CA2055802A1 - Structure de refroidissement pour composants electroniques - Google Patents

Structure de refroidissement pour composants electroniques

Info

Publication number
CA2055802A1
CA2055802A1 CA2055802A CA2055802A CA2055802A1 CA 2055802 A1 CA2055802 A1 CA 2055802A1 CA 2055802 A CA2055802 A CA 2055802A CA 2055802 A CA2055802 A CA 2055802A CA 2055802 A1 CA2055802 A1 CA 2055802A1
Authority
CA
Canada
Prior art keywords
printed circuit
circuit board
electronic device
heat conductive
cooling structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2055802A
Other languages
English (en)
Other versions
CA2055802C (fr
Inventor
Hideki Zenitani
Mitsuo Okawachi
Hisato Sato
Haruhiko Horizoe
Naoya Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2055802A1 publication Critical patent/CA2055802A1/fr
Application granted granted Critical
Publication of CA2055802C publication Critical patent/CA2055802C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CA002055802A 1990-11-22 1991-11-19 Structure de refroidissement pour composants electroniques Expired - Fee Related CA2055802C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2-315782 1990-11-22
JP2315782A JPH04188795A (ja) 1990-11-22 1990-11-22 電子回路部品の放熱構造

Publications (2)

Publication Number Publication Date
CA2055802A1 true CA2055802A1 (fr) 1992-05-23
CA2055802C CA2055802C (fr) 1996-11-05

Family

ID=18069491

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002055802A Expired - Fee Related CA2055802C (fr) 1990-11-22 1991-11-19 Structure de refroidissement pour composants electroniques

Country Status (3)

Country Link
US (1) US5243218A (fr)
JP (1) JPH04188795A (fr)
CA (1) CA2055802C (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5369552A (en) * 1992-07-14 1994-11-29 Ncr Corporation Multi-chip module with multiple compartments
US5917236A (en) * 1995-12-08 1999-06-29 Hewlett-Packard Company Packaging system for field effects transistors
US5808236A (en) * 1997-04-10 1998-09-15 International Business Machines Corporation High density heatsink attachment
EP0898220B1 (fr) * 1997-08-19 2003-01-15 Hewlett-Packard Company, A Delaware Corporation Appareil électronique ayant un système de dissipation thermique amelioré
US5910884A (en) * 1998-09-03 1999-06-08 International Business Machines Corporation Heatsink retention and air duct assembly
JP4142227B2 (ja) * 2000-01-28 2008-09-03 サンデン株式会社 車両用電動圧縮機のモータ駆動用インバータ装置
US6417563B1 (en) * 2000-07-14 2002-07-09 Advanced Micro Devices, Inc. Spring frame for protecting packaged electronic devices
US8779444B2 (en) * 2006-11-03 2014-07-15 Relume Technologies, Inc. LED light engine with applied foil construction
DE102007038676B4 (de) 2007-08-15 2023-09-21 Sew-Eurodrive Gmbh & Co Kg Elektrogerät und Antrieb
JP2010086071A (ja) * 2008-09-29 2010-04-15 Toshiba Corp 電子機器
CN201628914U (zh) * 2009-10-21 2010-11-10 鸿富锦精密工业（深圳）有限公司 电脑机箱散热系统
KR101925354B1 (ko) 2009-10-23 2018-12-05 다우 코닝 도레이 캄파니 리미티드 공동-개질된 오가노폴리실록산
GB0922077D0 (en) * 2009-12-17 2010-02-03 Quixant Ltd Electronic assembly and casing thereof
JP6355224B2 (ja) 2011-12-27 2018-07-11 東レ・ダウコーニング株式会社 低臭性グリセリン誘導体変性シリコーンまたはそれを含む組成物の製造方法
JP6313540B2 (ja) 2011-12-27 2018-04-18 東レ・ダウコーニング株式会社 ジグリセリン誘導体変性シリコーン、それを含有してなる油中水型エマルション用乳化剤、外用剤および化粧料
JP6369888B2 (ja) 2011-12-27 2018-08-08 東レ・ダウコーニング株式会社 新規液状オルガノポリシロキサン及びその利用
JP6105920B2 (ja) 2011-12-27 2017-03-29 東レ・ダウコーニング株式会社 共変性オルガノポリシロキサン、それを含有してなる油中水型エマルション用乳化剤、外用剤および化粧料
CN106414557A (zh) 2014-04-21 2017-02-15 道康宁东丽株式会社 液态高纯度多元醇衍生物改性的有机硅或其组合物的制造方法
TWI598721B (zh) * 2015-07-13 2017-09-11 鴻騰精密科技股份有限公司 電子裝置
US10345874B1 (en) * 2016-05-02 2019-07-09 Juniper Networks, Inc Apparatus, system, and method for decreasing heat migration in ganged heatsinks
KR101841836B1 (ko) * 2016-07-05 2018-03-26 김구용 다면 방열구조를 갖는 pcb 모듈, 및 이 모듈에 사용되는 방열 플레이트, 다층 pcb 어셈블리, 및 모듈 케이스
JP6884553B2 (ja) * 2016-11-04 2021-06-09 エドワーズ株式会社 真空ポンプ制御装置及び真空ポンプ、並びに真空ポンプ制御装置の組立方法
US10591964B1 (en) 2017-02-14 2020-03-17 Juniper Networks, Inc Apparatus, system, and method for improved heat spreading in heatsinks
JP2022049327A (ja) * 2020-09-16 2022-03-29 キオクシア株式会社 半導体記憶装置
CN114222419B (zh) * 2021-12-22 2025-06-20 维沃移动通信有限公司 电路板组件和电子设备

Also Published As

Publication number Publication date
US5243218A (en) 1993-09-07
CA2055802C (fr) 1996-11-05
JPH04188795A (ja) 1992-07-07

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed
MKLA Lapsed

Effective date: 20011119