CA2343486A1 - Methode de preparation de composes thermoconducteurs par l'intermediaire d'amas de particules a pontage de metal liquide - Google Patents
Methode de preparation de composes thermoconducteurs par l'intermediaire d'amas de particules a pontage de metal liquide Download PDFInfo
- Publication number
- CA2343486A1 CA2343486A1 CA 2343486 CA2343486A CA2343486A1 CA 2343486 A1 CA2343486 A1 CA 2343486A1 CA 2343486 CA2343486 CA 2343486 CA 2343486 A CA2343486 A CA 2343486A CA 2343486 A1 CA2343486 A1 CA 2343486A1
- Authority
- CA
- Canada
- Prior art keywords
- thermally conductive
- particulate
- liquid
- liquid metal
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 63
- 239000002245 particle Substances 0.000 title claims description 25
- 238000000034 method Methods 0.000 title claims description 17
- 150000001875 compounds Chemical class 0.000 title description 13
- 239000000203 mixture Substances 0.000 claims abstract description 47
- 239000007788 liquid Substances 0.000 claims abstract description 42
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 23
- 239000000956 alloy Substances 0.000 claims abstract description 23
- 229920002545 silicone oil Polymers 0.000 claims abstract description 20
- 229910052582 BN Inorganic materials 0.000 claims abstract description 17
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 17
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000007787 solid Substances 0.000 claims abstract description 5
- 230000009969 flowable effect Effects 0.000 claims abstract 7
- 239000000088 plastic resin Substances 0.000 claims abstract 7
- 238000002156 mixing Methods 0.000 claims description 22
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 20
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 claims description 16
- 229960003493 octyltriethoxysilane Drugs 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 229910052733 gallium Inorganic materials 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims 2
- RWHPJDQRXPFAJG-UHFFFAOYSA-N ethoxy(octyl)silane Chemical compound CCCCCCCC[SiH2]OCC RWHPJDQRXPFAJG-UHFFFAOYSA-N 0.000 claims 1
- 230000005661 hydrophobic surface Effects 0.000 claims 1
- 150000004756 silanes Chemical class 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
- 229910000807 Ga alloy Inorganic materials 0.000 abstract description 10
- 229910000846 In alloy Inorganic materials 0.000 abstract description 4
- 238000009472 formulation Methods 0.000 description 17
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 15
- 229910000077 silane Inorganic materials 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 229920000642 polymer Polymers 0.000 description 12
- 239000002131 composite material Substances 0.000 description 11
- 229920001296 polysiloxane Polymers 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 10
- 230000005484 gravity Effects 0.000 description 8
- 238000012856 packing Methods 0.000 description 7
- 239000000843 powder Substances 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 230000002209 hydrophobic effect Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000009974 thixotropic effect Effects 0.000 description 4
- NDXSUDIGSOJBLQ-UHFFFAOYSA-N [In][Bi][Zn][Sn] Chemical compound [In][Bi][Zn][Sn] NDXSUDIGSOJBLQ-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 238000005325 percolation Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000011236 particulate material Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002959 polymer blend Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920005573 silicon-containing polymer Polymers 0.000 description 2
- 229910000497 Amalgam Inorganic materials 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 238000001016 Ostwald ripening Methods 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- PSMFTUMUGZHOOU-UHFFFAOYSA-N [In].[Sn].[Bi] Chemical compound [In].[Sn].[Bi] PSMFTUMUGZHOOU-UHFFFAOYSA-N 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- MPZNMEBSWMRGFG-UHFFFAOYSA-N bismuth indium Chemical compound [In].[Bi] MPZNMEBSWMRGFG-UHFFFAOYSA-N 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- -1 for examp7_e Substances 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/690,994 | 2000-10-17 | ||
| US09/690,994 US6624224B1 (en) | 2000-04-05 | 2000-10-17 | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2343486A1 true CA2343486A1 (fr) | 2002-04-17 |
Family
ID=24774764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2343486 Abandoned CA2343486A1 (fr) | 2000-10-17 | 2001-04-03 | Methode de preparation de composes thermoconducteurs par l'intermediaire d'amas de particules a pontage de metal liquide |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2002121292A (fr) |
| CA (1) | CA2343486A1 (fr) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1754772A1 (fr) | 2005-08-18 | 2007-02-21 | Shin-Etsu Chemical Co., Ltd. | composition de graisse de silicone à conductivité thermique et produit durci formé à partir de celle-ci |
| CN112300511A (zh) * | 2019-07-26 | 2021-02-02 | 北京梦之墨科技有限公司 | 疏金属高分子材料、疏金属部件及基于液态金属的设备 |
| CN112449546A (zh) * | 2019-08-27 | 2021-03-05 | 华硕电脑股份有限公司 | 液态金属散热膏涂布方法及散热模块 |
| CN114075386A (zh) * | 2021-08-27 | 2022-02-22 | 苏州泰吉诺新材料科技有限公司 | 具有双连续结构的液体金属树脂复合材料及其制备方法 |
| CN116117130A (zh) * | 2023-03-08 | 2023-05-16 | 天津理工大学 | 一种表面张力降低的液态金属及其制备方法和应用 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4551074B2 (ja) * | 2003-10-07 | 2010-09-22 | 信越化学工業株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP4913874B2 (ja) * | 2010-01-18 | 2012-04-11 | 信越化学工業株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP5565758B2 (ja) * | 2011-06-29 | 2014-08-06 | 信越化学工業株式会社 | 硬化性でグリース状の熱伝導性シリコーン組成物および半導体装置 |
| JP5640945B2 (ja) | 2011-10-11 | 2014-12-17 | 信越化学工業株式会社 | 硬化性オルガノポリシロキサン組成物及び半導体装置 |
| EP4333047A4 (fr) | 2021-04-28 | 2025-04-30 | Shin-Etsu Chemical Co., Ltd. | Composition de silicone durcissable et dispositif à semi-conducteur |
| JP7467017B2 (ja) | 2021-05-25 | 2024-04-15 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
| WO2023149175A1 (fr) * | 2022-02-02 | 2023-08-10 | 信越化学工業株式会社 | Composition thermoconductrice de silicone et procédé de production associé |
| JP2023160267A (ja) * | 2022-04-22 | 2023-11-02 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物 |
| JP2024060273A (ja) | 2022-10-19 | 2024-05-02 | 信越化学工業株式会社 | 硬化性オルガノポリシロキサン組成物及び半導体装置 |
-
2001
- 2001-04-03 CA CA 2343486 patent/CA2343486A1/fr not_active Abandoned
- 2001-04-05 JP JP2001106954A patent/JP2002121292A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1754772A1 (fr) | 2005-08-18 | 2007-02-21 | Shin-Etsu Chemical Co., Ltd. | composition de graisse de silicone à conductivité thermique et produit durci formé à partir de celle-ci |
| CN112300511A (zh) * | 2019-07-26 | 2021-02-02 | 北京梦之墨科技有限公司 | 疏金属高分子材料、疏金属部件及基于液态金属的设备 |
| CN112449546A (zh) * | 2019-08-27 | 2021-03-05 | 华硕电脑股份有限公司 | 液态金属散热膏涂布方法及散热模块 |
| CN114075386A (zh) * | 2021-08-27 | 2022-02-22 | 苏州泰吉诺新材料科技有限公司 | 具有双连续结构的液体金属树脂复合材料及其制备方法 |
| CN116117130A (zh) * | 2023-03-08 | 2023-05-16 | 天津理工大学 | 一种表面张力降低的液态金属及其制备方法和应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002121292A (ja) | 2002-04-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Dead |