CH448198A - Verfahren zum Herstellen von elektrisch leitenden Verbindungen zwischen Festkörperbauelementen und dem Leitungsmuster einer Schaltungsplatte - Google Patents

Verfahren zum Herstellen von elektrisch leitenden Verbindungen zwischen Festkörperbauelementen und dem Leitungsmuster einer Schaltungsplatte

Info

Publication number
CH448198A
CH448198A CH348767A CH348767A CH448198A CH 448198 A CH448198 A CH 448198A CH 348767 A CH348767 A CH 348767A CH 348767 A CH348767 A CH 348767A CH 448198 A CH448198 A CH 448198A
Authority
CH
Switzerland
Prior art keywords
solid
circuit board
electrically conductive
conductor pattern
conductive connections
Prior art date
Application number
CH348767A
Other languages
English (en)
Inventor
Augustus Chance Dudley
Anthony Perri John
Riseman Jacob
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of CH448198A publication Critical patent/CH448198A/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, electron beams [EB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/81—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CH348767A 1966-03-09 1967-03-09 Verfahren zum Herstellen von elektrisch leitenden Verbindungen zwischen Festkörperbauelementen und dem Leitungsmuster einer Schaltungsplatte CH448198A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53307366A 1966-03-09 1966-03-09

Publications (1)

Publication Number Publication Date
CH448198A true CH448198A (de) 1967-12-15

Family

ID=24124356

Family Applications (1)

Application Number Title Priority Date Filing Date
CH348767A CH448198A (de) 1966-03-09 1967-03-09 Verfahren zum Herstellen von elektrisch leitenden Verbindungen zwischen Festkörperbauelementen und dem Leitungsmuster einer Schaltungsplatte

Country Status (7)

Country Link
US (1) US3614832A (de)
CH (1) CH448198A (de)
DE (1) DE1591186B1 (de)
FR (1) FR1521440A (de)
GB (1) GB1162184A (de)
NL (1) NL149674B (de)
SE (1) SE345343B (de)

