CA2189801C - Methode de production de particules de bourrage conductrices de type microcapsulaire - Google Patents

Methode de production de particules de bourrage conductrices de type microcapsulaire Download PDF

Info

Publication number
CA2189801C
CA2189801C CA002189801A CA2189801A CA2189801C CA 2189801 C CA2189801 C CA 2189801C CA 002189801 A CA002189801 A CA 002189801A CA 2189801 A CA2189801 A CA 2189801A CA 2189801 C CA2189801 C CA 2189801C
Authority
CA
Canada
Prior art keywords
minute
adhesive agent
conductive
particles
type conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA002189801A
Other languages
English (en)
Other versions
CA2189801A1 (fr
Inventor
Hiroaki Date
Makoto Usui
Isao Watanabe
Yuko Hozumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4263219A external-priority patent/JPH082995B2/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority claimed from CA002081222A external-priority patent/CA2081222C/fr
Publication of CA2189801A1 publication Critical patent/CA2189801A1/fr
Application granted granted Critical
Publication of CA2189801C publication Critical patent/CA2189801C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
CA002189801A 1991-10-24 1992-10-23 Methode de production de particules de bourrage conductrices de type microcapsulaire Expired - Lifetime CA2189801C (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP3-303818 1991-10-24
JP30381891 1991-10-24
JP4263219A JPH082995B2 (ja) 1991-10-24 1992-09-04 マイクロカプセル型導電性フィラーの作製方法
JP4-263219 1992-09-04
CA002081222A CA2081222C (fr) 1991-10-24 1992-10-23 Methode d'enduction de charge conductrice sous microcapsules

Publications (2)

Publication Number Publication Date
CA2189801A1 CA2189801A1 (fr) 1993-04-25
CA2189801C true CA2189801C (fr) 2000-12-12

Family

ID=27169226

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002189801A Expired - Lifetime CA2189801C (fr) 1991-10-24 1992-10-23 Methode de production de particules de bourrage conductrices de type microcapsulaire

Country Status (1)

Country Link
CA (1) CA2189801C (fr)

Also Published As

Publication number Publication date
CA2189801A1 (fr) 1993-04-25

Similar Documents

Publication Publication Date Title
US6080443A (en) Method for production of microcapsule type conductive filler
US7879445B2 (en) Adhesive for bonding circuit members, circuit board and process for its production
KR950000710B1 (ko) 이방도전성 접착제 조성물
US6340113B1 (en) Soldering methods and compositions
US6328844B1 (en) Filmy adhesive for connecting circuits and circuit board
US5641996A (en) Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
US6059952A (en) Method of fabricating coated powder materials and their use for high conductivity paste applications
JPH08227613A (ja) 導電性材料およびその使用方法
US6322685B1 (en) Apparatus and method for plating coatings on to fine powder materials and use of the powder therefrom
CA2081222C (fr) Methode d'enduction de charge conductrice sous microcapsules
US6255138B1 (en) Process for producing microencapsulated electroconductive filler
CA2189801C (fr) Methode de production de particules de bourrage conductrices de type microcapsulaire
US6737108B2 (en) Microcapsulating conductive metal particles with polymerized monomers
JP3446731B2 (ja) エポキシ樹脂組成物及び半導体装置
JPS62127194A (ja) 異方導電性はんだ接合材料の製造方法
JPH0688040A (ja) マイクロカプセル型導電性フィラーの作製方法
Paik et al. Flip chip assembly on organic boards using anisotropic conductive adhesives (ACAs) and nickel/gold bumps
EP1454973B1 (fr) Adhésif pour fixer des éléments de circuit, cartre de circuit imprimé et procédé de production
JP4092790B2 (ja) 回路板
JP3505321B2 (ja) 導電性微粒子及び基板
JPH09204816A (ja) 導電ペーストおよび導電性組成物並びにそれらの導電性コネクタとしての使用法
Wu et al. Self-alignment feasibility study and contact resistance improvement of electrically conductive adhesives (ECAs)
JPH06275123A (ja) カプセル型導電性接着剤用導電性フィラー
JP2018046238A (ja) 接続構造体及びその製造方法、端子付き電極の製造方法並びにこれに用いられる導電粒子、キット及び転写型

Legal Events

Date Code Title Description
EEER Examination request
MKEX Expiry
MKEX Expiry

Effective date: 20121023