CA2134575C - Montage de dispositifs en surface au moyen d'interconnexions adhesives conductrices - Google Patents

Montage de dispositifs en surface au moyen d'interconnexions adhesives conductrices

Info

Publication number
CA2134575C
CA2134575C CA002134575A CA2134575A CA2134575C CA 2134575 C CA2134575 C CA 2134575C CA 002134575 A CA002134575 A CA 002134575A CA 2134575 A CA2134575 A CA 2134575A CA 2134575 C CA2134575 C CA 2134575C
Authority
CA
Canada
Prior art keywords
membrane
assembly
pressure
cavity
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002134575A
Other languages
English (en)
Other versions
CA2134575A1 (fr
Inventor
Donald William Dahringer
Alan Michael Lyons
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Priority to CA002134575A priority Critical patent/CA2134575C/fr
Publication of CA2134575A1 publication Critical patent/CA2134575A1/fr
Application granted granted Critical
Publication of CA2134575C publication Critical patent/CA2134575C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CA002134575A 1994-10-28 1994-10-28 Montage de dispositifs en surface au moyen d'interconnexions adhesives conductrices Expired - Fee Related CA2134575C (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA002134575A CA2134575C (fr) 1994-10-28 1994-10-28 Montage de dispositifs en surface au moyen d'interconnexions adhesives conductrices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA002134575A CA2134575C (fr) 1994-10-28 1994-10-28 Montage de dispositifs en surface au moyen d'interconnexions adhesives conductrices

Publications (2)

Publication Number Publication Date
CA2134575A1 CA2134575A1 (fr) 1996-04-29
CA2134575C true CA2134575C (fr) 1999-08-31

Family

ID=4154554

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002134575A Expired - Fee Related CA2134575C (fr) 1994-10-28 1994-10-28 Montage de dispositifs en surface au moyen d'interconnexions adhesives conductrices

Country Status (1)

Country Link
CA (1) CA2134575C (fr)

Also Published As

Publication number Publication date
CA2134575A1 (fr) 1996-04-29

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed