CA2490464C - Procede de placage electrochimique de feuilles metalliques et de composites a matrice metallique, de revetements et de microcomposants - Google Patents

Procede de placage electrochimique de feuilles metalliques et de composites a matrice metallique, de revetements et de microcomposants Download PDF

Info

Publication number
CA2490464C
CA2490464C CA002490464A CA2490464A CA2490464C CA 2490464 C CA2490464 C CA 2490464C CA 002490464 A CA002490464 A CA 002490464A CA 2490464 A CA2490464 A CA 2490464A CA 2490464 C CA2490464 C CA 2490464C
Authority
CA
Canada
Prior art keywords
anode
range
cathode
cathodic
electrolyte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA002490464A
Other languages
English (en)
Other versions
CA2490464A1 (fr
Inventor
Gino Palumbo
Iain Brooks
Uwe Erb
Jonathan Mccrea
Glenn D. Hibbard
Francisco Gonzalez
Klaus Tomantschger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Integran Technologies Inc
Original Assignee
Integran Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integran Technologies Inc filed Critical Integran Technologies Inc
Publication of CA2490464A1 publication Critical patent/CA2490464A1/fr
Application granted granted Critical
Publication of CA2490464C publication Critical patent/CA2490464C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonic waves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/67—Electroplating to repair workpiece
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacture Of Switches (AREA)

Abstract

L'invention concerne un procédé de formation de revêtements ou de dépôts autonomes de métaux nanocristallins, d'alliages métalliques ou de composites à matrice métallique. Ce procédé utilise un dépôt au tambour ou des processus de placage sélectif mettant en oeuvre une position d'électrode par impulsion avec une anode ou une cathode non stationnaire. L'invention concerne aussi des composites et de microcomposants à matrice métallique. Elle concerne enfin un procédé de formation de microcomposants dont la granulométrie est inférieure à 1000 nm.
CA002490464A 2002-06-25 2002-06-25 Procede de placage electrochimique de feuilles metalliques et de composites a matrice metallique, de revetements et de microcomposants Expired - Lifetime CA2490464C (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2002/007023 WO2004001100A1 (fr) 2002-06-25 2002-06-25 Procede de placage electrochimique de feuilles metalliques et de composites a matrice metallique, de revetements et de microcomposants

Publications (2)

Publication Number Publication Date
CA2490464A1 CA2490464A1 (fr) 2003-12-31
CA2490464C true CA2490464C (fr) 2008-09-02

Family

ID=29762587

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002490464A Expired - Lifetime CA2490464C (fr) 2002-06-25 2002-06-25 Procede de placage electrochimique de feuilles metalliques et de composites a matrice metallique, de revetements et de microcomposants

Country Status (15)

