CH391113A - Lötverbindung für Halbleiterelemente - Google Patents

Lötverbindung für Halbleiterelemente

Info

Publication number
CH391113A
CH391113A CH1336261A CH1336261A CH391113A CH 391113 A CH391113 A CH 391113A CH 1336261 A CH1336261 A CH 1336261A CH 1336261 A CH1336261 A CH 1336261A CH 391113 A CH391113 A CH 391113A
Authority
CH
Switzerland
Prior art keywords
semiconductor elements
solder connection
solder
connection
semiconductor
Prior art date
Application number
CH1336261A
Other languages
English (en)
Inventor
Giger Johannes
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH1336261A priority Critical patent/CH391113A/de
Priority to DEA38929A priority patent/DE1206086B/de
Priority to GB43338/62A priority patent/GB965346A/en
Priority to FR915478A priority patent/FR1339257A/fr
Publication of CH391113A publication Critical patent/CH391113A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
CH1336261A 1961-11-17 1961-11-17 Lötverbindung für Halbleiterelemente CH391113A (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CH1336261A CH391113A (de) 1961-11-17 1961-11-17 Lötverbindung für Halbleiterelemente
DEA38929A DE1206086B (de) 1961-11-17 1961-12-04 Verfahren zum Herstellen einer grossflaechigen Weichlotverbindung zwischen einer Elektroden-platte eines Halbleiterelements und einem metallischen Traeger
GB43338/62A GB965346A (en) 1961-11-17 1962-11-15 Semiconductor devices
FR915478A FR1339257A (fr) 1961-11-17 1962-11-15 Liaison soudée pour les éléments à semi-conducteurs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1336261A CH391113A (de) 1961-11-17 1961-11-17 Lötverbindung für Halbleiterelemente

Publications (1)

Publication Number Publication Date
CH391113A true CH391113A (de) 1965-04-30

Family

ID=4391763

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1336261A CH391113A (de) 1961-11-17 1961-11-17 Lötverbindung für Halbleiterelemente

Country Status (4)

Country Link
CH (1) CH391113A (de)
DE (1) DE1206086B (de)
FR (1) FR1339257A (de)
GB (1) GB965346A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4792672A (en) * 1985-04-12 1988-12-20 Grumman Aerospace Corporation Detector buffer board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2922092A (en) * 1957-05-09 1960-01-19 Westinghouse Electric Corp Base contact members for semiconductor devices
DE1053670B (de) * 1957-07-09 1959-03-26 Walter Brandt G M B H Verfahren zur Verbindung eines Stromfuehrungsleiters mit der metallischen Deckelektrode eines Trockengleichrichters
DE1116827B (de) * 1960-03-11 1961-11-09 Siemens Ag Verfahren zur Herstellung einer Halbleiteranordnung mit mindestens einer Legierungselektrode

Also Published As

Publication number Publication date
DE1206086B (de) 1965-12-02
GB965346A (en) 1964-07-29
FR1339257A (fr) 1963-10-04

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