CA2189801A1 - Methode de production de particules de bourrage conductrices de type microcapsulaire - Google Patents

Methode de production de particules de bourrage conductrices de type microcapsulaire

Info

Publication number
CA2189801A1
CA2189801A1 CA 2189801 CA2189801A CA2189801A1 CA 2189801 A1 CA2189801 A1 CA 2189801A1 CA 2189801 CA2189801 CA 2189801 CA 2189801 A CA2189801 A CA 2189801A CA 2189801 A1 CA2189801 A1 CA 2189801A1
Authority
CA
Canada
Prior art keywords
type conductive
conductive filler
conductive particles
production
step involving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA 2189801
Other languages
English (en)
Other versions
CA2189801C (fr
Inventor
Hiroaki Date
Makoto Usui
Isao Watanabe
Yuko Hozumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4263219A external-priority patent/JPH082995B2/ja
Application filed by Individual filed Critical Individual
Priority claimed from CA002081222A external-priority patent/CA2081222C/fr
Publication of CA2189801A1 publication Critical patent/CA2189801A1/fr
Application granted granted Critical
Publication of CA2189801C publication Critical patent/CA2189801C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
CA002189801A 1991-10-24 1992-10-23 Methode de production de particules de bourrage conductrices de type microcapsulaire Expired - Lifetime CA2189801C (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP3-303818 1991-10-24
JP30381891 1991-10-24
JP4263219A JPH082995B2 (ja) 1991-10-24 1992-09-04 マイクロカプセル型導電性フィラーの作製方法
JP4-263219 1992-09-04
CA002081222A CA2081222C (fr) 1991-10-24 1992-10-23 Methode d'enduction de charge conductrice sous microcapsules

Publications (2)

Publication Number Publication Date
CA2189801A1 true CA2189801A1 (fr) 1993-04-25
CA2189801C CA2189801C (fr) 2000-12-12

Family

ID=27169226

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002189801A Expired - Lifetime CA2189801C (fr) 1991-10-24 1992-10-23 Methode de production de particules de bourrage conductrices de type microcapsulaire

Country Status (1)

Country Link
CA (1) CA2189801C (fr)

Also Published As

Publication number Publication date
CA2189801C (fr) 2000-12-12

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Effective date: 20121023