Country Link
EP (2) EP1826294A1 (fr)
JP (1) JP2005530926A (fr)
KR (1) KR100890819B1 (fr)
AT (1) ATE387522T1 (fr)
AU (1) AU2002321112B2 (fr)
BR (1) BR0215787B1 (fr)
CA (1) CA2490464C (fr)
DE (1) DE60225352T2 (fr)
DK (1) DK1516076T3 (fr)
ES (1) ES2301666T3 (fr)
IL (1) IL165904A0 (fr)
MX (1) MXPA04011940A (fr)
PT (1) PT1516076E (fr)
WO (1) WO2004001100A1 (fr)
ZA (1) ZA200410368B (fr)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004090361A2 (fr) * 2003-04-03 2004-10-21 The Timken Company Palier a element roulant tolerant a la corrosion
WO2004092450A1 (fr) 2003-04-11 2004-10-28 Lynntech, Inc. Compositions et revetements comprenant des quasicristaux
US8152810B2 (en) 2004-11-23 2012-04-10 Jackson Roger P Spinal fixation tool set and method
US7354354B2 (en) 2004-12-17 2008-04-08 Integran Technologies Inc. Article comprising a fine-grained metallic material and a polymeric material
US7320832B2 (en) 2004-12-17 2008-01-22 Integran Technologies Inc. Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
US7387578B2 (en) 2004-12-17 2008-06-17 Integran Technologies Inc. Strong, lightweight article containing a fine-grained metallic layer
US7425255B2 (en) 2005-06-07 2008-09-16 Massachusetts Institute Of Technology Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition
CA2619509C (fr) 2005-08-12 2015-01-06 Modumetal, Llc. Materiaux composites a composition modulee et leurs procedes de fabrication
US20070170068A1 (en) * 2006-01-24 2007-07-26 Usc, Llc Electrocomposite coatings for hard chrome replacement
US8202627B2 (en) * 2006-01-24 2012-06-19 Usc, Llc Electrocomposite coatings for hard chrome replacement
US7897265B2 (en) 2006-01-26 2011-03-01 Hamilton Sundstrand Corporation Low cost, environmentally favorable, chromium plate replacement coating for improved wear performance
JP4724581B2 (ja) * 2006-03-28 2011-07-13 新日本製鐵株式会社 磁気特性に優れた表面処理金属材およびその製造方法
US7521128B2 (en) * 2006-05-18 2009-04-21 Xtalic Corporation Methods for the implementation of nanocrystalline and amorphous metals and alloys as coatings
US20070275262A1 (en) * 2006-05-23 2007-11-29 Dechao Lin Reducing formation of tin whiskers on a tin plating layer
US9005420B2 (en) * 2007-12-20 2015-04-14 Integran Technologies Inc. Variable property electrodepositing of metallic structures
US7955721B2 (en) * 2008-01-16 2011-06-07 Hamilton Sundstrand Corporation Article having cobalt-phosphorous coating and method for heat treating
JP4564545B2 (ja) * 2008-03-25 2010-10-20 株式会社東芝 コーティング方法
CA2730229C (fr) 2008-07-07 2017-02-14 John D. Whitaker Materiaux a propriete modulee et procedes de fabrication de ceux-ci
US8309233B2 (en) * 2009-06-02 2012-11-13 Integran Technologies, Inc. Electrodeposited metallic-materials comprising cobalt on ferrous-alloy substrates
US8247050B2 (en) 2009-06-02 2012-08-21 Integran Technologies, Inc. Metal-coated polymer article of high durability and vacuum and/or pressure integrity
BRPI1010877B1 (pt) 2009-06-08 2020-09-15 Modumetal, Inc Revestimento de multicamadas resistente à corrosão e método de eletrodeposição
DE102009043594B4 (de) 2009-09-25 2013-05-16 Siemens Aktiengesellschaft Verfahren zum elektrochemischen Beschichten und Einbau von Partikeln in die Schicht
DE102009060937A1 (de) 2009-12-22 2011-06-30 Siemens Aktiengesellschaft, 80333 Verfahren zum elektrochemischen Beschichten
CN106086502B (zh) * 2010-03-12 2018-12-04 克斯塔里克公司 具有涂层的物件及涂布方法
US9694562B2 (en) 2010-03-12 2017-07-04 Xtalic Corporation Coated articles and methods
CA2806328C (fr) 2010-07-22 2019-01-22 Modumetal Llc Materiau et procede de deposition electrochimique d'alliages en laiton nanostratifies
KR101304846B1 (ko) * 2011-06-10 2013-09-05 주식회사 포스코 우수한 방열성을 갖는 플렉서블 디스플레이용 기판 및 그 제조방법
KR101322024B1 (ko) 2011-06-13 2013-10-28 주식회사 포스코 우수한 가요성 및 내구성을 갖는 태양전지용 Ｆｅ-Ｎｉ합금 기판 및 그 제조방법
WO2013074702A1 (fr) 2011-11-15 2013-05-23 Ashwin-Ushas Corporation, Inc. Dispositif électrochromique à polymères complémentaires
GB2497520A (en) * 2011-12-09 2013-06-19 Mahle Int Gmbh Method of electroplating a bearing surface
US20130186765A1 (en) * 2012-01-23 2013-07-25 Seagate Technology Llc Electrodeposition methods
KR101491752B1 (ko) * 2012-05-04 2015-02-11 강원대학교산학협력단 연료 전지용 바이폴라 플레이트 및 그 제조방법과 이를 포함하는 연료 전지
DE102012211941B4 (de) * 2012-07-09 2021-04-22 Hilti Aktiengesellschaft Werkzeugmaschine und Herstellungsverfahren
KR101370966B1 (ko) * 2012-10-17 2014-03-07 단국대학교 천안캠퍼스 산학협력단 선택적 전자기파 흡수 및 차폐 기능을 동시에 가지는 복합 금속박판 제조장치 및 제조방법
JP6296491B2 (ja) * 2013-03-14 2018-03-20 セイコーインスツル株式会社 金属構造体、金属構造体の製造方法、ばね部品、時計用発停レバーおよび時計