Families Citing this family (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2057126C3 (de) * 1970-05-14 1975-11-06 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen
DE2151765C2 (de) * 1970-11-05 1983-06-16 Honeywell Information Systems Italia S.p.A., Caluso, Torino Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen
FR2150214A1 (de) * 1971-08-20 1973-04-06 Thomson Csf
NL159818B (nl) * 1972-04-06 1979-03-15 Philips Nv Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.
JPS49131863U (de) * 1973-03-10 1974-11-13
JPS5429239B2 (de) * 1974-12-04 1979-09-21
US4062107A (en) * 1976-07-14 1977-12-13 U.S. Philips Corporation Method of manufacturing infra-red detector
CH645208A5 (de) * 1978-10-31 1984-09-14 Bbc Brown Boveri & Cie Verfahren zur herstellung von elektrischen kontakten an halbleiterbauelementen.
EP0015100B1 (de) * 1979-02-26 1983-08-17 National Research Development Corporation Verfahren zum Einbetten von verteilten Mikrowellen- Schaltungselementen in eine integrierte Mikrowellenschaltung
US4251852A (en) * 1979-06-18 1981-02-17 International Business Machines Corporation Integrated circuit package
DE3005662C2 (de) * 1980-02-15 1983-10-27 G. Rau GmbH & Co, 7530 Pforzheim Verfahren zur Herstellung eines Kontaktelementes
US4544989A (en) * 1980-06-30 1985-10-01 Sharp Kabushiki Kaisha Thin assembly for wiring substrate
US4508402A (en) * 1981-02-27 1985-04-02 Sharp Kabushiki Kaisha Integrated circuit package and display panel
US4404453A (en) * 1981-09-10 1983-09-13 Asta, Ltd. Laser bonding of microelectronic circuits
US4635354A (en) * 1982-07-22 1987-01-13 Texas Instruments Incorporated Low cost electronic apparatus construction method
EP0117348B1 (de) * 1982-12-06 1987-03-11 The Welding Institute Verfahren zum Anschweissen von Drähten an Halbleiterbauelemente
DE3247338A1 (de) * 1982-12-21 1984-06-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum laserloeten von flexiblen verdrahtungen
GB2143759B (en) * 1983-01-24 1986-12-10 Ford Motor Co Method of laser soldering
US4531044A (en) * 1983-01-24 1985-07-23 Ford Motor Company Method of laser soldering
US4527330A (en) * 1983-08-08 1985-07-09 Motorola, Inc. Method for coupling an electronic device into an electrical circuit
KR900001273B1 (ko) * 1983-12-23 1990-03-05 후지쑤 가부시끼가이샤 반도체 집적회로 장치
US5049434A (en) * 1984-04-30 1991-09-17 National Starch And Chemical Investment Holding Corporation Pre-patterned device substrate device-attach adhesive transfer system
US4631820A (en) * 1984-08-23 1986-12-30 Canon Kabushiki Kaisha Mounting assembly and mounting method for an electronic component
US4645114A (en) * 1985-06-17 1987-02-24 Northern Telecom Limited Shaped solder pad for surface mounting electronic devices and a surface mounting position incorporating such shaped pads
DE3534502A1 (de) * 1985-09-27 1987-04-09 Licentia Gmbh Verfahren zum herstellen einer klebekontaktierung
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPS62169434A (ja) * 1986-01-22 1987-07-25 Sharp Corp Ｌｓｉ搭載方式
US4780795A (en) * 1986-04-28 1988-10-25 Burr-Brown Corporation Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture
GB8620057D0 (en) * 1986-08-18 1986-10-01 Philips Nv Cathode ray tube display device
US4937203A (en) * 1986-09-26 1990-06-26 General Electric Company Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer
US4884122A (en) * 1988-08-05 1989-11-28 General Electric Company Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer
US4945399A (en) * 1986-09-30 1990-07-31 International Business Machines Corporation Electronic package with integrated distributed decoupling capacitors
US4704304A (en) * 1986-10-27 1987-11-03 International Business Machines Corporation Method for repair of opens in thin film lines on a substrate
US4744008A (en) * 1986-11-18 1988-05-10 International Business Machines Corporation Flexible film chip carrier with decoupling capacitors
DE3641353A1 (de) * 1986-12-03 1988-06-09 Schoeller & Co Elektrotech Einrichtung zur kontaktierung von anschluessen
US4855867A (en) * 1987-02-02 1989-08-08 International Business Machines Corporation Full panel electronic packaging structure
US4766670A (en) * 1987-02-02 1988-08-30 International Business Machines Corporation Full panel electronic packaging structure and method of making same
US4755866A (en) * 1987-02-27 1988-07-05 United Technologies Corporation Electronic circuit module
FR2625067A1 (fr) * 1987-12-22 1989-06-23 Sgs Thomson Microelectronics Procede pour fixer sur un support un composant electronique et ses contacts
US4892245A (en) * 1988-11-21 1990-01-09 Honeywell Inc. Controlled compression furnace bonding
USRE35578E (en) * 1988-12-12 1997-08-12 Sgs-Thomson Microelectronics, Inc. Method to install an electronic component and its electrical connections on a support, and product obtained thereby
USRE35385E (en) * 1988-12-12 1996-12-03 Sgs-Thomson Microelectronics, Sa. Method for fixing an electronic component and its contacts to a support
US5285107A (en) * 1989-04-20 1994-02-08 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
