CH435399A - Outil pour fixer un fil conducteur d'électricité à la surface d'un semi-conducteur - Google Patents

Outil pour fixer un fil conducteur d'électricité à la surface d'un semi-conducteur

Info

Publication number
CH435399A
CH435399A CH430865A CH430865A CH435399A CH 435399 A CH435399 A CH 435399A CH 430865 A CH430865 A CH 430865A CH 430865 A CH430865 A CH 430865A CH 435399 A CH435399 A CH 435399A
Authority
CH
Switzerland
Prior art keywords
attaching
semiconductor
tool
electrically conductive
conductive wire
Prior art date
Application number
CH430865A
Other languages
English (en)
Inventor
Louis Christensen Frank
Original Assignee
Tempress Research Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tempress Research Co filed Critical Tempress Research Co
Publication of CH435399A publication Critical patent/CH435399A/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49945—Assembling or joining by driven force fit

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
CH430865A 1964-03-31 1965-03-29 Outil pour fixer un fil conducteur d'électricité à la surface d'un semi-conducteur CH435399A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35628264 US3358897A (en) 1964-03-31 1964-03-31 Electric lead wire bonding tools

Publications (1)

Publication Number Publication Date
CH435399A true CH435399A (fr) 1967-05-15

Family

ID=23400842

Family Applications (1)

Application Number Title Priority Date Filing Date
CH430865A CH435399A (fr) 1964-03-31 1965-03-29 Outil pour fixer un fil conducteur d'électricité à la surface d'un semi-conducteur

Country Status (4)

Country Link
US (1) US3358897A (fr)
CH (1) CH435399A (fr)
DE (1) DE1590639B1 (fr)
GB (1) GB1056362A (fr)

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US3812581A (en) * 1969-11-24 1974-05-28 Wells Electronics Method for forming electrical joints between intermediate parts of an elongated conductor and selected conductive elements on an electrical assembly
US3650450A (en) * 1969-11-24 1972-03-21 Wells Electronics Means for forming electrical joints between intermediate parts of an elongated conductor and selected conductive element on an electrical assembly
US3891822A (en) * 1971-04-20 1975-06-24 Unitek Corp Pulse heated thermocompression bonding apparatus
US3917148A (en) * 1973-10-19 1975-11-04 Technical Devices Inc Welding tip
US4315128A (en) * 1978-04-07 1982-02-09 Kulicke And Soffa Industries Inc. Electrically heated bonding tool for the manufacture of semiconductor devices
NL184184C (nl) * 1981-03-20 1989-05-01 Philips Nv Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.
US4481467A (en) * 1981-07-30 1984-11-06 At&T Technologies, Inc. Break-away test probe
US4405074A (en) * 1981-08-31 1983-09-20 Kulicke And Soffa Industries Inc. Composite bonding tool and method of making same
US4513190A (en) * 1983-01-03 1985-04-23 Small Precision Tools, Inc. Protection of semiconductor wire bonding capillary from spark erosion
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US4560101A (en) * 1983-06-16 1985-12-24 Cooper Industries, Inc. Self-locking, removeable tapered tips for soldering and de-soldering tools
US4691854A (en) * 1984-12-21 1987-09-08 Texas Instruments Incorporated Coatings for ceramic bonding capillaries
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
US4974767A (en) * 1988-04-25 1990-12-04 Texas Instruments Incorporated Double cone wire bonding capillary
US5065932A (en) * 1990-09-24 1991-11-19 International Business Machines Corporation Solder placement nozzle with inert cover gas and inert gas bleed
US5042708A (en) * 1990-09-24 1991-08-27 International Business Machines Corporation Solder placement nozzle assembly
US5142117A (en) * 1990-11-20 1992-08-25 Motorola, Inc. Proximity heater for an ultrasonic bonding tool
US5746368A (en) * 1996-05-15 1998-05-05 Ford Motor Company Molten solder dispensing system
US8237091B2 (en) 2002-11-26 2012-08-07 Hakko Corporation Soldering iron with replaceable tip
US20050011876A1 (en) * 2002-11-26 2005-01-20 Takashi Uetani Soldering iron with replaceable tip cap
US7030339B2 (en) * 2002-11-26 2006-04-18 Hakko Corporation Soldering iron tip with metal particle sintered member connected to heat conducting core
CN1575900A (zh) 2003-07-04 2005-02-09 白光株式会社 焊料加热工具
WO2006052616A1 (fr) * 2004-11-03 2006-05-18 Tessera, Inc. Ameliorations apportees a des emballages empiles
US7608805B2 (en) 2005-01-14 2009-10-27 Hakko Corporation Control system for battery powered heating device
US8058101B2 (en) * 2005-12-23 2011-11-15 Tessera, Inc. Microelectronic packages and methods therefor
USD657242S1 (en) 2010-01-14 2012-04-10 S.C. Johnson & Son, Inc. Container with nozzle
US9159708B2 (en) 2010-07-19 2015-10-13 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
KR101075241B1 (ko) 2010-11-15 2011-11-01 테세라, 인코포레이티드 유전체 부재에 단자를 구비하는 마이크로전자 패키지
US20120146206A1 (en) 2010-12-13 2012-06-14 Tessera Research Llc Pin attachment
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
US8618659B2 (en) 2011-05-03 2013-12-31 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9105483B2 (en) 2011-10-17 2015-08-11 Invensas Corporation Package-on-package assembly with wire bond vias
US8561879B2 (en) * 2012-01-09 2013-10-22 Apple Inc. Hotbar device and methods for assembling electrical contacts to ensure co-planarity
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US8372741B1 (en) * 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US8975738B2 (en) 2012-11-12 2015-03-10 Invensas Corporation Structure for microelectronic packaging with terminals on dielectric mass
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9136254B2 (en) 2013-02-01 2015-09-15 Invensas Corporation Microelectronic package having wire bond vias and stiffening layer
US9034696B2 (en) 2013-07-15 2015-05-19 Invensas Corporation Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
US8883563B1 (en) 2013-07-15 2014-11-11 Invensas Corporation Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
US9023691B2 (en) 2013-07-15 2015-05-05 Invensas Corporation Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US9082753B2 (en) 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US9087815B2 (en) 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9263394B2 (en) 2013-11-22 2016-02-16 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9214454B2 (en) 2014-03-31 2015-12-15 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9530749B2 (en) 2015-04-28 2016-12-27 Invensas Corporation Coupling of side surface contacts to a circuit platform
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
CN107159530A (zh) * 2017-06-16 2017-09-15 奉化市威优特电器有限公司 一种热熔胶枪的加热装置

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US62941A (en) * 1867-03-19 Improved soldering-ibon
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BE548557A (fr) * 1955-06-13 Eckold Walter
US2985954A (en) * 1956-09-05 1961-05-30 Jones James Byron Method and apparatus employing vibratory energy for bonding metals
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Also Published As

Publication number Publication date
DE1590639B1 (de) 1971-10-14
GB1056362A (en) 1967-01-25
US3358897A (en) 1967-12-19

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