WO2014146117A2 (fr) 2013-03-15 2014-09-18 Modumetal, Inc. Procédé et appareil d'application en continu de revêtements métalliques nanostratifiés
BR112015022020A8 (pt) 2013-03-15 2019-12-10 Modumetal Inc objeto ou revestimento e seu processo de fabricação
US9207515B2 (en) 2013-03-15 2015-12-08 Ashwin-Ushas Corporation, Inc. Variable-emittance electrochromic devices and methods of preparing the same
EA201500948A1 (ru) 2013-03-15 2016-03-31 Модьюметл, Инк. Способ изготовления изделия и изделие, изготовленное вышеуказанным способом
CA2905548C (fr) 2013-03-15 2022-04-26 Modumetal, Inc. Revetements nanostratifies
US10006141B2 (en) 2013-06-20 2018-06-26 Baker Hughes, A Ge Company, Llc Method to produce metal matrix nanocomposite
US10102930B2 (en) 2013-11-13 2018-10-16 Framatome Inc. Nuclear fuel rod cladding including a metal nanomaterial layer
BR112017005534A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva
US10669635B2 (en) * 2014-09-18 2020-06-02 Baker Hughes, A Ge Company, Llc Methods of coating substrates with composite coatings of diamond nanoparticles and metal
EP3194642A4 (fr) 2014-09-18 2018-07-04 Modumetal, Inc. Procédé et appareil d'application en continu de revêtements métalliques nanostratifiés
US9873827B2 (en) 2014-10-21 2018-01-23 Baker Hughes Incorporated Methods of recovering hydrocarbons using suspensions for enhanced hydrocarbon recovery
US10167392B2 (en) 2014-10-31 2019-01-01 Baker Hughes Incorporated Compositions of coated diamond nanoparticles, methods of forming coated diamond nanoparticles, and methods of forming coatings
US10155899B2 (en) 2015-06-19 2018-12-18 Baker Hughes Incorporated Methods of forming suspensions and methods for recovery of hydrocarbon material from subterranean formations
US9632059B2 (en) 2015-09-03 2017-04-25 Ashwin-Ushas Corporation, Inc. Potentiostat/galvanostat with digital interface
US9482880B1 (en) 2015-09-15 2016-11-01 Ashwin-Ushas Corporation, Inc. Electrochromic eyewear
US9945045B2 (en) 2015-12-02 2018-04-17 Ashwin-Ushas Corporation, Inc. Electrochemical deposition apparatus and methods of using the same
KR102402804B1 (ko) * 2015-12-11 2022-05-27 히타치 긴조쿠 가부시키가이샤 전극 장치 및 그것을 이용한 금속박의 제조 방법
US11365488B2 (en) 2016-09-08 2022-06-21 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
TW201821649A (zh) 2016-09-09 2018-06-16 美商馬杜合金股份有限公司 層合物與奈米層合物材料於工具及模製方法之應用
WO2018053158A1 (fr) 2016-09-14 2018-03-22 Modumetal, Inc. Système de génération de champ électrique complexe, fiable et à haut rendement, et procédé de production de revêtements l'utilisant
EP3535118A1 (fr) 2016-11-02 2019-09-11 Modumetal, Inc. Structures d'emballage à couches d'interface de haute densité de topologie optimisée
CA3057836A1 (fr) 2017-03-24 2018-09-27 Modumetal, Inc. Plongeurs de levage dotes de revetements deposes par electrodeposition, et systemes et procedes de production de ceux-ci
CA3060619A1 (fr) 2017-04-21 2018-10-25 Modumetal, Inc. Articles tubulaires dotes de revetements deposes par electrodeposition et systemes et procedes de production desdits articles
KR101977469B1 (ko) * 2017-07-03 2019-05-13 주식회사 포스코 금속 포일 연마 장치 및 금속 포일의 표면특성 개선 방법
KR102439621B1 (ko) * 2017-09-01 2022-09-01 에스케이넥실리스 주식회사 전해동박, 그 제조방법 및 이를 포함하는 고용량 Li 이차전지용 음극
EP3784823A1 (fr) 2018-04-27 2021-03-03 Modumetal, Inc. Appareils, systèmes et procédés de production d'une pluralité d'articles pourvus de revêtements nano-stratifiés à l'aide d'une rotation
DE102018120028A1 (de) * 2018-08-17 2020-02-20 Bolta-Werke Gmbh Verfahren zur Herstellung einer Metallfolie, Metallfolie, Bauteil, Elektrolytlösung und Vorrichtung
CN109989081B (zh) * 2019-04-17 2021-05-25 浙江宏途电气科技有限公司 便于操作的电刷镀工件修复装置
CN110724983B (zh) * 2019-10-12 2022-02-08 天津大学 一种利用脉冲电沉积法制备纳米铜包覆碳化钨核壳结构粉体的方法
CN112676561B (zh) * 2020-11-19 2023-05-12 四川有色金源粉冶材料有限公司 一种新型合金粉末及其制备方法、耐磨涂层及其制备工艺
JP7552548B2 (ja) * 2021-10-14 2024-09-18 トヨタ自動車株式会社 金属皮膜の成膜装置および金属皮膜の成膜方法
KR102852496B1 (ko) * 2025-03-31 2025-08-29 주식회사 미래테크온 금 기반 다성분 합금의 도금 방법
CN120082936A (zh) * 2025-05-06 2025-06-03 陕西优卡曼材料科技有限公司 蜂窝表面结构阴极辊及利用该阴极辊制造合金箔的方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL68330C (fr) * 1950-11-03
JPS57171691A (en) * 1981-04-13 1982-10-22 Tadashi Hoashi Automatic brush plating method
US5433797A (en) * 1992-11-30 1995-07-18 Queen's University Nanocrystalline metals
US5352266A (en) * 1992-11-30 1994-10-04 Queen'university At Kingston Nanocrystalline metals and process of producing the same
US6030851A (en) * 1995-06-07 2000-02-29 Grandmont; Paul E. Method for overpressure protected pressure sensor
US6080504A (en) * 1998-11-02 2000-06-27 Faraday Technology, Inc. Electrodeposition of catalytic metals using pulsed electric fields

