CH455109A - Process for producing an adhesive and adhesive produced by the process - Google Patents
Process for producing an adhesive and adhesive produced by the processInfo
- Publication number
- CH455109A CH455109A CH1129565A CH1129565A CH455109A CH 455109 A CH455109 A CH 455109A CH 1129565 A CH1129565 A CH 1129565A CH 1129565 A CH1129565 A CH 1129565A CH 455109 A CH455109 A CH 455109A
- Authority
- CH
- Switzerland
- Prior art keywords
- dependent
- adhesive
- hardener
- epoxy resin
- mixture
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 22
- 239000000853 adhesive Substances 0.000 title claims description 20
- 230000001070 adhesive effect Effects 0.000 title claims description 20
- 239000003822 epoxy resin Substances 0.000 claims description 23
- 229920000647 polyepoxide Polymers 0.000 claims description 23
- 239000004848 polyfunctional curative Substances 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 16
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
- 239000002808 molecular sieve Substances 0.000 claims description 9
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 150000004658 ketimines Chemical class 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002775 capsule Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 239000000443 aerosol Substances 0.000 claims description 3
- DLYUQMMRRRQYAE-UHFFFAOYSA-N tetraphosphorus decaoxide Chemical compound O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 claims description 3
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 230000001419 dependent effect Effects 0.000 claims 10
- 229910000160 potassium phosphate Inorganic materials 0.000 claims 1
- 235000011009 potassium phosphates Nutrition 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- LCZUOKDVTBMCMX-UHFFFAOYSA-N 2,5-Dimethylpyrazine Chemical compound CC1=CN=C(C)C=N1 LCZUOKDVTBMCMX-UHFFFAOYSA-N 0.000 description 5
- 239000000395 magnesium oxide Substances 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- -1 aliphatic diamine Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- YWEUIGNSBFLMFL-UHFFFAOYSA-N diphosphonate Chemical compound O=P(=O)OP(=O)=O YWEUIGNSBFLMFL-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/54—Inorganic substances
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
Verfahren zur Herstellung eines Klebstoffes und nach dem Verfahren hergestellter Klebstoff Die Erfindung g bezieht sich auf ein Verfahren zur Herstellung eines ein Gemisch von Epoxyharz und einem Härtungsmittel enthaltenden Klebstoffes.
Es ist bekannt, dass Epoxyharze im Gemisch mit geeigneten Härtungsmitteln hervorragende Klebstoffe darstellen. Dabei können diese Härtungsmittel kurz vor der Anwendung der Mischung dem Epoxyharz beigemischt werden oder das Epoxyharz kann diese Härtungsmittel in einer in aktiven Form enthalten. Enthält das Epoxyharz inaktiven Härter, so wird bisher beim Klebevorgang der Härter durch Zufuhr von Wärme aktiviert.
Das erfindungsgemässe Verfahren ist dadurch gekennzeichnet, dass man das Epoxyharz mit einem durch Wasser aktivierbaren Härter vermischt.
Beim erfindungsgemässen Klebstoff leitet also der Härter die chemische Härtung des Epoxyharzes erst ein, wenn er durch Zutritt von Wasser aktiviert wird.
Vor der Aktivierung durch Wasser liegt im erfindungsgemässen Klebstoff der Härter in einer chemisch inaktiven Form vor, vorzugsweise als Ketimin oder als substituiertes Ketimin oder in einer anderen geeigneten, durch Wasser aktivierbaren Form. Bei den Ketiminen wird - durch Zutritt von Wasser die Hydrolyse eingeleitet, wobei je nach Ausgangsprodukt ein zur Härtung der Epoxyharze geeignetes Amin entsteht.
Man kann in einer weiteren Ausführungsart des erfindungsgemässen Verfahrens den Härter dem Epoxyharz in seiner inaktiven Form dadurch beigeben, dass man den Härter an feinporigen Trägerstoffen, wie z. B. Molekularsieben absorbiert.
Bei der Verwendung des erfindungsgemässen Klebstoffes kann das für die Härtung der Klebstoffmischung, also für die Aktivierung des Härters notwendige Wasser z. B. aus der natürlichen Luftfeuchtigkeit oder aus dem zu verklebenden Material selbst stammen, z, B. aus dem Beton oder bei Verklebung von hölzernen Werkstücken aus dem Holz, oder es kann insbesondere bei nichtporösen Werkstoffen, wie z. B. bei Metallen, vor der Verklebung in dünner Schicht auf die zu klebende Fläche aufgetragen oder dem Klebstoff selbst zugemischt werden.