JPH02306690A (ja) * 1989-05-22 1990-12-20 Toshiba Corp 表面実装用配線基板の製造方法
JP3280394B2 (ja) * 1990-04-05 2002-05-13 ロックヒード マーティン コーポレーション 電子装置
US5170029A (en) * 1990-04-19 1992-12-08 Matsushita Electric Works, Ltd. Energy-beam welding method
GB2244374B (en) * 1990-05-22 1994-10-05 Stc Plc Improvements in hybrid circuits
US5241456A (en) * 1990-07-02 1993-08-31 General Electric Company Compact high density interconnect structure
IT1242420B (it) * 1990-09-03 1994-03-04 Ri Co Srl Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili.
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5258330A (en) * 1990-09-24 1993-11-02 Tessera, Inc. Semiconductor chip assemblies with fan-in leads
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5679977A (en) * 1990-09-24 1997-10-21 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5227604A (en) * 1991-06-28 1993-07-13 Digital Equipment Corporation Atmospheric pressure gaseous-flux-assisted laser reflow soldering
JP2839795B2 (ja) * 1991-08-09 1998-12-16 シャープ株式会社 半導体装置
JP2702839B2 (ja) * 1991-11-20 1998-01-26 シャープ株式会社 配線基板の電極構造
EP0547807A3 (en) * 1991-12-16 1993-09-22 General Electric Company Packaged electronic system
US5240166A (en) * 1992-05-15 1993-08-31 International Business Machines Corporation Device for thermally enhanced ultrasonic bonding with localized heat pulses
US5604831A (en) * 1992-11-16 1997-02-18 International Business Machines Corporation Optical module with fluxless laser reflow soldered joints
US5289632A (en) * 1992-11-25 1994-03-01 International Business Machines Corporation Applying conductive lines to integrated circuits
US5444600A (en) * 1992-12-03 1995-08-22 Linear Technology Corporation Lead frame capacitor and capacitively-coupled isolator circuit using the same
US5457878A (en) * 1993-10-12 1995-10-17 Lsi Logic Corporation Method for mounting integrated circuit chips on a mini-board
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US6359335B1 (en) 1994-05-19 2002-03-19 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US5834339A (en) 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
US6232152B1 (en) 1994-05-19 2001-05-15 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
US5904868A (en) * 1994-06-16 1999-05-18 International Business Machines Corporation Mounting and/or removing of components using optical fiber tools
US5567648A (en) * 1994-08-29 1996-10-22 Motorola, Inc. Process for providing interconnect bumps on a bonding pad by application of a sheet of conductive discs
US5915170A (en) * 1994-09-20 1999-06-22 Tessera, Inc. Multiple part compliant interface for packaging of a semiconductor chip and method therefor
US5929517A (en) * 1994-12-29 1999-07-27 Tessera, Inc. Compliant integrated circuit package and method of fabricating the same
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US6030856A (en) 1996-06-10 2000-02-29 Tessera, Inc. Bondable compliant pads for packaging of a semiconductor chip and method therefor
KR0185570B1 (ko) * 1996-07-15 1999-03-20 김광호 칩 스케일 패키지의 제조 방법
US6075711A (en) * 1996-10-21 2000-06-13 Alpine Microsystems, Inc. System and method for routing connections of integrated circuits
US5937276A (en) 1996-12-13 1999-08-10 Tessera, Inc. Bonding lead structure with enhanced encapsulation
US6686015B2 (en) 1996-12-13 2004-02-03 Tessera, Inc. Transferable resilient element for packaging of a semiconductor chip and method therefor
US5877555A (en) * 1996-12-20 1999-03-02 Ericsson, Inc. Direct contact die attach
US6294407B1 (en) 1998-05-06 2001-09-25 Virtual Integration, Inc. Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same
US6510606B2 (en) 1998-06-15 2003-01-28 Lockheed Martin Corporation Multichip module
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
SE517944C2 (sv) * 2000-04-06 2002-08-06 Ericsson Telefon Ab L M Förfarande och styrelement för fastsättning av ett mönsterkort på ett element
SE518778C2 (sv) * 2000-04-19 2002-11-19 Ericsson Telefon Ab L M Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort
US7335995B2 (en) 2001-10-09 2008-02-26 Tessera, Inc. Microelectronic assembly having array including passive elements and interconnects
AU2002337834A1 (en) * 2001-10-09 2003-04-22 Tessera, Inc. Stacked packages
US6977440B2 (en) 2001-10-09 2005-12-20 Tessera, Inc. Stacked packages
US20040152242A1 (en) * 2003-01-30 2004-08-05 Wong Chun Kit Device package utilizing interconnect strips to make connections between package and die
US7288472B2 (en) * 2004-12-21 2007-10-30 Intel Corporation Method and system for performing die attach using a flame
KR100651563B1 (ko) * 2005-07-07 2006-11-29 삼성전기주식회사 전자부품이 내장된 배선기판의 제조방법
EP2560466A4 (de) * 2010-04-15 2015-05-06 Furukawa Electric Co Ltd Brett und verfahren zur herstellung eines bretts
WO2015043495A1 (zh) * 2013-09-30 2015-04-02 南通富士通微电子股份有限公司 晶圆封装结构和封装方法
US9296056B2 (en) * 2014-07-08 2016-03-29 International Business Machines Corporation Device for thermal management of surface mount devices during reflow soldering
US10507541B2 (en) * 2017-02-14 2019-12-17 John Nelson Soldering jig assembly

