CA918483A - Process for improving photoresist adhesion - Google Patents
Process for improving photoresist adhesionInfo
- Publication number
- CA918483A CA918483A CA055027A CA55027A CA918483A CA 918483 A CA918483 A CA 918483A CA 055027 A CA055027 A CA 055027A CA 55027 A CA55027 A CA 55027A CA 918483 A CA918483 A CA 918483A
- Authority
- CA
- Canada
- Prior art keywords
- photoresist adhesion
- improving photoresist
- improving
- adhesion
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/6903—Inorganic materials containing silicon
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6502—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials
- H10P14/6506—Formation of intermediate materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/68—Organic materials, e.g. photoresists
- H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/136—Coating process making radiation sensitive element
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Formation Of Insulating Films (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74202568A | 1968-07-02 | 1968-07-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA918483A true CA918483A (en) | 1973-01-09 |
Family
ID=24983198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA055027A Expired CA918483A (en) | 1968-07-02 | 1969-06-23 | Process for improving photoresist adhesion |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3549368A (2) |
| CA (1) | CA918483A (2) |
| FR (1) | FR2012133A1 (2) |
| GB (1) | GB1262513A (2) |
Families Citing this family (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3779774A (en) * | 1972-05-09 | 1973-12-18 | Xidex Corp | Silicone surfactants for vesicular films |
| FR2193864B1 (2) * | 1972-07-31 | 1974-12-27 | Rhone Poulenc Sa | |
| US4103045A (en) * | 1972-07-31 | 1978-07-25 | Rhone-Poulenc, S.A. | Process for improving the adhesion of coatings made of photoresistant polymers to surfaces of inorganic oxides |
| JPS5525418B2 (2) * | 1972-12-20 | 1980-07-05 | ||
| JPS53292B2 (2) * | 1974-02-01 | 1978-01-07 | ||
| US3962004A (en) * | 1974-11-29 | 1976-06-08 | Rca Corporation | Pattern definition in an organic layer |
| US4075367A (en) * | 1976-03-18 | 1978-02-21 | Ncr Corporation | Semiconductor processing of silicon nitride |
| US4173683A (en) * | 1977-06-13 | 1979-11-06 | Rca Corporation | Chemically treating the overcoat of a semiconductor device |
| US4330569A (en) * | 1979-05-25 | 1982-05-18 | Ncr Corporation | Method for conditioning nitride surface |
| US4524126A (en) * | 1981-06-30 | 1985-06-18 | International Business Machines Corporation | Adhesion of a photoresist to a substrate |
| CA1184321A (en) * | 1981-06-30 | 1985-03-19 | John C. Marinace | Adhesion of a photoresist to a substrate |
| US4409319A (en) * | 1981-07-15 | 1983-10-11 | International Business Machines Corporation | Electron beam exposed positive resist mask process |
| US4491629A (en) * | 1982-02-22 | 1985-01-01 | Tokyo Shibaura Denki Kabushiki Kaisha | Water soluble photoresist composition with bisazide, diazo, polymer and silane |
| JPS59500436A (ja) * | 1982-03-29 | 1984-03-15 | モトロ−ラ・インコ−ポレ−テツド | 電子ビ−ム/光学的ハイブリドリソグラフイツクレジスト法 |
| US4431685A (en) * | 1982-07-02 | 1984-02-14 | International Business Machines Corporation | Decreasing plated metal defects |
| US4464458A (en) * | 1982-12-30 | 1984-08-07 | International Business Machines Corporation | Process for forming resist masks utilizing O-quinone diazide and pyrene |
| US4497890A (en) * | 1983-04-08 | 1985-02-05 | Motorola, Inc. | Process for improving adhesion of resist to gold |
| US4535054A (en) * | 1983-05-05 | 1985-08-13 | Hughes Aircraft Company | Wet process for developing styrene polymer resists for submicron lithography |
| JPS60147729A (ja) * | 1984-01-12 | 1985-08-03 | Toshiba Corp | ホトレジスト組成物 |
| US4592926A (en) * | 1984-05-21 | 1986-06-03 | Machine Technology, Inc. | Processing apparatus and method |