Zur schnelleren Wasseraufnahme kann man ausser dem Epoxyharz und dem Härter eine hygroskopische Substanz, wie z. B. dehydratisiertes Kaliumphosphat, Phosphorpentoxyd usw. beigeben.
Im Folgenden werden einige Beispiele für durch das Verfahren hergestellte, noch inaktive Mischungen angeführt: Beispiel 1
40 g Epoxyharz vom Bisphenol-A-Typ
22 g Ketiminderivat
1,24 g Molekularsieb Typ 4 A Beispiel 2
40 g Epoxyharz vom Bisphenol-A-Typ
22 g Ketiminhärter
1,24 g Molekularsieb Typ 4 A
1,24 g geglühtes Magnesiumoxyd Beispiel 3
40 g Epoxyharz Bisphenol-A-Typ (Molekulargewicht ca.
400) Rein oder im Gemisch mit anderen Epoxyharzen
22 g Ketiminhärter
1,24 g Molekularsieb Typ 4 A
1,24 g Aerosil
1,24 g geglühtes Magnesiumoxyd Beispiel 4
40 g Epoxyharz vom Bisphenol-A-Typ
22 g Ketiminhärter
1,24 g Molekularsieb Typ 4 A
1,24 g Aerosil
1,24 g Aluminium-Bronce
1,24 g geglühtes Magnesiumoxyd Beispiel 5
40 g Epoxyharz Bisphenol-A-Typ
23 g Ketiminhärter
1,24 g Molekularsieb Typ 4 A
3,1 g Bentone 27
1,24 g Magnesiumoxyd
Den Mischungen obiger Beispiele kann für den Auftrag im Spritzverfahren oder für die Abpackung in Aerosolpackungen bis zu 50 und mehr O/o eines geeigneten Lösungsmittels, z. B. Methyläthylketon, zugesetzt werden.
Das Verfahren zur Herstellung der obigen, beispielsweisen Klebstoffmischungen wird z. B. wie folgt ausgeführt:
Zuerst wird das Epoxyharz oder das Epoxyharzgemisch zusammen mit den gut vorgetrockneten Füllstoffen auf einem Dreiwalzenstuhl in Stickstoffatmosphäre abgerieben. Diesem Gemisch wird nachträglich das Molekularsieb in einer Aufschlemmung in einem neutralen Lösungsmittel zugegeben, und anschliessend wird das Ganze wieder zweimal unter Stickstoffatmosphäre über einen Dreiwalzenstuhl gegeben. Zuletzt wird der Ketiminhärter zugesetzt und in die Mischung eingebracht und anschliessend die fabrizierte Mischung unter Fernhaltung von Feuchtigkeit, also in inaktivem Zustand in Tuben oder andere Behälter abgepackt.
Zur Lagerung der Klebstoffmischung in inaktivem Zustande sind ausser Tuben insbesondere Kapseln, Aerosoldosen und andere derartige Packungen geeignet. Zur Erhöhung der Lagerstabilität können der Mischung neben Epoxyharz, Härter, hygroskopischer Substanz und Molekularsieb auch noch andere Trokkenstoffe und Füllstoffe, z. B. Silicagel, zugegeben werden.
Als Ketiminhärter können z. B. folgende zwei Verbindungen verwendet werden: 1. 1,4 Di (methyläthyl-ketimino) butan
EMI2.1
2. 1,4 Di (methyläthyl-ketimino) hexan
EMI2.2
An der Stelle der aliphatischen Diaminderivate können auch aromatische Di- oder Polyaminderivate treten.
Process for producing an adhesive and an adhesive produced by the process The invention relates to a process for producing an adhesive containing a mixture of epoxy resin and a curing agent.
It is known that epoxy resins, mixed with suitable curing agents, are excellent adhesives. These hardening agents can be added to the epoxy resin shortly before the mixture is used, or the epoxy resin can contain these hardening agents in an active form. If the epoxy resin contains inactive hardeners, the hardener has been activated by supplying heat during the gluing process.
The process according to the invention is characterized in that the epoxy resin is mixed with a hardener which can be activated by water.
In the adhesive according to the invention, the hardener only initiates the chemical hardening of the epoxy resin when it is activated by the ingress of water.
Before activation by water, the hardener in the adhesive according to the invention is in a chemically inactive form, preferably as ketimine or as substituted ketimine or in another suitable form which can be activated by water. In the case of ketimines, hydrolysis is initiated by the ingress of water, with an amine suitable for curing the epoxy resins being formed, depending on the starting product.