Also Published As

Publication number Publication date
ATE387522T1 (de) 2008-03-15
PT1516076E (pt) 2008-03-11
DE60225352T2 (de) 2008-06-12
KR20050024394A (ko) 2005-03-10
EP1516076B1 (fr) 2008-02-27
BR0215787A (pt) 2005-03-01
ES2301666T3 (es) 2008-07-01
CA2490464A1 (fr) 2003-12-31
KR100890819B1 (ko) 2009-04-06
EP1516076A1 (fr) 2005-03-23
EP1826294A1 (fr) 2007-08-29
AU2002321112A1 (en) 2004-01-06
AU2002321112B2 (en) 2008-07-03
IL165904A0 (en) 2006-01-15
JP2005530926A (ja) 2005-10-13
WO2004001100A1 (fr) 2003-12-31
DE60225352D1 (de) 2008-04-10
MXPA04011940A (es) 2005-03-31
BR0215787B1 (pt) 2013-12-03
HK1075278A1 (en) 2005-12-09
ZA200410368B (en) 2006-07-26
DK1516076T3 (da) 2008-06-23

Similar Documents

Publication Publication Date Title
CA2490464C (fr) Procede de placage electrochimique de feuilles metalliques et de composites a matrice metallique, de revetements et de microcomposants
US20050205425A1 (en) Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
EP0339464B1 (fr) Electroplacage des particules fines
Hovestad et al. Electroplating of metal matrix composites by codeposition of suspended particles
EP1051543B1 (fr) Procede d'electrodeposition de revetement(s) metallique(s) sur des substances particulaires selon une vitesse d'enrobage elevee avec une forte densite de courant
US20120024696A1 (en) Electroplating Apparatus
CN103726083A (zh) 纳晶和非晶金属及合金作为涂层的实施方法
DE10228323B4 (de) Verfahren zum kathodischen elektrolytischen Abscheiden und Mikrokomponenten, hergestellt durch ein solches Verfahren
CN110453261A (zh) 一种基于电化学的材料表面改性方法与装置
Hussain Synthesis of bulk nanostructured materials by high speed turbulent flow—a method of electrodepositing nanocrystalline nickel
HK1105218A (en) Process for electroplating metallic and metal matrix composite foils and microcomponents
HK1075278B (en) Process for electroplating metallic and metal matrix composite foils, coatings and microcomponents
Ming et al. Wear resistance of copper EDM tool electrode electroformed from copper sulfate baths and pyrophosphate baths
DE10262102B4 (de) Verfahren zum kathodischen elektrolytischen Abscheiden
CN110760892B (zh) 一种连续电化学沉积制备金属颗粒的方法
US12529160B2 (en) Articles comprising heterogeneous and thermally stable grain-refined alloys
Swain Preparation of coated microtools for electrochemical machining applications
GB2622117A (en) Electroforming method and system
Sancakoğlu Co-deposition of metal films with ceramic nanoparticles on metallic substrates by electrodeposition system
CN118272898A (zh) 一种基于层流作用的射流电沉积合金共镀装置
Sundaram et al. 6 Electrical and Electrochemical
김한 Micro-pattern Metallization using Jet-circulating Electrodeposition
Wong Shaped pulse electroforming of nickel
JPH01247594A (ja) 金属微粉末の流動メッキ方法

Legal Events

Date Code Title Description
EEER Examination request
MKEX Expiry

Effective date: 20220627