CA2309630A1 - Heat pipe thermal management apparatus - Google Patents

Heat pipe thermal management apparatus Download PDF

Info

Publication number
CA2309630A1
CA2309630A1 CA002309630A CA2309630A CA2309630A1 CA 2309630 A1 CA2309630 A1 CA 2309630A1 CA 002309630 A CA002309630 A CA 002309630A CA 2309630 A CA2309630 A CA 2309630A CA 2309630 A1 CA2309630 A1 CA 2309630A1
Authority
CA
Canada
Prior art keywords
resin
thermal
resins
carbon fiber
thermal management
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002309630A
Other languages
English (en)
French (fr)
Inventor
James D. Miller
Kevin J. Levesque
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BP Corp North America Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2309630A1 publication Critical patent/CA2309630A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CA002309630A 1997-11-13 1998-11-09 Heat pipe thermal management apparatus Abandoned CA2309630A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6541897P 1997-11-13 1997-11-13
US60/065,418 1997-11-13
PCT/US1998/023711 WO1999026286A1 (en) 1997-11-13 1998-11-09 Heat pipe thermal management apparatus

Publications (1)

Publication Number Publication Date
CA2309630A1 true CA2309630A1 (en) 1999-05-27

Family

ID=22062582

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002309630A Abandoned CA2309630A1 (en) 1997-11-13 1998-11-09 Heat pipe thermal management apparatus

Country Status (4)

Country Link
EP (1) EP1029352A1 (de)
JP (1) JP2001523892A (de)
CA (1) CA2309630A1 (de)
WO (1) WO1999026286A1 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6215661B1 (en) * 1999-08-11 2001-04-10 Motorola, Inc. Heat spreader
US6585039B2 (en) * 2000-02-01 2003-07-01 Cool Options, Inc. Composite overmolded heat pipe construction
US6408935B1 (en) * 2000-08-16 2002-06-25 Thermal Corp. Heat sink assembly with over-molded cooling fins
AU2001285013A1 (en) * 2001-08-17 2003-03-03 Honeywell International Inc. Thermal transfer devices using heat pipes
US6986435B2 (en) * 2001-08-23 2006-01-17 Cool Options, Inc. Self-heating food and beverage container made from a thermally conductive polymer composition
JP3834528B2 (ja) 2002-07-11 2006-10-18 ポリマテック株式会社 熱伝導性高分子成形体の製造方法
JP2004051852A (ja) 2002-07-22 2004-02-19 Polymatech Co Ltd 熱伝導性高分子成形体及びその製造方法
JP2004149722A (ja) * 2002-10-31 2004-05-27 Polymatech Co Ltd 熱伝導性高分子成形体
US6976769B2 (en) 2003-06-11 2005-12-20 Cool Options, Inc. Light-emitting diode reflector assembly having a heat pipe
US7781063B2 (en) * 2003-07-11 2010-08-24 Siemens Energy, Inc. High thermal conductivity materials with grafted surface functional groups
US7033670B2 (en) 2003-07-11 2006-04-25 Siemens Power Generation, Inc. LCT-epoxy polymers with HTC-oligomers and method for making the same
WO2005034236A1 (de) * 2003-09-29 2005-04-14 Siemens Aktiengesellschaft Plastisch verformbarer kühlkörper für elektrische und/ oder elektronische bauelemente
JP2008507594A (ja) * 2004-06-15 2008-03-13 シーメンス パワー ジェネレーション インコーポレイテッド 樹脂内に配列した高熱伝導性材料
US20050277721A1 (en) 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
US7553781B2 (en) 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
US7592045B2 (en) 2004-06-15 2009-09-22 Siemens Energy, Inc. Seeding of HTC fillers to form dendritic structures
US7553438B2 (en) 2004-06-15 2009-06-30 Siemens Energy, Inc. Compression of resin impregnated insulating tapes
US8216672B2 (en) 2004-06-15 2012-07-10 Siemens Energy, Inc. Structured resin systems with high thermal conductivity fillers
US8030818B2 (en) 2004-06-15 2011-10-04 Siemens Energy, Inc. Stator coil with improved heat dissipation
US20050274774A1 (en) 2004-06-15 2005-12-15 Smith James D Insulation paper with high thermal conductivity materials
US7776392B2 (en) 2005-04-15 2010-08-17 Siemens Energy, Inc. Composite insulation tape with loaded HTC materials
JP2006113126A (ja) * 2004-10-12 2006-04-27 Sony Corp 液晶表示パネルの枠体及び液晶表示装置
US7651963B2 (en) 2005-04-15 2010-01-26 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
US7846853B2 (en) 2005-04-15 2010-12-07 Siemens Energy, Inc. Multi-layered platelet structure
CN101180370B (zh) 2005-05-20 2011-12-07 住友化学株式会社 聚合物组合物和使用该聚合物组合物的高分子发光器件
US7781057B2 (en) 2005-06-14 2010-08-24 Siemens Energy, Inc. Seeding resins for enhancing the crystallinity of polymeric substructures
US7955661B2 (en) 2005-06-14 2011-06-07 Siemens Energy, Inc. Treatment of micropores in mica materials
US8357433B2 (en) 2005-06-14 2013-01-22 Siemens Energy, Inc. Polymer brushes
US7655295B2 (en) 2005-06-14 2010-02-02 Siemens Energy, Inc. Mix of grafted and non-grafted particles in a resin
US7547847B2 (en) 2006-09-19 2009-06-16 Siemens Energy, Inc. High thermal conductivity dielectric tape
CN102498149B (zh) * 2009-09-16 2013-11-27 株式会社钟化 有机导热性添加剂、树脂组合物及硬化物
EP3499119A1 (de) * 2017-12-18 2019-06-19 Covestro Deutschland AG Vorrichtung zum ableiten von wärme von einer wärmequelle und verwendung dieser vorrichtung

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US65418A (en) 1867-06-04 Improvement in boiler-feeders
JPS57145347A (en) * 1981-03-03 1982-09-08 Nec Corp Semiconductor package
JPS58140593A (ja) * 1982-02-15 1983-08-20 Mitsubishi Electric Corp ヒ−トパイプ
US4888247A (en) * 1986-08-27 1989-12-19 General Electric Company Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite
US4867235A (en) * 1986-10-20 1989-09-19 Westinghouse Electric Corp. Composite heat transfer means
EP0309982A3 (de) * 1987-09-30 1990-09-12 E.I. Du Pont De Nemours And Company Polymerkeramische Verbundplatte
JPH02198114A (ja) * 1988-10-03 1990-08-06 E I Du Pont De Nemours & Co 製造物品
US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
US5598632A (en) 1994-10-06 1997-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing micro heat panels
US5598320A (en) 1995-03-06 1997-01-28 Ast Research, Inc. Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices
US5621613A (en) 1995-05-16 1997-04-15 Intel Corporation Apparatus for dissipating heat in a hinged computing device

Also Published As

Publication number Publication date
JP2001523892A (ja) 2001-11-27
WO1999026286A1 (en) 1999-05-27
EP1029352A1 (de) 2000-08-23

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Legal Events

Date Code Title Description
FZDE Discontinued