JP2002121292A - 液体金属架橋粒子クラスターによる熱伝導性化合物の製法 - Google Patents

液体金属架橋粒子クラスターによる熱伝導性化合物の製法

Info

Publication number
JP2002121292A
JP2002121292A JP2001106954A JP2001106954A JP2002121292A JP 2002121292 A JP2002121292 A JP 2002121292A JP 2001106954 A JP2001106954 A JP 2001106954A JP 2001106954 A JP2001106954 A JP 2001106954A JP 2002121292 A JP2002121292 A JP 2002121292A
Authority
JP
Japan
Prior art keywords
particles
mixture
liquid
thermally conductive
liquid metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001106954A
Other languages
English (en)
Japanese (ja)
Inventor
Sanjay Misra
ミスラ サンジェイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bergquist Co Inc
Original Assignee
Bergquist Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/690,994 external-priority patent/US6624224B1/en
Application filed by Bergquist Co Inc filed Critical Bergquist Co Inc
Publication of JP2002121292A publication Critical patent/JP2002121292A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
JP2001106954A 2000-10-17 2001-04-05 液体金属架橋粒子クラスターによる熱伝導性化合物の製法 Pending JP2002121292A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US690994 2000-10-17
US09/690,994 US6624224B1 (en) 2000-04-05 2000-10-17 Method of preparing thermally conductive compounds by liquid metal bridged particle clusters

Publications (1)

Publication Number Publication Date
JP2002121292A true JP2002121292A (ja) 2002-04-23

Family

ID=24774764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001106954A Pending JP2002121292A (ja) 2000-10-17 2001-04-05 液体金属架橋粒子クラスターによる熱伝導性化合物の製法

Country Status (2)

Country Link
JP (1) JP2002121292A (fr)
CA (1) CA2343486A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005112961A (ja) * 2003-10-07 2005-04-28 Shin Etsu Chem Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2010095730A (ja) * 2010-01-18 2010-04-30 Shin-Etsu Chemical Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2013010862A (ja) * 2011-06-29 2013-01-17 Shin-Etsu Chemical Co Ltd 硬化性でグリース状の熱伝導性シリコーン組成物および半導体装置
US8802763B2 (en) 2011-10-11 2014-08-12 Shin-Etsu Chemical Co., Ltd. Curable organopolysiloxane composition and semiconductor device
WO2022230600A1 (fr) 2021-04-28 2022-11-03 信越化学工業株式会社 Composition de silicone durcissable et dispositif à semi-conducteur
EP4095187A1 (fr) 2021-05-25 2022-11-30 Shin-Etsu Chemical Co., Ltd. Composition de silicone thermoconductrice et son produit durci
WO2023149175A1 (fr) * 2022-02-02 2023-08-10 信越化学工業株式会社 Composition thermoconductrice de silicone et procédé de production associé
JP2023160267A (ja) * 2022-04-22 2023-11-02 信越化学工業株式会社 熱伝導性シリコーン組成物
WO2024084897A1 (fr) 2022-10-19 2024-04-25 信越化学工業株式会社 Composition d'organopolysiloxane durcissable et dispositif à semi-conducteur

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4634891B2 (ja) 2005-08-18 2011-02-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物およびその硬化物
CN112300511A (zh) * 2019-07-26 2021-02-02 北京梦之墨科技有限公司 疏金属高分子材料、疏金属部件及基于液态金属的设备
CN112449546B (zh) * 2019-08-27 2024-07-19 华硕电脑股份有限公司 液态金属散热膏涂布方法及散热模块
CN114075386A (zh) * 2021-08-27 2022-02-22 苏州泰吉诺新材料科技有限公司 具有双连续结构的液体金属树脂复合材料及其制备方法
CN116117130B (zh) * 2023-03-08 2024-12-27 天津理工大学 一种表面张力降低的液态金属复合物及其制备方法和应用

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005112961A (ja) * 2003-10-07 2005-04-28 Shin Etsu Chem Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2010095730A (ja) * 2010-01-18 2010-04-30 Shin-Etsu Chemical Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2013010862A (ja) * 2011-06-29 2013-01-17 Shin-Etsu Chemical Co Ltd 硬化性でグリース状の熱伝導性シリコーン組成物および半導体装置
US8802763B2 (en) 2011-10-11 2014-08-12 Shin-Etsu Chemical Co., Ltd. Curable organopolysiloxane composition and semiconductor device
WO2022230600A1 (fr) 2021-04-28 2022-11-03 信越化学工業株式会社 Composition de silicone durcissable et dispositif à semi-conducteur
KR20240004493A (ko) 2021-04-28 2024-01-11 신에쓰 가가꾸 고교 가부시끼가이샤 경화성 오르가노폴리실록산 조성물 및 반도체 장치
EP4095187A1 (fr) 2021-05-25 2022-11-30 Shin-Etsu Chemical Co., Ltd. Composition de silicone thermoconductrice et son produit durci
KR20220159899A (ko) 2021-05-25 2022-12-05 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 조성물 및 그 경화물
WO2023149175A1 (fr) * 2022-02-02 2023-08-10 信越化学工業株式会社 Composition thermoconductrice de silicone et procédé de production associé
JP2023160267A (ja) * 2022-04-22 2023-11-02 信越化学工業株式会社 熱伝導性シリコーン組成物
WO2024084897A1 (fr) 2022-10-19 2024-04-25 信越化学工業株式会社 Composition d'organopolysiloxane durcissable et dispositif à semi-conducteur
KR20250086764A (ko) 2022-10-19 2025-06-13 신에쓰 가가꾸 고교 가부시끼가이샤 경화성 오르가노폴리실록산 조성물 및 반도체 장치

Also Published As

Publication number Publication date
CA2343486A1 (fr) 2002-04-17

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