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1156457B (de) * 1961-07-08 1963-10-31 Telefunken Patent Verfahren zur Herstellung einer integrierten Schaltungsanordnung
GB1044689A (en) * 1962-09-21 1966-10-05 Standard Telephones Cables Ltd Improvements in or relating to mountings for semi-conductor devices
DE1931563U (de) * 1965-10-29 1966-01-27 Bbc Brown Boveri & Cie Modulleiste fuer ein aufbausystem fuer integrierte schaltungen.

Also Published As

Publication number Publication date
GB1162184A (en) 1969-08-20
DE1591186B1 (de) 1971-01-14
SE345343B (de) 1972-05-23
FR1521440A (fr) 1968-04-19
NL6703605A (de) 1967-09-11
US3614832A (en) 1971-10-26
NL149674B (nl) 1976-05-17

Similar Documents

Publication Publication Date Title
CH448198A (de) Verfahren zum Herstellen von elektrisch leitenden Verbindungen zwischen Festkörperbauelementen und dem Leitungsmuster einer Schaltungsplatte
DE1933731B2 (de) Verfahren zum herstellen einer integrierten halbleiterschaltung
CH415780A (de) Verfahren zum Zusammenbau und zum elektrischen Verbinden von mit einer gedruckten Schaltung versehenen Leiterplatten
CH454985A (de) Verfahren zur Herstellung von Schaltkreisanordnungen mit elektrischen Verbindungen zwischen auf einer Substratplatte und auf einem Halbleiterbauteil befindlichen Kontakten
GB1071695A (en) Electrical connector arrangement for printed circuit boards
CH413941A (de) Verfahren zur Herstellung von leitenden Verbindungen bei elektrischen Schaltungsplatten
AT250472B (de) Verfahren zum Herstellen von elektrisch leitenden Verbindungswegen in Isolierstoffen
DE1640468B2 (de) Elektrische verbindung zwischen auf gegenueberliegenden seiten von schaltkarten verlaufenden leiterstreifen
MY6900361A (en) Methods and components for making structures comprising electrical circuits
BE833719A (fr) Embase de connecteur pour plaquette de circuits
CH482303A (de) Verfahren zum Herstellen einer integrierten elektronischen Halbleiterschaltung und nach diesem Verfahren erhaltene Halbleiterschaltung
CH489314A (de) Verfahren zum Löten elektrischer Schaltkreise
FR1390739A (fr) Connecteur pour plaques de circuits imprimés
IT990694B (it) Connettore elettrico per circuiti su cartoni
CH499883A (de) Verfahren zum Herstellen einer auf einem elektrisch isolierenden Fremdsubstrat befindlichen integrierten Halbleiterschaltung
CH485326A (de) Verfahren zum Herstellen elektrisch leitender Schichten für Halbleiterbauelemente
AT266246B (de) Verfahren zur Herstellung einer Lötverbindung zwischen zwei Leitungsbahnen einer Platte mit flächenhafter Verdrahtung
CH528148A (de) Verfahren zum Herstellen einer elektrischen Schaltungsanordnung
IT961375B (it) Metodo per produrre disposizioni di conduttori elettrici per circuiti stampati
AT294955B (de) Verfahren zur Herstellung von gedruckten Leiterplatten
AT301665B (de) Verfahren zur Herstellung elektrischer Leiterplatten
IL31484A0 (en) Method of soldering printed circuit components
AT264594B (de) Verfahren zum Herstellen von Metallkontakten auf Halbleiterbauelementen
CH535530A (de) Verfahren und Vorrichtung zum elektrisch leitenden Verbinden von Anschlussteilen einer Verbindungseinheit und nach dem Verfahren verbundene Verbindungseinheit
CH512869A (de) Verfahren zur Herstellung einer elektrischen Schaltplatte von der Art einer gedruckten Schaltung