CA2020237A1 - Fabrication de dispositifs par procede de lithographie - Google Patents

Fabrication de dispositifs par procede de lithographie

Info

Publication number
CA2020237A1
CA2020237A1 CA2020237A CA2020237A CA2020237A1 CA 2020237 A1 CA2020237 A1 CA 2020237A1 CA 2020237 A CA2020237 A CA 2020237A CA 2020237 A CA2020237 A CA 2020237A CA 2020237 A1 CA2020237 A1 CA 2020237A1
Authority
CA
Canada
Prior art keywords
lithographic processing
device manufacture
manufacture involving
involving lithographic
fabrication
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2020237A
Other languages
English (en)
Other versions
CA2020237C (fr
Inventor
Steven David Berger
John Murray Gibson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27012996&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA2020237(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US07/390,139 external-priority patent/US5079112A/en
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Publication of CA2020237A1 publication Critical patent/CA2020237A1/fr
Application granted granted Critical
Publication of CA2020237C publication Critical patent/CA2020237C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2008—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3175—Projection methods, i.e. transfer substantially complete pattern to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31777—Lithography by projection
    • H01J2237/31791—Scattering mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
CA002020237A 1989-08-07 1990-06-29 Fabrication de dispositifs par procede de lithographie Expired - Fee Related CA2020237C (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US07/390,139 US5079112A (en) 1989-08-07 1989-08-07 Device manufacture involving lithographic processing
US390,139 1990-03-23
US498,179 1990-03-23
US07/498,179 US5130213A (en) 1989-08-07 1990-03-23 Device manufacture involving lithographic processing

Publications (2)

Publication Number Publication Date
CA2020237A1 true CA2020237A1 (fr) 1991-02-08
CA2020237C CA2020237C (fr) 1994-06-07

Family

ID=27012996

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002020237A Expired - Fee Related CA2020237C (fr) 1989-08-07 1990-06-29 Fabrication de dispositifs par procede de lithographie

Country Status (7)

Country Link
US (2) US5130213A (fr)
EP (1) EP0412690B1 (fr)
JP (4) JPH0834169B2 (fr)
CA (1) CA2020237C (fr)
DE (1) DE69023073T2 (fr)
ES (1) ES2078949T3 (fr)
HK (1) HK34696A (fr)

Families Citing this family (54)

