CA2260885C - Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede - Google Patents

Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede Download PDF

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Publication number
CA2260885C
CA2260885C CA002260885A CA2260885A CA2260885C CA 2260885 C CA2260885 C CA 2260885C CA 002260885 A CA002260885 A CA 002260885A CA 2260885 A CA2260885 A CA 2260885A CA 2260885 C CA2260885 C CA 2260885C
Authority
CA
Canada
Prior art keywords
conducting
printed circuit
paths
conducting paths
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA002260885A
Other languages
English (en)
Other versions
CA2260885A1 (fr
Inventor
Francois Droz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nagravision SARL
Original Assignee
NID SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NID SA filed Critical NID SA
Priority to CA002260885A priority Critical patent/CA2260885C/fr
Priority to PCT/CH1996/000263 priority patent/WO1998004106A1/fr
Priority to AU62972/96A priority patent/AU6297296A/en
Publication of CA2260885A1 publication Critical patent/CA2260885A1/fr
Application granted granted Critical
Publication of CA2260885C publication Critical patent/CA2260885C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H01F2027/2861—Coil formed by folding a blank

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Procédé de fabrication de circuit imprimé (21; 31) à partir d'un film diélectrique (1) revêtu d'une ou plusieurs couches conductrices métalliques superficielles (2, 2') comprenant une étape de démarcation des différentes pistes conductrices (8) par usinage mécanique d'entailles (7) dans ladite couche conductrice. L'usinage est effectué au moyen d'un outil de coupe tranchant (5; 10) permettant de couper des entailles séparant lesdites pistes conductrices, sans retrait de matière conductrice ni repoussement vers la profondeur. Par exemple, un poinçon d'étampage (5) ou une table de découpe commandant une lame (10) peut être utilisée pour tailler des entailles. Convient également pour des circuits multicouches. Particulièrement adapté pour circuits imprimés flexibles, pour connecteurs, etc. et pour bobines d'inductance (23) utilisées par exemple dans des cartes à puce (20; 30).
CA002260885A 1996-07-18 1996-07-18 Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede Expired - Lifetime CA2260885C (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CA002260885A CA2260885C (fr) 1996-07-18 1996-07-18 Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede
PCT/CH1996/000263 WO1998004106A1 (fr) 1996-07-18 1996-07-18 Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede
AU62972/96A AU6297296A (en) 1996-07-18 1996-07-18 Method for making printed circuits and resulting printed circuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CA002260885A CA2260885C (fr) 1996-07-18 1996-07-18 Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede
PCT/CH1996/000263 WO1998004106A1 (fr) 1996-07-18 1996-07-18 Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede

Publications (2)

Publication Number Publication Date
CA2260885A1 CA2260885A1 (fr) 1998-01-29
CA2260885C true CA2260885C (fr) 2008-09-16

Family

ID=25680787

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002260885A Expired - Lifetime CA2260885C (fr) 1996-07-18 1996-07-18 Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede

Country Status (2)

Country Link
CA (1) CA2260885C (fr)
WO (1) WO1998004106A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3335938B2 (ja) 1999-03-01 2002-10-21 新光電気工業株式会社 Ｉｃカード用アンテナフレーム及びｉｃカードの製造方法
DE10248020B4 (de) * 2002-10-15 2008-09-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zum Fügen von zumindest zwei Bauteilen
JP4672384B2 (ja) * 2004-04-27 2011-04-20 大日本印刷株式会社 Ｉｃタグ付シートの製造方法、ｉｃタグ付シートの製造装置、ｉｃタグ付シート、ｉｃチップの固定方法、ｉｃチップの固定装置、およびｉｃタグ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB610058A (en) * 1945-03-24 1948-10-11 Albert Ward Franklin Improvements in structural unit for radio apparatus and method of making the same
US2622054A (en) * 1946-05-11 1952-12-16 Albert W Franklin Method of making an electrical unit
DE1615015B1 (de) * 1965-01-14 1970-10-22 Western Electric Co Verfahren zur Herstellung einer gedruckten Schaltung
DE1690542A1 (de) * 1967-09-07 1971-11-18 Zucht Geb Schmidt Gisela Verfahren zur mechanischen Separierung reproduzierbarer,diskreter Leiterbahnen auf mit leitender Schicht bedecktem Isoliermaterial
DE2223892A1 (de) * 1971-05-18 1973-01-11 Maria Antonietta Brandi Verfahren zum herstellen von elektrischen stromleiterplatten
FR2318556A1 (fr) * 1975-07-12 1977-02-11 Seebach Juergen Procede de fabrication de plaques de circuits electriques et appareil mettant en oeuvre ce procede
US4356627A (en) * 1980-02-04 1982-11-02 Amp Incorporated Method of making circuit path conductors in plural planes
DE3330738A1 (de) * 1983-08-26 1985-03-07 Gerhard 8912 Kaufering Rahlf Verfahren und vorrichtung zur herstellung von elektrischen schaltungen auf leiterplatten
FR2674724A1 (fr) * 1991-03-27 1992-10-02 Lecoent Fernand Procede de fabrication de circuit electronique moule en deux ou trois dimensions.

Also Published As

Publication number Publication date
WO1998004106A1 (fr) 1998-01-29
CA2260885A1 (fr) 1998-01-29

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