CA2091859C - Systeme de refroidissement de circuits electroniques encapsules - Google Patents

Systeme de refroidissement de circuits electroniques encapsules

Info

Publication number
CA2091859C
CA2091859C CA002091859A CA2091859A CA2091859C CA 2091859 C CA2091859 C CA 2091859C CA 002091859 A CA002091859 A CA 002091859A CA 2091859 A CA2091859 A CA 2091859A CA 2091859 C CA2091859 C CA 2091859C
Authority
CA
Canada
Prior art keywords
containers
nozzles
coolant
cooling system
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002091859A
Other languages
English (en)
Other versions
CA2091859A1 (fr
Inventor
Shinya Akamatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of CA2091859A1 publication Critical patent/CA2091859A1/fr
Application granted granted Critical
Publication of CA2091859C publication Critical patent/CA2091859C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/774—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/776—Arrangements for jet impingement, e.g. for spraying

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CA002091859A 1992-04-06 1993-03-17 Systeme de refroidissement de circuits electroniques encapsules Expired - Fee Related CA2091859C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4083782A JP2745948B2 (ja) 1992-04-06 1992-04-06 集積回路の冷却構造
JP83782/1992 1992-04-06

Publications (2)

Publication Number Publication Date
CA2091859A1 CA2091859A1 (fr) 1993-10-07
CA2091859C true CA2091859C (fr) 1996-07-02

Family

ID=13812203

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002091859A Expired - Fee Related CA2091859C (fr) 1992-04-06 1993-03-17 Systeme de refroidissement de circuits electroniques encapsules

Country Status (5)

Country Link
US (1) US5264984A (fr)
EP (1) EP0565297B1 (fr)
JP (1) JP2745948B2 (fr)
CA (1) CA2091859C (fr)
DE (1) DE69316066T2 (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2853481B2 (ja) * 1992-09-30 1999-02-03 日本電気株式会社 半導体素子の冷却構造
JP2500757B2 (ja) * 1993-06-21 1996-05-29 日本電気株式会社 集積回路の冷却構造
US5563768A (en) * 1995-08-31 1996-10-08 At&T Global Information Solutions Company Heat source cooling apparatus and method utilizing mechanism for dividing a flow of cooling fluid
US5576932A (en) * 1995-08-31 1996-11-19 At&T Global Information Solutions Company Method and apparatus for cooling a heat source
US5831824A (en) * 1996-01-31 1998-11-03 Motorola, Inc. Apparatus for spray-cooling multiple electronic modules
US5675473A (en) * 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US5718117A (en) * 1996-04-10 1998-02-17 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5687577A (en) * 1996-04-10 1997-11-18 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5731542A (en) * 1996-05-23 1998-03-24 Motorola, Inc. Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate
US5907473A (en) * 1997-04-04 1999-05-25 Raytheon Company Environmentally isolated enclosure for electronic components
US6388882B1 (en) * 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
JP2003051689A (ja) * 2001-08-06 2003-02-21 Toshiba Corp 発熱素子用冷却装置
US7084495B2 (en) * 2003-10-16 2006-08-01 Intel Corporation Electroosmotic pumps using porous frits for cooling integrated circuit stacks
EP1637741A1 (fr) * 2004-09-17 2006-03-22 Pumpenfabrik Ernst Vogel Gesellschaft m.b.H. Pompe et son unité de contrôle refroidie par le liquide pompé
US7277291B2 (en) * 2005-08-08 2007-10-02 Verifone Holdings, Inc. Thermal transfer device
CN101848624B (zh) * 2009-03-25 2013-07-03 富准精密工业(深圳)有限公司 液冷散热装置
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
FR2955971B1 (fr) * 2010-02-01 2012-03-09 Areva T & D Sas Echangeur de chaleur notamment pour un semi-conducteur de puissance
US9165857B2 (en) * 2012-11-08 2015-10-20 Intel Corporation Heat dissipation lid having direct liquid contact conduits
US9420728B2 (en) 2014-04-15 2016-08-16 International Business Machines Corporation Liquid-cooled heat sink configured to facilitate drainage
JP2015231015A (ja) * 2014-06-06 2015-12-21 富士通株式会社 液冷ジャケットおよび電子機器
US10651112B2 (en) 2016-11-01 2020-05-12 Massachusetts Institute Of Technology Thermal management of RF devices using embedded microjet arrays
US10665529B2 (en) 2017-07-21 2020-05-26 Massachusetts Institute Of Technology Modular microjet cooling of packaged electronic components
US20240314980A1 (en) * 2021-03-08 2024-09-19 Tesla, Inc. Cold plate with integrated sliding pedestal and processing system including the same
DE102022126106B4 (de) 2022-10-10 2026-01-22 Erwin Quarder Systemtechnik Gmbh Kühleinrichtung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1227886A (fr) * 1984-01-26 1987-10-06 Haruhiko Yamamoto Systeme a liquide caloporteur pour composants de circuits electroniques
JP2786193B2 (ja) * 1987-10-26 1998-08-13 株式会社日立製作所 半導体冷却装置
US4909315A (en) * 1988-09-30 1990-03-20 Microelectronics And Computer Technology Corporation Fluid heat exchanger for an electronic component
US4882654A (en) * 1988-12-22 1989-11-21 Microelectronics And Computer Technology Corporation Method and apparatus for adjustably mounting a heat exchanger for an electronic component
US5166863A (en) * 1991-07-15 1992-11-24 Amdahl Corporation Liquid-cooled assembly of heat-generating devices and method for assembling and disassembling

Also Published As

Publication number Publication date
DE69316066T2 (de) 1998-04-23
CA2091859A1 (fr) 1993-10-07
US5264984A (en) 1993-11-23
EP0565297B1 (fr) 1998-01-07
EP0565297A1 (fr) 1993-10-13
JPH05304234A (ja) 1993-11-16
DE69316066D1 (de) 1998-02-12
JP2745948B2 (ja) 1998-04-28

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Legal Events

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