| JPS61248035A (ja) * | 1985-04-26 | 1986-11-05 | Nippon Zeon Co Ltd | 密着性の改良されたホトレジスト組成物 |
| US4806458A (en) * | 1985-10-28 | 1989-02-21 | Hoechst Celanese Corporation | Composition containing a mixture of hexa-alkyl disilazane and propylene glycol alkyl ether and/or propylene glycol alkyl ether acetate |
| US4692398A (en) * | 1985-10-28 | 1987-09-08 | American Hoechst Corporation | Process of using photoresist treating composition containing a mixture of a hexa-alkyl disilazane, propylene glycol alkyl ether and propylene glycol alkyl ether acetate |
| JPS62129846A (ja) * | 1985-12-02 | 1987-06-12 | Dainippon Screen Mfg Co Ltd | フオトレジストの塗布方法及び塗布装置 |
| US4976817A (en) * | 1988-12-09 | 1990-12-11 | Morton International, Inc. | Wet lamination process and apparatus |
| US5429673A (en) * | 1993-10-01 | 1995-07-04 | Silicon Resources, Inc. | Binary vapor adhesion promoters and methods of using the same |
| US5582703A (en) * | 1994-12-12 | 1996-12-10 | Palomar Technologies Corporation | Method of fabricating an ultra-high resolution three-color screen |
| US5846692A (en) * | 1995-12-04 | 1998-12-08 | Matsushita Electric Industrial Co., Ltd. | Pattern formation method |
| US5578505A (en) * | 1995-12-15 | 1996-11-26 | Micron Technology, Inc. | Methods for measuring the surface area of a semiconductor wafer |
| US6387719B1 (en) | 2001-02-28 | 2002-05-14 | Lexmark International, Inc. | Method for improving adhesion |
| US7851138B2 (en) | 2007-07-19 | 2010-12-14 | Hitachi Global Storage Technologies, Netherlands, B.V. | Patterning a surface comprising silicon and carbon |
| US9953952B2 (en) * | 2008-08-20 | 2018-04-24 | Infineon Technologies Ag | Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier |
| US9012133B2 (en) | 2011-08-30 | 2015-04-21 | International Business Machines Corporation | Removal of alkaline crystal defects in lithographic patterning |
| TWI707038B (zh) | 2013-08-05 | 2020-10-11 | 美商扭轉生物科技有限公司 | 重新合成之基因庫 |
| CA2975855C (en) | 2015-02-04 | 2025-09-23 | Twist Bioscience Corporation | SYNTHETIC GENE COMPOSITIONS AND ASSEMBLY METHODS |
| WO2016126882A1 (en) | 2015-02-04 | 2016-08-11 | Twist Bioscience Corporation | Methods and devices for de novo oligonucleic acid assembly |
| JP6699256B2 (ja) * | 2015-03-16 | 2020-05-27 | 大日本印刷株式会社 | インプリントモールド製造用基材とインプリントモールドの製造方法 |
| US9981239B2 (en) | 2015-04-21 | 2018-05-29 | Twist Bioscience Corporation | Devices and methods for oligonucleic acid library synthesis |
| KR20180050411A (ko) | 2015-09-18 | 2018-05-14 | 트위스트 바이오사이언스 코포레이션 | 올리고핵산 변이체 라이브러리 및 그의 합성 |
| KR102794025B1 (ko) | 2015-09-22 | 2025-04-09 | 트위스트 바이오사이언스 코포레이션 | 핵산 합성을 위한 가요성 기판 |
| GB201517629D0 (en) * | 2015-10-06 | 2015-11-18 | Isis Innovation | Device architecture |
| CN115920796A (zh) | 2015-12-01 | 2023-04-07 | 特韦斯特生物科学公司 | 功能化表面及其制备 |
| US10177001B2 (en) | 2016-05-31 | 2019-01-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Surface modifying material for semiconductor device fabrication |
| JP6854340B2 (ja) | 2016-08-22 | 2021-04-07 | ツイスト バイオサイエンス コーポレーション | デノボ合成された核酸ライブラリ |
| US10417457B2 (en) | 2016-09-21 | 2019-09-17 | Twist Bioscience Corporation | Nucleic acid based data storage |
| KR102514213B1 (ko) | 2016-12-16 | 2023-03-27 | 트위스트 바이오사이언스 코포레이션 | 면역 시냅스의 변이체 라이브러리 및 그의 합성 |
| US10096477B2 (en) | 2017-02-15 | 2018-10-09 | International Business Machines Corporation | Method to improve adhesion of photoresist on silicon substrate for extreme ultraviolet and electron beam lithography |
| CN110892485B (zh) | 2017-02-22 | 2024-03-22 | 特韦斯特生物科学公司 | 基于核酸的数据存储 |
| WO2018170169A1 (en) | 2017-03-15 | 2018-09-20 | Twist Bioscience Corporation | Variant libraries of the immunological synapse and synthesis thereof |
| WO2018231864A1 (en) | 2017-06-12 | 2018-12-20 | Twist Bioscience Corporation | Methods for seamless nucleic acid assembly |
| US10696965B2 (en) | 2017-06-12 | 2020-06-30 | Twist Bioscience Corporation | Methods for seamless nucleic acid assembly |
