CA926034A - Method of manufacturing thick-film hybrid integrated circuits - Google Patents

Method of manufacturing thick-film hybrid integrated circuits

Info

Publication number
CA926034A
CA926034A CA113205A CA113205A CA926034A CA 926034 A CA926034 A CA 926034A CA 113205 A CA113205 A CA 113205A CA 113205 A CA113205 A CA 113205A CA 926034 A CA926034 A CA 926034A
Authority
CA
Canada
Prior art keywords
integrated circuits
hybrid integrated
film hybrid
manufacturing thick
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA113205A
Other languages
English (en)
Other versions
CA113205S (en
Inventor
H. Liederbach William
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Application granted granted Critical
Publication of CA926034A publication Critical patent/CA926034A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CA113205A 1970-07-06 1971-05-17 Method of manufacturing thick-film hybrid integrated circuits Expired CA926034A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5253870A 1970-07-06 1970-07-06

Publications (1)

Publication Number Publication Date
CA926034A true CA926034A (en) 1973-05-08

Family

ID=21978269

Family Applications (1)

Application Number Title Priority Date Filing Date
CA113205A Expired CA926034A (en) 1970-07-06 1971-05-17 Method of manufacturing thick-film hybrid integrated circuits

Country Status (9)

Country Link
US (1) US3714709A (fr)
BE (1) BE769531A (fr)
CA (1) CA926034A (fr)
DE (1) DE2132939A1 (fr)
ES (1) ES392704A1 (fr)
FR (1) FR2098054A5 (fr)
GB (1) GB1329052A (fr)
NL (1) NL7109258A (fr)
SE (1) SE378974B (fr)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2228218B1 (de) * 1972-06-09 1973-05-10 Siemens AG, 1000 Berlin u. 8000 München Verfahren zum tauchloeten von traegerplaettchen
DE2606963C3 (de) * 1976-02-20 1981-07-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung einer hartlötbaren Dickschichtschaltung auf ein vorzugsweise aus einer Oxidkeramik bestehendes Trägerplättchen
GB1592158A (en) * 1976-11-15 1981-07-01 Britax Wingard Ltd Heated mirrors and methods for making the same
FR2402379A1 (fr) * 1977-08-31 1979-03-30 Cayrol Pierre Henri Perfectionnements apportes aux circuits imprimes
US4238528A (en) * 1978-06-26 1980-12-09 International Business Machines Corporation Polyimide coating process and material
DE2915240A1 (de) 1978-06-28 1980-01-03 Mitsumi Electric Co Gedruckte schaltung
US4215333A (en) * 1978-10-02 1980-07-29 National Semiconductor Corporation Resistor termination
GB2046024B (en) * 1979-03-30 1983-01-26 Ferranti Ltd Circuit assembly
US4419818A (en) * 1981-10-26 1983-12-13 Amp Incorporated Method for manufacturing substrate with selectively trimmable resistors between signal leads and ground structure
US4426769A (en) 1981-08-14 1984-01-24 Amp Incorporated Moisture getter for integrated circuit packages
US4613940A (en) * 1982-11-09 1986-09-23 International Microelectronic Products Method and structure for use in designing and building electronic systems in integrated circuits
US4508758A (en) * 1982-12-27 1985-04-02 At&T Technologies, Inc. Encapsulated electronic circuit
US4791391A (en) * 1983-03-30 1988-12-13 E. I. Du Pont De Nemours And Company Planar filter connector having thick film capacitors
US4641221A (en) * 1985-08-02 1987-02-03 The Dow Chemical Company Thin tape for dielectric materials
DE3615583C2 (de) * 1986-05-09 1995-05-24 Hella Kg Hueck & Co Schaltungsanordnung
JPH0716116B2 (ja) * 1986-10-24 1995-02-22 株式会社東芝 電子装置
US5006822A (en) * 1990-01-03 1991-04-09 Prabhakara Reddy Hybrid RF coupling device with integrated capacitors and resistors
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5371326A (en) * 1993-08-31 1994-12-06 Clearwaters-Dreager; Cindy Non-toxic fabric conductors and method for making same
US5519253A (en) * 1993-09-07 1996-05-21 Delco Electronics Corp. Coaxial switch module
US5444295A (en) * 1993-09-07 1995-08-22 Delco Electronics Corp. Linear dual switch module
US5563447A (en) * 1993-09-07 1996-10-08 Delco Electronics Corp. High power semiconductor switch module
JP3461204B2 (ja) * 1993-09-14 2003-10-27 株式会社東芝 マルチチップモジュール
US5457878A (en) * 1993-10-12 1995-10-17 Lsi Logic Corporation Method for mounting integrated circuit chips on a mini-board
US5539254A (en) * 1994-03-09 1996-07-23 Delco Electronics Corp. Substrate subassembly for a transistor switch module
US5512790A (en) * 1994-07-21 1996-04-30 Delco Electronics Corporation Triaxial double switch module
DE69524855T2 (de) * 1994-08-25 2002-08-14 National Semiconductor Corp., Sunnyvale Bauelementstapel in mehrchiphalbleiterpackungen
US5588202A (en) * 1995-03-17 1996-12-31 Honeywell Inc. Method for manufacturing an overmolded sensor
FR2736740A1 (fr) * 1995-07-11 1997-01-17 Trt Telecom Radio Electr Procede de production et d'assemblage de carte a circuit integre et carte ainsi obtenue
US6127727A (en) * 1998-04-06 2000-10-03 Delco Electronics Corp. Semiconductor substrate subassembly with alignment and stress relief features
US5895974A (en) * 1998-04-06 1999-04-20 Delco Electronics Corp. Durable substrate subassembly for transistor switch module
US6732422B1 (en) * 2002-01-04 2004-05-11 Taiwan Semiconductor Manufacturing Company Method of forming resistors
DE10230712B4 (de) * 2002-07-08 2006-03-23 Siemens Ag Elektronikeinheit mit einem niedrigschmelzenden metallischen Träger
US9704944B2 (en) * 2013-02-28 2017-07-11 Texas Instruments Deutschland Gmbh Three precision resistors of different sheet resistance at same level
US11304310B1 (en) 2020-10-13 2022-04-12 Macronix International Co., Ltd. Method of fabricating circuit board

Also Published As

Publication number Publication date
SE378974B (fr) 1975-09-15
NL7109258A (fr) 1972-01-10
DE2132939A1 (de) 1972-01-13
FR2098054A5 (fr) 1972-03-03
BE769531A (fr) 1972-01-05
GB1329052A (en) 1973-09-05
US3714709A (en) 1973-02-06
ES392704A1 (es) 1973-08-01

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