In a further embodiment of the method according to the invention, the hardener can be added to the epoxy resin in its inactive form by adding the hardener to fine-pored carriers, such as. B. absorbed molecular sieves.
When using the adhesive according to the invention, the water necessary for hardening the adhesive mixture, ie for activating the hardener, can e.g. B. from the natural humidity or from the material to be glued itself, for example from the concrete or when gluing wooden workpieces from the wood, or it can be especially with non-porous materials such. B. with metals, applied in a thin layer to the surface to be bonded before bonding or mixed with the adhesive itself.
In addition to the epoxy resin and the hardener, a hygroscopic substance such as B. dehydrated potassium phosphate, phosphorus pentoxide, etc. add.
In the following some examples of still inactive mixtures produced by the process are given: Example 1
40 g of bisphenol A type epoxy resin
22 g of ketimine derivative
1.24 g molecular sieve type 4 A Example 2
40 g of bisphenol A type epoxy resin
22 g of ketine hardener
1.24 g Type 4 A molecular sieve
1.24 g of calcined magnesium oxide Example 3
40 g epoxy resin bisphenol A type (molecular weight approx.
400) Pure or mixed with other epoxy resins
22 g of ketine hardener
1.24 g Type 4 A molecular sieve
1.24 g Aerosil
1.24 g of calcined magnesium oxide Example 4
40 g of bisphenol A type epoxy resin
22 g of ketine hardener
1.24 g Type 4 A molecular sieve
1.24 g Aerosil
1.24 g aluminum bronze
1.24 g of calcined magnesium oxide Example 5
40 g bisphenol A type epoxy resin
23 g of ketine hardener
1.24 g Type 4 A molecular sieve
3.1 g Bentone 27
1.24 g of magnesium oxide
The mixtures of the above examples can contain up to 50 and more O / o of a suitable solvent, for example for spray application or for packaging in aerosol packs. B. methyl ethyl ketone are added.
The process for the preparation of the above, for example adhesive mixtures is e.g. B. carried out as follows:
First, the epoxy resin or the epoxy resin mixture is rubbed off together with the well-predried fillers on a three-roll mill in a nitrogen atmosphere. The molecular sieve is subsequently added to this mixture in a slurry in a neutral solvent, and the whole is then passed twice over a three-roll mill under a nitrogen atmosphere. Finally, the ketimine hardener is added and introduced into the mixture, and then the fabricated mixture is packed in tubes or other containers while keeping moisture away, i.e. in an inactive state.
In addition to tubes, capsules, aerosol cans and other such packs are particularly suitable for storing the adhesive mixture in the inactive state. To increase the storage stability of the mixture, in addition to epoxy resin, hardener, hygroscopic substance and molecular sieve, other dry substances and fillers, e.g. B. silica gel, are added.
As a ketine hardener z. B. the following two compounds are used: 1. 1,4 di (methylethyl-ketimino) butane
EMI2.1
2. 1,4 di (methylethyl-ketimino) hexane
EMI2.2
The aliphatic diamine derivatives can also be replaced by aromatic di- or polyamine derivatives.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH1129565A CH455109A (en) | 1965-08-11 | 1965-08-11 | Process for producing an adhesive and adhesive produced by the process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH1129565A CH455109A (en) | 1965-08-11 | 1965-08-11 | Process for producing an adhesive and adhesive produced by the process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH455109A true CH455109A (en) | 1968-04-30 |
Family
ID=4372069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1129565A CH455109A (en) | 1965-08-11 | 1965-08-11 | Process for producing an adhesive and adhesive produced by the process |
Country Status (1)
| Country | Link |
|---|---|
| CH (1) | CH455109A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0234047A3 (en) * | 1986-01-29 | 1988-11-09 | Sika AG, vorm. Kaspar Winkler & Co. | Composition curable by the influence of humidity |
| EP0421390A3 (en) * | 1989-10-06 | 1992-05-27 | Somar Corporation | Hardening agent composition, method of preparing the same and thermosetting epoxy resin composition |
-
1965
- 1965-08-11 CH CH1129565A patent/CH455109A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0234047A3 (en) * | 1986-01-29 | 1988-11-09 | Sika AG, vorm. Kaspar Winkler & Co. | Composition curable by the influence of humidity |
| EP0421390A3 (en) * | 1989-10-06 | 1992-05-27 | Somar Corporation | Hardening agent composition, method of preparing the same and thermosetting epoxy resin composition |
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