| CN111566125A (zh) | 2017-09-11 | 2020-08-21 | 特韦斯特生物科学公司 | Gpcr结合蛋白及其合成 |
| CN111565834B (zh) | 2017-10-20 | 2022-08-26 | 特韦斯特生物科学公司 | 用于多核苷酸合成的加热的纳米孔 |
| KR102804057B1 (ko) | 2018-01-04 | 2025-05-07 | 트위스트 바이오사이언스 코포레이션 | Dna 기반 디지털 정보 저장 |
| CA3100739A1 (en) | 2018-05-18 | 2019-11-21 | Twist Bioscience Corporation | Polynucleotides, reagents, and methods for nucleic acid hybridization |
| US11031244B2 (en) * | 2018-08-14 | 2021-06-08 | Lam Research Corporation | Modification of SNO2 surface for EUV lithography |
| US12357959B2 (en) | 2018-12-26 | 2025-07-15 | Twist Bioscience Corporation | Highly accurate de novo polynucleotide synthesis |
| CA3131691A1 (en) | 2019-02-26 | 2020-09-03 | Twist Bioscience Corporation | Variant nucleic acid libraries for antibody optimization |
| CN113766930B (zh) | 2019-02-26 | 2025-07-22 | 特韦斯特生物科学公司 | Glp1受体的变异核酸文库 |
| AU2020298294A1 (en) | 2019-06-21 | 2022-02-17 | Twist Bioscience Corporation | Barcode-based nucleic acid sequence assembly |
| JP2022548309A (ja) | 2019-09-23 | 2022-11-17 | ツイスト バイオサイエンス コーポレーション | Crth2のバリアント核酸ライブラリー |
| WO2021061842A1 (en) | 2019-09-23 | 2021-04-01 | Twist Bioscience Corporation | Variant nucleic acid libraries for single domain antibodies |
| IL293670A (en) | 2019-12-09 | 2022-08-01 | Twist Bioscience Corp | Variable nucleic acid libraries for adenosine receptors |
| TWI797640B (zh) | 2020-06-18 | 2023-04-01 | 法商液態空氣喬治斯克勞帝方法研究開發股份有限公司 | 基於矽之自組裝單層組成物及使用該組成物之表面製備 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3163534A (en) * | 1961-03-13 | 1964-12-29 | Harris Intertype Corp | Lithographic plate including a hydrophilic barrier layer comprising a silane, an acrylic compound, and an organic metal ester |
| US3398210A (en) * | 1963-06-17 | 1968-08-20 | Dow Corning | Compositions comprising acryloxyalkylsilanes and unsaturated polyester resins |
| US3405017A (en) * | 1965-02-26 | 1968-10-08 | Hughes Aircraft Co | Use of organosilicon subbing layer in photoresist method for obtaining fine patterns for microcircuitry |
| US3482977A (en) * | 1966-02-11 | 1969-12-09 | Sylvania Electric Prod | Method of forming adherent masks on oxide coated semiconductor bodies |
-
1968
- 1968-07-02 US US742025A patent/US3549368A/en not_active Expired - Lifetime
-
1969
- 1969-06-04 FR FR6918094A patent/FR2012133A1/fr active Pending
- 1969-06-23 CA CA055027A patent/CA918483A/en not_active Expired
- 1969-06-23 GB GB31561/69A patent/GB1262513A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1262513A (en) | 1972-02-02 |
| US3549368A (en) | 1970-12-22 |
| FR2012133A1 (2) | 1970-03-13 |
| DE1915085A1 (de) | 1970-03-05 |
| DE1915085B2 (de) | 1976-05-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA918483A (en) | Process for improving photoresist adhesion | |
| CA939247A (en) | Process for applying photoresist | |
| CA944365A (en) | Process for dipentene | |
| CA795689A (en) | Freezing-mixing process | |
| CA936544A (en) | Perchlorination process | |
| CA793795A (en) | Process for bonding | |
| CA785822A (en) | Isomerisation process | |
| CA778696A (en) | Heat-copying process | |
| CA788475A (en) | Dehydrodimerization process | |
| CA789590A (en) | Aldoling process | |
| CA788498A (en) | Dehydrodimerization process | |
| CA798096A (en) | Process | |
| AU429890B2 (en) | Cotelemerization process | |
| AU424405B2 (en) | Desulphiding process | |
| AU426905B2 (en) | Electrosharpening process | |
| AU431779B2 (en) | Freezing-mixing process | |
| CA831036A (en) | Process for bisurethanes | |
| AU459395B2 (en) | Process for polymerizing-olefins | |
| CA829346A (en) | Process for dialkyl-diphenylamines | |
| CA816171A (en) | Process for polychloroalkyl cyanofluoroalkanoates | |
| CA779235A (en) | Process for de-copperising lead | |
| CA791060A (en) | Process for de-copperising lead | |
| AU424851B2 (en) | Process for applying photoresist | |
| CA784454A (en) | Process timers | |
| AU427274B2 (en) | Vulcanisation process |