CH427040A - Vorrichtung zum Kontaktieren einer Halbleiteranordnung mittels Thermokompression - Google Patents
Vorrichtung zum Kontaktieren einer Halbleiteranordnung mittels ThermokompressionInfo
- Publication number
- CH427040A CH427040A CH1590663A CH1590663A CH427040A CH 427040 A CH427040 A CH 427040A CH 1590663 A CH1590663 A CH 1590663A CH 1590663 A CH1590663 A CH 1590663A CH 427040 A CH427040 A CH 427040A
- Authority
- CH
- Switzerland
- Prior art keywords
- thermocompression
- contacting
- semiconductor arrangement
- semiconductor
- arrangement
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J7/00—Micromanipulators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07168—Means for storing or moving the material for the connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
- Support Of The Bearing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES83130A DE1225770B (de) | 1963-01-02 | 1963-01-02 | Vorrichtung zum Kontaktieren einer Halbleiteranordnung mittels Thermokompression |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH427040A true CH427040A (de) | 1966-12-31 |
Family
ID=7510805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1590663A CH427040A (de) | 1963-01-02 | 1963-12-24 | Vorrichtung zum Kontaktieren einer Halbleiteranordnung mittels Thermokompression |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3310216A (2) |
| CH (1) | CH427040A (2) |
| DE (1) | DE1225770B (2) |
| FR (1) | FR1378508A (2) |
| GB (1) | GB995988A (2) |
| NL (2) | NL142527B (2) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3531852A (en) * | 1968-01-15 | 1970-10-06 | North American Rockwell | Method of forming face-bonding projections |
| US3477630A (en) * | 1968-04-26 | 1969-11-11 | Western Electric Co | Apparatus for assembling articles |
| US3601890A (en) * | 1969-11-04 | 1971-08-31 | Federal Tool Eng Co | Method of and apparatus for fabricating contacts and assembling them in groups with connector blocks |
| US3840978A (en) * | 1969-11-12 | 1974-10-15 | Ibm | Method for positioning and bonding |
| US3628717A (en) * | 1969-11-12 | 1971-12-21 | Ibm | Apparatus for positioning and bonding |
| DE2114496C3 (de) * | 1971-03-25 | 1981-05-07 | Texas Instruments Deutschland Gmbh, 8050 Freising | Maschine zum Befestigen von Verbindungsdrähten an mehreren Anschlußstellen eines Halbleiterbauelements und an den zugehörigen Anschlußstellen eines das Halbleiterbauelement aufnehmenden Gehäuses |
| JPH0340439A (ja) * | 1989-07-07 | 1991-02-21 | Mitsubishi Electric Corp | 半導体装置の組立装置 |
| DE3602596A1 (de) * | 1986-01-29 | 1987-07-30 | Telefunken Electronic Gmbh | Zentriervorrichtung zur automatischen bearbeitung von komponenten elektronischer bauelemente |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE571509A (2) * | 1957-09-26 | 1900-01-01 | ||
| US3149510A (en) * | 1960-07-05 | 1964-09-22 | Kulicke & Soffa Mfg Co | Fine wire manipulator and bonding instrument for transistors |
-
0
- NL NL301740D patent/NL301740A/xx unknown
-
1963
- 1963-01-02 DE DES83130A patent/DE1225770B/de active Pending
- 1963-12-12 NL NL301740A patent/NL142527B/xx unknown
- 1963-12-20 GB GB5031963A patent/GB995988A/en not_active Expired
- 1963-12-20 FR FR957950A patent/FR1378508A/fr not_active Expired
- 1963-12-24 CH CH1590663A patent/CH427040A/de unknown
-
1964
- 1964-01-02 US US33532364 patent/US3310216A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| GB995988A (en) | 1965-06-23 |
| US3310216A (en) | 1967-03-21 |
| DE1225770B (de) | 1966-09-29 |
| NL301740A (2) | 1900-01-01 |
| NL142527B (nl) | 1974-06-17 |
| FR1378508A (fr) | 1964-11-13 |
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