CA2055352A1 - Appret utilise pour la metallisation des surfaces de support - Google Patents

Appret utilise pour la metallisation des surfaces de support

Info

Publication number
CA2055352A1
CA2055352A1 CA2055352A CA2055352A CA2055352A1 CA 2055352 A1 CA2055352 A1 CA 2055352A1 CA 2055352 A CA2055352 A CA 2055352A CA 2055352 A CA2055352 A CA 2055352A CA 2055352 A1 CA2055352 A1 CA 2055352A1
Authority
CA
Canada
Prior art keywords
substrate surfaces
metallisation
primer
former
primers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2055352A
Other languages
English (en)
Other versions
CA2055352C (fr
Inventor
Gerhard D. Wolf
Kirkor Sirinyan
Wolfgang Henning
Rudolf Merten
Ulrich V. Gizycki
Bruce Benda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2055352A1 publication Critical patent/CA2055352A1/fr
Application granted granted Critical
Publication of CA2055352C publication Critical patent/CA2055352C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Chemically Coating (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Laminated Bodies (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CA002055352A 1990-11-16 1991-11-13 Appret utilise pour la metallisation des surfaces de support Expired - Fee Related CA2055352C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4036591.3 1990-11-16
DE4036591A DE4036591A1 (de) 1990-11-16 1990-11-16 Primer zum metallisieren von substratoberflaechen

Publications (2)

Publication Number Publication Date
CA2055352A1 true CA2055352A1 (fr) 1992-05-17
CA2055352C CA2055352C (fr) 1999-10-26

Family

ID=6418415

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002055352A Expired - Fee Related CA2055352C (fr) 1990-11-16 1991-11-13 Appret utilise pour la metallisation des surfaces de support

Country Status (5)

Country Link
US (1) US5378268A (fr)
EP (1) EP0485839B1 (fr)
JP (1) JPH04365872A (fr)
CA (1) CA2055352C (fr)
DE (2) DE4036591A1 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5411795A (en) * 1992-10-14 1995-05-02 Monsanto Company Electroless deposition of metal employing thermally stable carrier polymers
DE4319759A1 (de) * 1993-06-15 1994-12-22 Bayer Ag Pulvermischungen zum Metallisieren von Substratoberflächen
DE19736093A1 (de) * 1997-08-20 1999-02-25 Bayer Ag Herstellung dreidimensionaler Leiterplatten
DE19812880A1 (de) 1998-03-24 1999-09-30 Bayer Ag Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung
JP2002001880A (ja) * 2000-06-20 2002-01-08 Inoac Corp 導電性プラスチック成形品およびその製造方法
DE10243132B4 (de) * 2002-09-17 2006-09-14 Biocer Entwicklungs Gmbh Antiinfektiöse, biokompatible Titanoxid-Beschichtungen für Implantate sowie Verfahren zu deren Herstellung
US7255782B2 (en) * 2004-04-30 2007-08-14 Kenneth Crouse Selective catalytic activation of non-conductive substrates
US20050241951A1 (en) * 2004-04-30 2005-11-03 Kenneth Crouse Selective catalytic activation of non-conductive substrates
WO2006027947A1 (fr) * 2004-09-10 2006-03-16 Nippon Mining & Metals Co., Ltd. Agent de prétraitement de placage d’or autocatalytique et produit stratifié de revêtement de cuivre pour carte souple
GB0422386D0 (en) * 2004-10-08 2004-11-10 Qinetiq Ltd Active filler particles in inks
JP2008007849A (ja) * 2006-06-01 2008-01-17 Nippon Paint Co Ltd 無電解めっき用プライマー組成物及び無電解めっき方法
US7909977B2 (en) * 2008-03-27 2011-03-22 Intel Corporation Method of manufacturing a substrate for a microelectronic device, and substrate formed thereby
EP2384246A1 (fr) * 2009-01-30 2011-11-09 E. I. du Pont de Nemours and Company Encres de jet d'encre avec densité optique améliorée
GB2549222B (en) * 2014-02-19 2018-06-20 Golden Mark Water color paint system
JP7143559B2 (ja) 2017-08-28 2022-09-29 ディーエスエム アイピー アセッツ ビー．ブイ． フッ素化ポリウレタンを含む合成膜組成物
US11643551B2 (en) * 2017-08-28 2023-05-09 Dsm Ip Assets B.V. Synthetic membrane composition comprising a polyurethane and a polyoxazoline
CN109694685B (zh) * 2018-12-31 2021-07-13 苏州思德新材料科技有限公司 一种阻燃型单组份泡沫填缝剂及其制备方法
CN114958169B (zh) * 2022-05-11 2022-12-02 电子科技大学 一种用于制备图形化金属层的交联催化剂

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3560257A (en) * 1967-01-03 1971-02-02 Kollmorgen Photocircuits Metallization of insulating substrates
US3900320A (en) * 1971-09-30 1975-08-19 Bell & Howell Co Activation method for electroless plating
US4017265A (en) * 1972-02-15 1977-04-12 Taylor David W Ferromagnetic memory layer, methods of making and adhering it to substrates, magnetic tapes, and other products
DE2443488A1 (de) * 1973-10-25 1975-04-30 Akad Wissenschaften Ddr Metallisierte koerper und verfahren zu deren herstellung
US4368281A (en) * 1980-09-15 1983-01-11 Amp Incorporated Printed circuits
DE3148280A1 (de) * 1981-12-05 1983-06-09 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
US4701351A (en) * 1986-06-16 1987-10-20 International Business Machines Corporation Seeding process for electroless metal deposition
DE3627256A1 (de) * 1986-08-12 1988-02-18 Bayer Ag Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf kunststoffoberflaechen
DE3743780A1 (de) * 1987-12-23 1989-07-06 Bayer Ag Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf polyimidoberflaechen
DE3814506A1 (de) * 1988-04-29 1989-11-09 Bayer Ag Verfahren zum metallisieren von substratoberflaechen
US5053280A (en) * 1988-09-20 1991-10-01 Hitachi-Chemical Co., Ltd. Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent

Also Published As

Publication number Publication date
EP0485839A3 (en) 1993-02-24
EP0485839B1 (fr) 1995-01-04
JPH04365872A (ja) 1992-12-17
DE4036591A1 (de) 1992-05-21
DE59104146D1 (de) 1995-02-16
US5378268A (en) 1995-01-03
EP0485839A2 (fr) 1992-05-20
CA2055352C (fr) 1999-10-26

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed