CH440462A - Verfahren zum Herstellen eines Anschlusses an einer Halbleitervorrichtung - Google Patents
Verfahren zum Herstellen eines Anschlusses an einer HalbleitervorrichtungInfo
- Publication number
- CH440462A CH440462A CH1640065A CH1640065A CH440462A CH 440462 A CH440462 A CH 440462A CH 1640065 A CH1640065 A CH 1640065A CH 1640065 A CH1640065 A CH 1640065A CH 440462 A CH440462 A CH 440462A
- Authority
- CH
- Switzerland
- Prior art keywords
- making
- connection
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US415296A US3330026A (en) | 1964-12-02 | 1964-12-02 | Semiconductor terminals and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH440462A true CH440462A (de) | 1967-07-31 |
Family
ID=23645133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1640065A CH440462A (de) | 1964-12-02 | 1965-11-29 | Verfahren zum Herstellen eines Anschlusses an einer Halbleitervorrichtung |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3330026A (de) |
| CH (1) | CH440462A (de) |
| DE (1) | DE1515597A1 (de) |
| ES (1) | ES320211A1 (de) |
| GB (1) | GB1068108A (de) |
| NL (1) | NL6515691A (de) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3403438A (en) * | 1964-12-02 | 1968-10-01 | Corning Glass Works | Process for joining transistor chip to printed circuit |
| GB1096486A (en) * | 1965-12-22 | 1967-12-29 | Tetra Pak Ab | A method of producing a thermo-couple |
| DE1564572C2 (de) * | 1966-04-21 | 1975-01-09 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum Verbinden von Kontaktkörpern mit Kontaktträgern |
| US3483611A (en) * | 1966-08-12 | 1969-12-16 | Cavitron Corp | Methods and apparatus for assembling parts together by ultrasonic energy |
| US3395844A (en) * | 1966-09-08 | 1968-08-06 | Corning Glass Works | Pillar attachment machine |
| US3477114A (en) * | 1967-05-15 | 1969-11-11 | Whittaker Corp | Method and apparatus for edge-bonding metallic sheets |
| US3531852A (en) * | 1968-01-15 | 1970-10-06 | North American Rockwell | Method of forming face-bonding projections |
| DE1803307A1 (de) * | 1968-10-16 | 1970-05-21 | Siemens Ag | Verfahren zum Herstellen einer festen Verbindung zwischen einem Kunststoff- und einem Metallkoerper |
| US3733685A (en) * | 1968-11-25 | 1973-05-22 | Gen Motors Corp | Method of making a passivated wire bonded semiconductor device |
| US3489658A (en) * | 1969-03-03 | 1970-01-13 | Avco Corp | Method of forming a window in a passivating layer of a semiconductor |
| US3698075A (en) * | 1969-11-05 | 1972-10-17 | Motorola Inc | Ultrasonic metallic sheet-frame bonding |
| US3926357A (en) * | 1973-10-09 | 1975-12-16 | Du Pont | Process for applying contacts |
| US3976240A (en) * | 1973-10-09 | 1976-08-24 | E. I. Du Pont De Nemours And Company | Apparatus for applying contacts |
| US4024613A (en) * | 1975-01-02 | 1977-05-24 | Owens-Illinois, Inc. | Method of permanently attaching metallic spacers in gaseous discharge display panels |
| DE2642323A1 (de) * | 1976-09-21 | 1978-03-23 | Rau Fa G | Kontaktkoerper und herstellungsverfahren hierzu |
| US4139140A (en) * | 1976-09-21 | 1979-02-13 | G. Rau | Method for producing an electrical contact element |
| US4179802A (en) * | 1978-03-27 | 1979-12-25 | International Business Machines Corporation | Studded chip attachment process |
| US4702003A (en) * | 1985-06-10 | 1987-10-27 | The Boc Group, Inc. | Method of fabricating a freestanding semiconductor connection |
| JPS63119552A (ja) * | 1986-11-07 | 1988-05-24 | Sharp Corp | Lsiチツプ |
| US4831724A (en) * | 1987-08-04 | 1989-05-23 | Western Digital Corporation | Apparatus and method for aligning surface mountable electronic components on printed circuit board pads |
| JP2532615B2 (ja) * | 1988-10-20 | 1996-09-11 | 松下電器産業株式会社 | バンプ形成方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3256465A (en) * | 1962-06-08 | 1966-06-14 | Signetics Corp | Semiconductor device assembly with true metallurgical bonds |
| US3235945A (en) * | 1962-10-09 | 1966-02-22 | Philco Corp | Connection of semiconductor elements to thin film circuits using foil ribbon |
-
1964
- 1964-12-02 US US415296A patent/US3330026A/en not_active Expired - Lifetime
-
1965
- 1965-11-23 GB GB49711/65A patent/GB1068108A/en not_active Expired
- 1965-11-26 DE DE19651515597 patent/DE1515597A1/de active Pending
- 1965-11-29 CH CH1640065A patent/CH440462A/de unknown
- 1965-11-30 ES ES0320211A patent/ES320211A1/es not_active Expired
- 1965-12-02 NL NL6515691A patent/NL6515691A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3330026A (en) | 1967-07-11 |
| DE1515597A1 (de) | 1969-07-31 |
| ES320211A1 (es) | 1966-09-01 |
| GB1068108A (en) | 1967-05-10 |
| NL6515691A (de) | 1966-06-03 |
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