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US5130213A (en) * 1989-08-07 1992-07-14 At&T Bell Laboratories Device manufacture involving lithographic processing
US5258246A (en) * 1989-08-07 1993-11-02 At&T Bell Laboratories Device manufacture involving lithographic processing
JP2957669B2 (ja) * 1990-09-28 1999-10-06 株式会社東芝 反射マスク及びこれを用いた荷電ビーム露光装置
US5254438A (en) * 1990-11-29 1993-10-19 Hewlett-Packard Company Single pass compensation for electron beam proximity effect
EP0500456B1 (fr) * 1991-02-19 1998-05-06 Fujitsu Limited Méthode d'exposition par projection et masque optique pour exposition par projection
JPH05134385A (ja) * 1991-11-11 1993-05-28 Nikon Corp 反射マスク
US5316879A (en) * 1992-07-14 1994-05-31 At&T Bell Laboratories Sub-micron device fabrication using multiple aperture filter
US5279925A (en) * 1992-12-16 1994-01-18 At&T Bell Laboratories Projection electron lithographic procedure
US5382498A (en) * 1992-12-16 1995-01-17 At&T Corp. Processes for electron lithography
EP0669636A1 (fr) * 1994-02-25 1995-08-30 AT&T Corp. Détection d'erreur dans un système de fabrication
US5624774A (en) * 1994-06-16 1997-04-29 Nikon Corporation Method for transferring patterns with charged particle beam
JPH08124833A (ja) * 1994-10-26 1996-05-17 Nikon Corp 荷電粒子線転写用マスク
JPH08124834A (ja) * 1994-10-26 1996-05-17 Nikon Corp 荷電粒子線転写装置
US5773837A (en) * 1994-11-22 1998-06-30 Nikon Corporation Apparatus for image transfer with charged particle beam, and deflector and mask used with such apparatus
US5689117A (en) * 1994-11-22 1997-11-18 Nikon Corporation Apparatus for image transfer with charged particle beam, and deflector and mask used with such apparatus
US5532496A (en) * 1994-12-14 1996-07-02 International Business Machines Corporation Proximity effect compensation in scattering-mask lithographic projection systems and apparatus therefore
US5561008A (en) * 1995-01-27 1996-10-01 Lucent Technologies Inc. Process for device fabrication using projection lithography and an apparatus therefor
JPH08236428A (ja) * 1995-03-01 1996-09-13 Nikon Corp 荷電粒子線露光方法及びそれに用いるマスク
JP3940824B2 (ja) * 1995-08-14 2007-07-04 株式会社ニコン 荷電粒子線によるパターン転写方法および転写装置
JP3601630B2 (ja) * 1995-11-01 2004-12-15 株式会社ニコン 荷電粒子線転写方法
US5751004A (en) * 1997-01-24 1998-05-12 International Business Machines Corporation Projection reticle transmission control for coulomb interaction analysis
US5942760A (en) * 1997-11-03 1999-08-24 Motorola Inc. Method of forming a semiconductor device utilizing scalpel mask, and mask therefor
US5985493A (en) 1998-04-08 1999-11-16 Lucent Technologies Inc. Membrane mask for projection lithography
US7001713B2 (en) * 1998-04-18 2006-02-21 United Microelectronics, Corp. Method of forming partial reverse active mask
US6051346A (en) * 1998-04-29 2000-04-18 Lucent Technologies Inc. Process for fabricating a lithographic mask
US6297169B1 (en) * 1998-07-27 2001-10-02 Motorola, Inc. Method for forming a semiconductor device using a mask having a self-assembled monolayer
US6177218B1 (en) 1998-08-07 2001-01-23 Lucent Technologies Inc. Lithographic process for device fabrication using electron beam imaging
US6376847B1 (en) 1998-08-24 2002-04-23 Matsushia Electric Industrial Co., Ltd. Charged particle lithography method and system
JP2000100715A (ja) 1998-09-17 2000-04-07 Nikon Corp 電子ビーム露光装置の調整方法
US6355383B1 (en) 1999-02-24 2002-03-12 Nec Corporation Electron-beam exposure system, a mask for electron-beam exposure and a method for electron-beam exposure
US6394109B1 (en) 1999-04-13 2002-05-28 Applied Materials, Inc. Method and apparatus for removing carbon contamination in a sub-atmospheric charged particle beam lithography system
JP3706527B2 (ja) 1999-06-30 2005-10-12 Ｈｏｙａ株式会社 電子線描画用マスクブランクス、電子線描画用マスクおよび電子線描画用マスクの製造方法
JP2001093803A (ja) * 1999-09-20 2001-04-06 Sony Corp リソグラフィーにおけるボケ量の算出方法及びリソグラフィー方法
US6324933B1 (en) 1999-10-06 2001-12-04 Agere Systems Guardian Corp. Planar movable stage mechanism
JP3360725B2 (ja) 1999-10-19 2002-12-24 日本電気株式会社 電子線露光方法、並びにこれに用いるマスク及び電子線露光装置
JP3360666B2 (ja) * 1999-11-12 2002-12-24 日本電気株式会社 描画パターン検証方法
JP2001144008A (ja) * 1999-11-17 2001-05-25 Nec Corp 電子線露光方法、並びにこれに用いるマスク及び電子線露光装置
US6469775B1 (en) 2000-01-31 2002-10-22 Micron Technology, Inc. Reticle for creating resist-filled vias in a dual damascene process
DE10041040A1 (de) * 2000-08-22 2002-03-07 Zeiss Carl Vorrichtung und Verfahren zur Belichtung einer strahlungsempfindlichen Schicht mittels geladener Teilchen sowie Maske hierfür
JP2002170760A (ja) * 2000-12-01 2002-06-14 Nikon Corp 荷電粒子ビーム露光装置、荷電粒子ビーム露光方法及びデバイス製造方法
US20020070354A1 (en) * 2000-12-11 2002-06-13 Nobuo Shimazu Manufacturing method of mask for electron beam proximity exposure and mask
KR100597014B1 (ko) 2001-01-10 2006-07-06 재단법인서울대학교산학협력재단 물질의 결정 구조를 이용한 패턴 형성 방법 및 그 구조를갖는 기능성 소자
KR100462055B1 (ko) * 2001-04-03 2004-12-17 재단법인서울대학교산학협력재단 물질의 결정구조를 이용한 패턴 형성 방법 및 장치
DE10117025A1 (de) 2001-04-05 2002-10-10 Zeiss Carl Teilchenoptische Vorrichtung,Beleuchtungsvorrichtung und Projektionssystem sowie Verfahren unter Verwendung derselben
TW530336B (en) * 2001-08-21 2003-05-01 Asml Masktools Bv Lithographic method and lithographic apparatus
FR2890461B1 (fr) * 2005-09-05 2008-12-26 Sagem Defense Securite Obturateur et illuminateur d'un dispositif de photolithographie
US7897008B2 (en) * 2006-10-27 2011-03-01 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for regional plasma control
US8387674B2 (en) 2007-11-30 2013-03-05 Taiwan Semiconductor Manufacturing Comany, Ltd. Chip on wafer bonder
US8178280B2 (en) * 2010-02-05 2012-05-15 Taiwan Semiconductor Manufacturing Company, Ltd. Self-contained proximity effect correction inspiration for advanced lithography (special)
FR2996015B1 (fr) * 2012-09-25 2014-09-12 Sagem Defense Securite Illuminateur de dispositif de photolithographie permettant la diffraction controlee
JP6190168B2 (ja) * 2013-06-04 2017-08-30 キヤノン株式会社 合焦方法、合焦装置、露光方法、およびデバイス製造方法
JP2015050439A (ja) * 2013-09-04 2015-03-16 株式会社東芝 描画データの補正方法、描画方法、及びリソグラフィ用のマスク又はテンプレートの製造方法
JP7474151B2 (ja) * 2020-08-21 2024-04-24 株式会社ニューフレアテクノロジー マルチ電子ビーム描画装置及びマルチ電子ビーム描画方法
CN112684657B (zh) * 2020-12-24 2022-02-01 四川长虹电器股份有限公司 一种准直固态发光芯片或芯片阵列光源的方法

