ATE387522T1 - Verfahren zur elektroplattierung von metallischen und metall-matrix-composite folien, beschichtungen und mikrokomponenten - Google Patents

Verfahren zur elektroplattierung von metallischen und metall-matrix-composite folien, beschichtungen und mikrokomponenten

Info

Publication number
ATE387522T1
ATE387522T1 AT02754753T AT02754753T ATE387522T1 AT E387522 T1 ATE387522 T1 AT E387522T1 AT 02754753 T AT02754753 T AT 02754753T AT 02754753 T AT02754753 T AT 02754753T AT E387522 T1 ATE387522 T1 AT E387522T1
Authority
AT
Austria
Prior art keywords
metal
coatings
metal matrix
electroplatting
microcomponents
Prior art date
Application number
AT02754753T
Other languages
German (de)
English (en)
Inventor
Gino Palumbo
Iain Brooks
Jonathan Mccrea
Glenn Hibbard
Francisco Gonzalez
Klaus Tomantschger
Uwe Erb
Original Assignee
Integran Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integran Technologies Inc filed Critical Integran Technologies Inc
Application granted granted Critical
Publication of ATE387522T1 publication Critical patent/ATE387522T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonic waves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/67—Electroplating to repair workpiece
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacture Of Switches (AREA)
AT02754753T 2002-06-25 2002-06-25 Verfahren zur elektroplattierung von metallischen und metall-matrix-composite folien, beschichtungen und mikrokomponenten ATE387522T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2002/007023 WO2004001100A1 (fr) 2002-06-25 2002-06-25 Procede de placage electrochimique de feuilles metalliques et de composites a matrice metallique, de revetements et de microcomposants

Publications (1)

Publication Number Publication Date
ATE387522T1 true ATE387522T1 (de) 2008-03-15

Family

ID=29762587

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02754753T ATE387522T1 (de) 2002-06-25 2002-06-25 Verfahren zur elektroplattierung von metallischen und metall-matrix-composite folien, beschichtungen und mikrokomponenten

Country Status (15)

Country Link
EP (2) EP1826294A1 (fr)
JP (1) JP2005530926A (fr)
KR (1) KR100890819B1 (fr)
AT (1) ATE387522T1 (fr)
AU (1) AU2002321112B2 (fr)
BR (1) BR0215787B1 (fr)
CA (1) CA2490464C (fr)
DE (1) DE60225352T2 (fr)
DK (1) DK1516076T3 (fr)
ES (1) ES2301666T3 (fr)
IL (1) IL165904A0 (fr)
MX (1) MXPA04011940A (fr)
PT (1) PT1516076E (fr)
WO (1) WO2004001100A1 (fr)
ZA (1) ZA200410368B (fr)

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Also Published As

Publication number Publication date
CA2490464C (fr) 2008-09-02
PT1516076E (pt) 2008-03-11
DE60225352T2 (de) 2008-06-12
KR20050024394A (ko) 2005-03-10
EP1516076B1 (fr) 2008-02-27
BR0215787A (pt) 2005-03-01
ES2301666T3 (es) 2008-07-01
CA2490464A1 (fr) 2003-12-31
KR100890819B1 (ko) 2009-04-06
EP1516076A1 (fr) 2005-03-23
EP1826294A1 (fr) 2007-08-29
AU2002321112A1 (en) 2004-01-06
AU2002321112B2 (en) 2008-07-03
IL165904A0 (en) 2006-01-15
JP2005530926A (ja) 2005-10-13
WO2004001100A1 (fr) 2003-12-31
DE60225352D1 (de) 2008-04-10
MXPA04011940A (es) 2005-03-31
BR0215787B1 (pt) 2013-12-03
HK1075278A1 (en) 2005-12-09
ZA200410368B (en) 2006-07-26
DK1516076T3 (da) 2008-06-23

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