CA2015771A1 - Methode de fabrication de microcircuits hybrides permettant d'obtenir des resistaqnces precises en couches epaisses - Google Patents

Methode de fabrication de microcircuits hybrides permettant d'obtenir des resistaqnces precises en couches epaisses

Info

Publication number
CA2015771A1
CA2015771A1 CA002015771A CA2015771A CA2015771A1 CA 2015771 A1 CA2015771 A1 CA 2015771A1 CA 002015771 A CA002015771 A CA 002015771A CA 2015771 A CA2015771 A CA 2015771A CA 2015771 A1 CA2015771 A1 CA 2015771A1
Authority
CA
Canada
Prior art keywords
substrate
printing
firing
environment
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002015771A
Other languages
English (en)
Inventor
William R. Keaton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AG Communication Systems Corp
Original Assignee
AG Communication Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AG Communication Systems Corp filed Critical AG Communication Systems Corp
Publication of CA2015771A1 publication Critical patent/CA2015771A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
CA002015771A 1989-05-01 1990-04-30 Methode de fabrication de microcircuits hybrides permettant d'obtenir des resistaqnces precises en couches epaisses Abandoned CA2015771A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34580689A 1989-05-01 1989-05-01
US345,806 1989-05-01

Publications (1)

Publication Number Publication Date
CA2015771A1 true CA2015771A1 (fr) 1990-11-01

Family

ID=23356560

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002015771A Abandoned CA2015771A1 (fr) 1989-05-01 1990-04-30 Methode de fabrication de microcircuits hybrides permettant d'obtenir des resistaqnces precises en couches epaisses

Country Status (1)

Country Link
CA (1) CA2015771A1 (fr)

Similar Documents

Publication Publication Date Title
US6631551B1 (en) Method of forming integral passive electrical components on organic circuit board substrates
US4870746A (en) Method of making a multilayer printed circuit board having screened-on resistors
US4555745A (en) Thick-film capacitor manufactured by printed-circuit techniques
US6021050A (en) Printed circuit boards with integrated passive components and method for making same
US6860000B2 (en) Method to embed thick film components
EP1093327B1 (fr) Procédé amélioré d'enrobage de composants passifs
EP1020909B1 (fr) Méthode pour produir un circuit à couches épaisses hybrides sur un circuit imprimé metallique
US20030150101A1 (en) Printed circuit board with buried resistor and manufacturing method thereof
WO1986003337A1 (fr) Procede de fabrication de modules d'interconnexion dimensionnellement stables et produit obtenu par ce procede
US5496619A (en) Assembly formed from conductive paste and insulating paste
US5510594A (en) Method of manufacturing thick-film circuit component
CA1309758C (fr) Systemes de materiau conducteur en film epais
JPH0324076B2 (fr)
US6225035B1 (en) Method for forming a thick-film resistor
US5274352A (en) Thick film resistive element, thick film printed circuit board and thick film hybrid integrated circuit device and their production methods
DE3605160A1 (de) Verfahren zur herstellung eines hybrid-integrierten schaltungssubstrats
CA2015772C (fr) Methode de fabrication de microcircuits hybrides permettant d'obtenir des resistances precises en couches epaisses
EP1405552B1 (fr) Procede pour produire une carte a circuit imprime multicouche en ceramique
CA2015771A1 (fr) Methode de fabrication de microcircuits hybrides permettant d'obtenir des resistaqnces precises en couches epaisses
JPH0595071U (ja) 厚膜回路基板
CA1316231C (fr) Resistance de puce
US5794327A (en) Method for making copper electrical connections
JPH05243713A (ja) 配線基板の製造方法
US4898805A (en) Method for fabricating hybrid integrated circuit
JPH03274791A (ja) 印刷厚膜多層回路基板

Legal Events

Date Code Title Description
FZDE Discontinued