technology, Inc. Method for testing semiconductor packages using decoupling capacitors to reduce noise
KR100277314B1 (ko) * 1996-11-08 2001-01-15 모기 쥰이찌 박막콘덴서 및 이를탑재한반도체장치
DE19728692C2 (de) * 1997-07-04 2002-04-11 Infineon Technologies Ag IC-Baustein mit passiven Bauelementen
DE19851458C2 (de) 1998-11-09 2000-11-16 Bosch Gmbh Robert Monolithisch integrierte Schaltung mit mehreren, einen Nebenschluß nach Masse bildenden Kapazitäten und Verstärkerschaltung
US6175241B1 (en) 1999-02-19 2001-01-16 Micron Technology, Inc. Test carrier with decoupling capacitors for testing semiconductor components
KR100618903B1 (ko) * 2005-06-18 2006-09-01 삼성전자주식회사 독립된 전원 장치를 구비하는 반도체 집적 회로와 반도체집적 회로를 구비하는 반도체 시스템 및 반도체 집적 회로형성 방법
US8012874B2 (en) * 2007-12-14 2011-09-06 Ati Technologies Ulc Semiconductor chip substrate with multi-capacitor footprint
US8564122B2 (en) 2011-12-09 2013-10-22 Advanced Micro Devices, Inc. Circuit board component shim structure
US11837527B2 (en) 2020-07-23 2023-12-05 Advanced Micro Devices, Inc. Semiconductor chip stack with locking through vias

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833753A (en) * 1972-11-30 1974-09-03 V Garboushian Hermetically sealed mounting structure for miniature electronic circuitry
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
US4451845A (en) * 1981-12-22 1984-05-29 Avx Corporation Lead frame device including ceramic encapsulated capacitor and IC chip
US4636918A (en) * 1982-07-30 1987-01-13 Rogers Corporation Decoupled integrated circuit package
JPS5954249A (ja) * 1982-09-22 1984-03-29 Fujitsu Ltd 半導体装置
JPS5972751A (ja) * 1982-10-20 1984-04-24 Fujitsu Ltd 半導体装置
JPS59111350A (ja) * 1982-12-16 1984-06-27 Matsushita Electric Ind Co Ltd 半導体装置
FR2550009B1 (fr) * 1983-07-29 1986-01-24 Inf Milit Spatiale Aeronaut Boitier de composant electronique muni d'un condensateur
US4672421A (en) * 1984-04-02 1987-06-09 Motorola, Inc. Semiconductor packaging and method
FR2565032B1 (fr) * 1984-05-25 1987-02-20 Inf Milit Spatiale Aeronaut Dispositif de repartition de potentiel electrique et boitier de composant electronique incorporant un tel dispositif
JPS61108160A (ja) * 1984-11-01 1986-05-26 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法

Also Published As

Publication number Publication date
US5043533A (en) 1991-08-27
JPH0362954A (ja) 1991-03-19
CA2014255C (fr) 2000-12-26
EP0397391A3 (fr) 1991-12-04
EP0397391A2 (fr) 1990-11-14

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed
MKEC Expiry (correction)

Effective date: 20121202