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US5258246A (en) * 1989-08-07 1993-11-02 At&T Bell Laboratories Device manufacture involving lithographic processing
US5130213A (en) * 1989-08-07 1992-07-14 At&T Bell Laboratories Device manufacture involving lithographic processing
US5079112A (en) * 1989-08-07 1992-01-07 At&T Bell Laboratories Device manufacture involving lithographic processing
US5260151A (en) * 1991-12-30 1993-11-09 At&T Bell Laboratories Device manufacture involving step-and-scan delineation
US5279925A (en) * 1992-12-16 1994-01-18 At&T Bell Laboratories Projection electron lithographic procedure
JPH0834169A (ja) * 1994-07-25 1996-02-06 Mitsubishi Paper Mills Ltd 感熱転写用受像シート

Also Published As

Publication number Publication date
CA2020237C (fr) 1994-06-07
JP3153525B2 (ja) 2001-04-09
EP0412690A2 (fr) 1991-02-13
JPH03101214A (ja) 1991-04-26
USRE36964E (en) 2000-11-21
EP0412690B1 (fr) 1995-10-18
JP2857384B2 (ja) 1999-02-17
JP3153521B2 (ja) 2001-04-09
HK34696A (en) 1996-03-08
EP0412690A3 (en) 1991-09-04
JPH11329959A (ja) 1999-11-30
JPH1074695A (ja) 1998-03-17
US5130213A (en) 1992-07-14
JPH11317360A (ja) 1999-11-16
ES2078949T3 (es) 1996-01-01
DE69023073D1 (de) 1995-11-23
JPH0834169B2 (ja) 1996-03-29
DE69023073T2 (de) 1996-03-21

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